公开(公告)号：US5229328A

公开(公告)日：1993-07-20

申请号：US908429

申请日：1992-06-30

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084 ,  Y10T29/49121

摘要： A method for bonding conductors to semiconductor chip contact pads wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

摘要翻译： 一种用于将导体接合到半导体芯片接触焊盘的方法，其中每个导体安装在电介质带上，并且具有由带支撑到相邻位置的附接部分，距离接合位置具有均匀的距离，并且与平面接触 的磁带下面。 一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。 另一个支撑带在接触位置处具有窗口。 导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

公开(公告)号：US5322204A

公开(公告)日：1994-06-21

申请号：US79508

申请日：1993-06-21

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/50 ,  H05K3/40 ,  B23K1/20 ,  H01K8/00

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084 ,  Y10T29/49142 ,  Y10T29/49153 ,  Y10T29/53235

摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

摘要翻译： 一种导体附件，其中每个导体安装在介质带上，并且具有由带支撑到邻近位置的附接部分，距离接合位置具有均匀的距离，并且与带的下侧平面接触。 一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。 另一个支撑带在接触位置处具有窗口。 导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

公开(公告)号：US5233221A

公开(公告)日：1993-08-03

申请号：US736090

申请日：1991-07-26

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084

摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

摘要翻译： 一种导体附件，其中每个导体安装在介质带上，并且具有由带支撑到邻近位置的附接部分，距离接合位置具有均匀的距离，并且与带的下侧平面接触。 一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。 另一个支撑带在接触位置处具有窗口。 导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

公开(公告)号：US5117275A

公开(公告)日：1992-05-26

申请号：US602837

申请日：1990-10-24

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/50 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084 ,  Y10T29/49142 ,  Y10T29/49153 ,  Y10T29/53235

摘要： A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

公开(公告)号：US5360946A

公开(公告)日：1994-11-01

申请号：US761182

申请日：1991-09-17

申请人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

发明人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC分类号： H01L24/45 ,  H01L21/481 ,  H01L23/49572 ,  H01L23/49894 ,  H01L24/85 ,  H05K3/363 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/176 ,  H05K3/0017 ,  H05K3/3452 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

摘要翻译： 本发明涉及适用于硅载体或其它类型的芯片载体应用的改进的柔性（或TAB）产品，其中例如通过Cu热循环引起的柔性可靠性问题被显着地减少或消除。 更具体地，本发明体现了用于这种产品中的许多涂层以及制造和使用它们的各种方法。

公开(公告)号：US5546655A

公开(公告)日：1996-08-20

申请号：US329066

申请日：1994-10-25

申请人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

发明人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K3/02

CPC分类号： H01L24/45 ,  H01L21/481 ,  H01L23/49572 ,  H01L23/49894 ,  H01L24/85 ,  H05K3/363 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/176 ,  H05K3/0017 ,  H05K3/3452 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

摘要翻译： 适用于芯片载体应用的柔性或TAB产品，其中在功率和热循环期间由铜枝晶生长和引线弯曲引起的柔性可靠性问题通过将特殊涂层施加到柔性带的引导区域来减少。

公开(公告)号：US07581666B2

公开(公告)日：2009-09-01

申请号：US11905868

申请日：2007-10-05

申请人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

发明人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

IPC分类号： B23K31/12 ,  B23K20/00 ,  B23K31/00

CPC分类号： H01L24/93 ,  B23K20/004 ,  H01L2224/78901 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10S228/904

摘要： A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

摘要翻译： 提供了一种用于引线接合装置的引线接合方法。 引线接合装置至少包括第一引线接合器和第二引线接合器，用于分别在基板上的第一区域中的至少几个第一芯片和第二区域中的第二区域中的几个第二芯片。 引线键合方法包括以下步骤。 首先，获得第一区域和第二区域的初始位置坐标。 接下来，确定第一区域和第二区域之间的空间是否大于预定空间。 当第一区域和第二区域之间的空间大于预定空间时，第一引线接合器和第二引线接合器分别同时地接合第一芯片和第二芯片。

