公开(公告)号：US07986592B2

公开(公告)日：2011-07-26

申请号：US12075419

申请日：2008-03-10

Applicant: Toshiki Hirano ,  Timothy C. Reiley ,  Barry C. Stipe

Inventor： Toshiki Hirano ,  Timothy C. Reiley ,  Barry C. Stipe

IPC: G11B11/00

CPC classification number: G11B5/314 ,  G11B2005/0021

Abstract: Components for, and assembly of, a thermally assisted recording device involve a laser mounted to a recording head slider. The output from the laser is directed into an optical waveguide, which delivers the laser light to the media to be written. Several challenges with thermally assisted recording are enabled by the use of a laser carrier, which holds and protects the small, relatively fragile laser and serves as a partial heat sink for the power generated by the laser. The laser, carrier and slider are bonded and can be interconnected as a unit to a suspension constituent to a hard disk drive (HDD) device.

Abstract translation: 热辅助记录装置的组件和组件包括安装在记录头滑块上的激光。 来自激光器的输出被引导到光波导中，该光波导将激光传送到待写入的介质。 通过使用激光载体来实现热辅助记录的几个挑战，该激光载体保持和保护小的相对脆弱的激光器并且用作由激光产生的功率的部分散热器。 激光器，载体和滑块被接合并且可以作为单元互连到悬挂构件到硬盘驱动器（HDD）设备。

公开(公告)号：US5374463A

公开(公告)日：1994-12-20

申请号：US815120

申请日：1991-10-22

Applicant: Donald S. Bethune ,  Mattanjah Sjim'on de Vries ,  Gerard Meijer ,  Vlad J. Novotny ,  Timothy C. Reiley ,  Anthony W. Wu

Inventor： Donald S. Bethune ,  Mattanjah Sjim'on de Vries ,  Gerard Meijer ,  Vlad J. Novotny ,  Timothy C. Reiley ,  Anthony W. Wu

IPC: B05D5/08 ,  B05D7/24 ,  C10M103/02 ,  F16N15/00 ,  G11B5/10 ,  G11B5/255 ,  G11B5/60 ,  G11B23/50 ,  G11B5/00

CPC classification number: B82Y30/00 ,  B05D1/62 ,  B05D5/08 ,  B82Y10/00 ,  C10M103/02 ,  F16N15/00 ,  G11B23/507 ,  G11B5/10 ,  G11B5/255 ,  G11B5/6005 ,  Y10S428/90 ,  Y10T428/24355 ,  Y10T428/24364 ,  Y10T428/30

Abstract: A film comprising fullerene molecules or their derivatives, preferably C.sub.60 or C.sub.70 fullerene molecules, is used as a lubricating film between two bearing surfaces. In a particular embodiment, a data recording disk file with the film deposited on the disk surface has improved properties of static friction and wear resistance at the head-disk interface.

Abstract translation: 使用包含富勒烯分子或其衍生物，优选C 60或C 70富勒烯分子的膜作为两个承载表面之间的润滑膜。 在特定实施例中，具有沉积在盘表面上的胶片的数据记录盘文件具有改善的磁头 - 磁盘接口处的静摩擦和耐磨性能。

公开(公告)号：US5142337A

公开(公告)日：1992-08-25

申请号：US594513

申请日：1990-10-09

Applicant: John P. Karidis ,  Timothy C. Reiley ,  Lawrence B. Schein

Inventor： John P. Karidis ,  Timothy C. Reiley ,  Lawrence B. Schein

IPC: G03G9/09 ,  G03G13/08 ,  G03G13/22 ,  G03G15/01 ,  G03G15/04 ,  G03G15/08 ,  G06K15/14 ,  H04N1/29 ,  H04N1/40

CPC classification number: H04N1/40087 ,  G03G13/08 ,  G03G13/22

Abstract: An electrophotographic printing process enables a two-color printer having only binary printing capability to produce high-quality monochrome grey-scale output having, for example, up to 100 grey levels in a 3.times.3 super-pixel through the use of a second toner comprising a mixture of opaque black, opaque white, and clear toner. A layer of the second toner is applied so as to overlie the first toner layer on the substrate, the first toner comprising black toner. The composition of the second toner may be, for example, 9 percent opaque black toner, 9 percent opaque white toner, and 82 percent clear toner. Another embodiment extends this concept to the high-quality, enhanced grey-scale printing of a color other than black. In another embodiment, the layer of the second toner is comprised of a mixture of equal amounts of opaque black toner and opaque white toner and is applied so as to overlie the first toner layer on the substrate, the first toner layer comprised of black toner having a charge-to-mass ratio in the range of 2 to 10 times less than the second toner. This embodiment is also extended to high-quality, enhanced grey-scale printing of a color other than black. The use of these concepts is also extended to a full-color printer, in which each color is printed using enhanced grey-scale.

