公开(公告)号：US5229328A

公开(公告)日：1993-07-20

申请号：US908429

申请日：1992-06-30

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084 ,  Y10T29/49121

摘要： A method for bonding conductors to semiconductor chip contact pads wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

摘要翻译： 一种用于将导体接合到半导体芯片接触焊盘的方法，其中每个导体安装在电介质带上，并且具有由带支撑到相邻位置的附接部分，距离接合位置具有均匀的距离，并且与平面接触 的磁带下面。 一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。 另一个支撑带在接触位置处具有窗口。 导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

公开(公告)号：US5322204A

公开(公告)日：1994-06-21

申请号：US79508

申请日：1993-06-21

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/50 ,  H05K3/40 ,  B23K1/20 ,  H01K8/00

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084 ,  Y10T29/49142 ,  Y10T29/49153 ,  Y10T29/53235

摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

摘要翻译： 一种导体附件，其中每个导体安装在介质带上，并且具有由带支撑到邻近位置的附接部分，距离接合位置具有均匀的距离，并且与带的下侧平面接触。 一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。 另一个支撑带在接触位置处具有窗口。 导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

公开(公告)号：US5233221A

公开(公告)日：1993-08-03

申请号：US736090

申请日：1991-07-26

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084

摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

摘要翻译： 一种导体附件，其中每个导体安装在介质带上，并且具有由带支撑到邻近位置的附接部分，距离接合位置具有均匀的距离，并且与带的下侧平面接触。 一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。 另一个支撑带在接触位置处具有窗口。 导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

公开(公告)号：US5117275A

公开(公告)日：1992-05-26

申请号：US602837

申请日：1990-10-24

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/50 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084 ,  Y10T29/49142 ,  Y10T29/49153 ,  Y10T29/53235

摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

公开(公告)号：US5006925A

公开(公告)日：1991-04-09

申请号：US440180

申请日：1989-11-22

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Ismail C. Noyan ,  Michael J. Palmer

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Ismail C. Noyan ,  Michael J. Palmer

IPC分类号： H05K7/20 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L23/5385 ,  H01L25/0652 ,  H01L2924/0002

摘要： A three dimensional chip package comprising a plurality of semiconductor substrates, each having at least one semiconductor electronic device mounted thereon; wherein at least a subset of said plurality substrates are physically joined to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and further wherein at least one cooling channel is provided within said enclosure into which a cooling fluid may be introduced.

公开(公告)号：US5093890A

公开(公告)日：1992-03-03

申请号：US618768

申请日：1990-11-27

申请人： Mark F. Bregman ,  Ismail C. Noyan ,  Mark B. Ritter ,  Harold S. Stone

发明人： Mark F. Bregman ,  Ismail C. Noyan ,  Mark B. Ritter ,  Harold S. Stone

IPC分类号： G02B6/24 ,  G02B6/28 ,  G02B6/42 ,  G02B6/43 ,  G06E3/00 ,  H01L27/15 ,  H04B10/213

CPC分类号： G02B6/43 ,  G02B6/2817

摘要： An optical bus for interconnecting electronic devices. The bus has a substrate with through-holes therein. An optically conductive material is disposed on one side of the substrate. The material fills the through-holes and forms a layer of predetermined thickness on this side of the substrate. In the outer surface of this layer there are facets or angled regions. The surface and facets are optically reflective. Cards or modules are optically connected by means of optical connectors to the through-holes on the opposite side of the substrate. Light emitted by the connector travels to the associated faceted surface from which it reflects towards other faceted surfaces from which it is partially transmitted and partially reflected to another connector. The arrangement permits optical communication between a plurality of electronic devices.

公开(公告)号：US5093879A

公开(公告)日：1992-03-03

申请号：US542275

申请日：1990-06-22

申请人： Mark F. Bregman ,  William D. Brewer ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Ismail C. Noyan ,  Modest M. Oprysko ,  Mark B. Ritter ,  Dennis L. Rogers ,  Jeanine M. Trewhella

发明人： Mark F. Bregman ,  William D. Brewer ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Ismail C. Noyan ,  Modest M. Oprysko ,  Mark B. Ritter ,  Dennis L. Rogers ,  Jeanine M. Trewhella

IPC分类号： G02B6/42 ,  G02B6/43 ,  H01L31/12 ,  H01L31/167 ,  H04B10/00

CPC分类号： G02B6/4249 ,  G02B6/43 ,  H01L31/167 ,  H04B10/803

摘要： A direct optical connector (DOC) comprised of first and second members, each including a plurality of light emitting and light detecting locations, operative in combination with energy transfer media to form direct optical connections between the light emitting locations and the light detecting locations, wherein said first and second members are adapted for reclosable connection to each other whereupon the light emitting locations on one member are aligned with the light detecting locations on the other member. The first and second members of the preferred DOC are modular. Alternative forms of energy transfer media are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc., thereby permitting the fabrication and/or use of a connector most suited to meet the requirements of a particular application.A modular half of a DOC can be used in conjunction with a remote optical connector (ROC) to channel light over relatively long distances. The invention also encompasses processes for fabricating ROCs.