公开(公告)号：US20080035706A1

公开(公告)日：2008-02-14

申请号：US11646304

申请日：2006-12-28

申请人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

发明人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

IPC分类号： B23K20/12

CPC分类号： B23K20/005 ,  H01L2224/78 ,  H01L2924/14 ,  H01L2924/1433

摘要： A wire-bonding apparatus is used for wire-bonding at least a first chip and a second chip on a substrate at the same time. The wire-bonding apparatus includes at least a first capillary, a second capillary, a driving unit, a processing unit and a database. The driving unit is used for driving the first capillary and the second capillary. The processing unit is used for outputting a command to the driving unit to control the first capillary and the second capillary. The database is used for storing an operating parameter data. The processing unit controls the first capillary and the second capillary according to the operating parameter data.

摘要翻译： 引线接合装置用于同时将至少第一芯片和第二芯片引线接合在基板上。 引线接合装置至少包括第一毛细管，第二毛细管，驱动单元，处理单元和数据库。 驱动单元用于驱动第一毛细管和第二毛细管。 处理单元用于向驱动单元输出命令以控制第一毛细管和第二毛细管。 数据库用于存储操作参数数据。 处理单元根据操作参数数据控制第一毛细管和第二毛细管。

公开(公告)号：US20060103020A1

公开(公告)日：2006-05-18

申请号：US11163815

申请日：2005-10-31

申请人： Ho-Ming Tong ,  Shin-Hua Chao ,  Chi-Yu Wang ,  Cherry Mercado Reyes

发明人： Ho-Ming Tong ,  Shin-Hua Chao ,  Chi-Yu Wang ,  Cherry Mercado Reyes

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00014

摘要： A circuit structure of a redistribution layer (RDL) is suitable for a chip to define the circuits and the contact window required by the following bump process. The RDL is disposed on the active surface of the chip. The circuit structure of the RDL mainly includes a first titanium layer, a second titanium layer and a conductive layer. Wherein, the conductive layer is made of aluminum; the first titanium layer and the second titanium layer cover the two surfaces of the conductive layer, respectively. The connectivity between the first titanium layer or the second titanium layer and a macromolecule polymer is stronger than the connectivity between the conductive layer and the macromolecule polymer, so that the peeling or crack caused by poor connectivity between the conductive layer and the adjacent dielectric layers are significantly improved thereby.

摘要翻译： 再分配层（RDL）的电路结构适用于芯片来定义随后的凸块工艺所需的电路和接触窗口。 RDL设置在芯片的有源表面上。 RDL的电路结构主要包括第一钛层，第二钛层和导电层。 其中，导电层由铝制成; 第一钛层和第二钛层分别覆盖导电层的两个表面。 第一钛层或第二钛层与高分子聚合物之间的连接性比导电层和高分子聚合物之间的连通性更强，导致导电层和相邻电介质层之间连接性差的剥离或裂纹是 从而显着改善。

公开(公告)号：US06891360B1

公开(公告)日：2005-05-10

申请号：US09165832

申请日：1998-10-02

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Eugene John O'Sullivan ,  Da-Yuan Shih ,  Ho-Ming Tong

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Eugene John O'Sullivan ,  Da-Yuan Shih ,  Ho-Ming Tong

IPC分类号： G01R31/26 ,  G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  H01L21/66 ,  H05K3/24 ,  H05K3/32 ,  G01R31/02

CPC分类号： G01R1/06738 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/0735 ,  H05K3/244 ,  H05K3/325 ,  Y10T29/49169

摘要： A plated test probe structure for testing electrical connections to integrated circuits (IC) devices with solder bumped interconnection pads that are an integral part of the fan-out wiring on the test substrate, or other printed wiring device.

摘要翻译： 用于测试与集成电路（IC）器件的电气连接的电镀测试探针结构，其具有焊料凸起的互连焊盘，其是测试基板或其它印刷线路装置上的扇出接线的组成部分。