Abstract translation: 电子照相印刷方法使得仅具有二进制打印能力的双色打印机能够通过使用第二调色剂来产生高质量的单色灰度输出，该输出具有例如在3×3超像素中高达100个灰度级， 不透明黑色，不透明白色和透明调色剂的混合物。 施加第二调色剂层以覆盖基板上的第一调色剂层，第一调色剂包含黑色调色剂。 第二调色剂的组成可以是例如9％不透明黑色调色剂，9％不透明白色调色剂和82％透明调色剂。 另一个实施例将该概念扩展到除了黑色以外的其他颜色的高质量，增强的灰度级打印。 在另一个实施方案中，第二调色剂层由等量的不透明黑色调色剂和不透明白色调色剂的混合物组成，并且被施加以覆盖在基材上的第一调色剂层，由黑色调色剂组成的第一调色剂层具有 电荷质量比在比第二调色剂小2至10倍的范围内。 该实施例还扩展到除了黑色之外的高质量，增强的灰度级打印。 这些概念的使用也扩展到全彩色打印机，其中每种颜色使用增强型灰度打印。

公开(公告)号：US5134460A

公开(公告)日：1992-07-28

申请号：US609057

申请日：1990-11-02

Applicant: Michael J. Brady ,  Sung K. Kang ,  Paul A. Moskowitz ,  James G. Ryan ,  Timothy C. Reiley ,  Erick G. Walton ,  Harry R. Bickford ,  Michael J. Palmer

Inventor： Michael J. Brady ,  Sung K. Kang ,  Paul A. Moskowitz ,  James G. Ryan ,  Timothy C. Reiley ,  Erick G. Walton ,  Harry R. Bickford ,  Michael J. Palmer

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/86 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  Y10S257/915

Abstract: A semiconductor chip carrying integrated circuits has lead lines terminating in conductive terminal pads exposed to the exterior through openings in a passivation layer. The pads include pedestals or bumps extending up from them. Each of the pedestals includes a thin metallic adhesion layer deposited on the pad. A thick metallic layer of aluminum or an alloy of aluminum is deposited upon said thin metallic adhesion layer. The thick metallic layer includes at least one metal selected from the group consisting of aluminum, aluminum plus a small percentage of Cu, Ni, Si, or Fe. Several other alternative metals can be added to aluminum to form an alloy. The thick metallic layer forms the bulk of the height of the pedestal. An adhesion layer is deposited on the bump of aluminum composed of a thin film of titanium or chromium. A barrier layer is deposited on the adhesion layer composed of copper, nickel, platinum, palladium or cobalt. A noble metal consisting of gold, palladium, or platinum is deposited on the barrier layer. In a variation of the top surface, a thick cap of a reworkable bonding metal is deposited above the metallic bump as the top surface of said bump. The bump can be composed of a number of metals such as gold, copper, nickel and aluminum in this case with aluminum being preferred. In place of the adhesion and barrier metals one can employ a layer of titanium nitride deposited on said thick layer of metal.

Abstract translation: 携带集成电路的半导体芯片具有终端于通过钝化层中的开口暴露于外部的导电端子焊盘中的导线。 垫片包括从它们向上延伸的基座或凸块。 每个基座包括沉积在垫上的薄金属粘附层。 铝的厚金属层或铝合金沉积在所述薄金属粘合层上。 厚金属层包括选自铝，铝和小百分比的Cu，Ni，Si或Fe中的至少一种金属。 可以将几种其它替代金属加入到铝中以形成合金。 厚的金属层形成基座的高度的大部分。 粘合层沉积在由钛或铬的薄膜构成的铝凸块上。 阻挡层沉积在由铜，镍，铂，钯或钴组成的粘合层上。 由金，钯或铂组成的贵金属沉积在阻挡层上。 在顶表面的变型中，可再加工的粘合金属的厚盖被沉积在金属凸块上方作为所述凸块的顶表面。 凸起可以由许多金属如金，铜，镍和铝组成，在这种情况下，优选铝。 代替粘合和阻挡金属，可以使用沉积在所述厚金属层上的氮化钛层。