公开(公告)号：US4862322A

公开(公告)日：1989-08-29

申请号：US188805

申请日：1988-05-02

申请人： Harry R. Bickford ,  Mark F. Bregman ,  Paul A. Moskowitz ,  Michael J. Palmer ,  Timothy C. Reiley ,  Paige A. Poore ,  Caroline A. Kovac

发明人： Harry R. Bickford ,  Mark F. Bregman ,  Paul A. Moskowitz ,  Michael J. Palmer ,  Timothy C. Reiley ,  Paige A. Poore ,  Caroline A. Kovac

IPC分类号： H01L25/18 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07

CPC分类号： H01L25/0657 ,  H01L23/49575 ,  H01L25/0652 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/06513 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107

摘要： An integrated circuit device package in which integrated circuit devices are mounted with active faces placed facing each other to form a double-device structure. Input/output terminals on the active faces of each device can be electrically interconnected by placing an interconnection means between the chips to electrically interconnect input/output terminals on the active faces of the first and second device. Beam leads, each having an inner and outer lead bond site, project outwardly from between the devices where each of the inner lead bond site is solderlessly bonded between conducting patterns on each device bonded. A series of double-device structures can be formed on a tape having a plurality of sets of beam lead patterns thereon. Each beam lead of each set having an inner and outer lead bond site, projects outwardly from between the double-device structure, the inner lead bond site being solderlessly bonded between conducting patterns on each device.

公开(公告)号：US06332127B1

公开(公告)日：2001-12-18

申请号：US09238474

申请日：1999-01-28

申请人： Daniel Quinto Bandera ,  Mark F. Bregman ,  Ajei S. Gopal ,  Sandeep Singhal

发明人： Daniel Quinto Bandera ,  Mark F. Bregman ,  Ajei S. Gopal ,  Sandeep Singhal

IPC分类号： G06F1760

CPC分类号： G06Q30/02 ,  G06Q30/0257 ,  G06Q30/0267 ,  G06Q30/0277

摘要： Systems, methods and computer program products are provided for selecting an advertising object to be displayed within a Web page requested by a user based on the geographic location of the user and/or on the time of day. Systems, methods and computer program products are provided for validating an offer within an advertising object of a Web page displayed within a Web client in communication with a Web server. Systems, methods and computer program products are also provided for changing content within an object displayed within a Web page based on changes in geographic location of a user. In addition, systems, methods and computer program products are provided for redeeming an electronic coupon stored within a first computing device, wherein the electronic coupon is valid within a designated geographic region and for a designated period of time.

摘要翻译： 提供了系统，方法和计算机程序产品，用于基于用户的地理位置和/或时间选择要在用户请求的网页内显示的广告对象。 提供了系统，方法和计算机程序产品，用于验证在与Web服务器通信的Web客户端内显示的网页的广告对象内的报价。 还提供了系统，方法和计算机程序产品，用于基于用户的地理位置的变化来改变显示在网页内的对象内的内容。 此外，提供了系统，方法和计算机程序产品以用于兑换存储在第一计算设备内的电子券，其中电子优惠券在指定的地理区域内和指定的时间段内是有效的。

公开(公告)号：US5189363A

公开(公告)日：1993-02-23

申请号：US583261

申请日：1990-09-14

申请人： Mark F. Bregman ,  Paul R. Hoffman ,  Peter G. Ledermann ,  Paul A. Moskowitz ,  Roger A. Pollak ,  Timothy C. Reiley ,  Mark B. Ritter

发明人： Mark F. Bregman ,  Paul R. Hoffman ,  Peter G. Ledermann ,  Paul A. Moskowitz ,  Roger A. Pollak ,  Timothy C. Reiley ,  Mark B. Ritter

IPC分类号： G01R31/26 ,  G01R1/073

CPC分类号： G01R1/0735

摘要： A system for testing chips uses a patterned tape having a patterned array of cantilevered contact leads. The tape serves as an interface between the chip under test and a testing unit by providing conductive leads from the I/O terminals on the chip to an off-chip measuring system. The leads on the array may have balls, tips or other shapes on the end to provide contact with the terminals and compensate for height differences. The tape is a single frame or has a series of arrays each positioned around an opening where the chip will be located when a particular pattern is positioned over that chip for test. The pattern on the tape may be the same array or a different array. The tape is indexed to a new pattern when the old one is damaged or no longer needed. Alignment with the chip is by optical sensing and physical pin movement. The tape may have a flap protruding into an aperture and deflectable to provide for planar contact of the leads to the device under test.