公开(公告)号：US5006917A

公开(公告)日：1991-04-09

申请号：US398799

申请日：1989-08-25

Applicant: Sung K. Kang ,  Michael J. Palmer ,  Timothy C. Reiley ,  Robert D. Topa

Inventor： Sung K. Kang ,  Michael J. Palmer ,  Timothy C. Reiley ,  Robert D. Topa

IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/60 ,  H01L21/603

CPC classification number: H01L24/80 ,  B23K20/023 ,  B23K20/233 ,  B23K33/00 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14

Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

公开(公告)号：US20080151426A1

公开(公告)日：2008-06-26

申请号：US11643055

申请日：2006-12-20

Applicant: Fu-Ying Huang ,  Timothy C. Reiley ,  Timothy C. Strand ,  Qinghua Zeng

Inventor： Fu-Ying Huang ,  Timothy C. Reiley ,  Timothy C. Strand ,  Qinghua Zeng

IPC: G11B5/60

CPC classification number: G11B5/56 ,  G11B5/60 ,  G11B5/6064

Abstract: A system and method for dynamically controlling the position of a hard drive head is disclosed. The system includes a hard drive slider comprising a first substrate, a second substrate coupled to the first substrate wherein the second substrate comprises a plurality of flexures wherein at least one of the flexures is responsive to an applied current, the flexure expanding in response to the current; and a third substrate coupled to the second substrate comprising vias to provide said current to the flexure. Embodiments of the invention can be used in contact and non contact recording situations and for absorbing mechanical vibrations.

Abstract translation: 公开了一种用于动态地控制硬盘驱动器头的位置的系统和方法。 该系统包括硬盘驱动器滑块，其包括第一基板，耦合到第一基板的第二基板，其中第二基板包括多个挠曲件，其中至少一个挠曲件响应于施加的电流，挠曲件响应于 当前; 以及耦合到所述第二基板的第三基板包括通孔以向所述挠曲件提供所述电流。 本发明的实施例可用于接触和非接触记录情况以及用于吸收机械振动。

公开(公告)号：US06802761B1

公开(公告)日：2004-10-12

申请号：US10392630

申请日：2003-03-20

Applicant: Jacey R. Beaucage ,  Timothy C. Reiley ,  Huey-Ming Tzeng ,  Xiao Z. Wu

Inventor： Jacey R. Beaucage ,  Timothy C. Reiley ,  Huey-Ming Tzeng ,  Xiao Z. Wu

IPC: B24B100

CPC classification number: B24B37/16 ,  B24D18/00

Abstract: A lapping plate has photolithographically defined patterns that are electroplated to produce lands with well-defined channels. By choosing a particular geometry, the retention force is significantly reduced over prior art options, while still retaining a high land area fraction. In some versions, the material is electroplated onto sufficiently thin substrates to allow conformation to a curved vacuum chuck. This configuration provides a very large reduction in retraction force when compared to smooth, flat lapping plates. In addition, the substrate used to form the lapping plate has reduced thickness, and a vacuum chuck is used to pull the thin, flat lapping plate against it to define the curvature. This allows the lapping plate to be charged by a flat charging ring. The substrate used is typically glass and has been sputter-metallized on both sides. The resist is then patterned, leaving an exposed pattern in the metallization on both sides.

Abstract translation: 研磨板具有光刻定义的图案，其电镀以产生具有明确定义的通道的焊盘。 通过选择特定的几何形状，保持力比现有技术的选择显着降低，同时仍然保持高的陆地面积分数。 在一些版本中，将材料电镀到足够薄的衬底上以允许构成弯曲的真空吸盘。 与平滑的平板研磨板相比，该构造提供了非常大的缩回力的减小。 此外，用于形成研磨板的基底具有减小的厚度，并且使用真空卡盘将薄的平的研磨板拉向其以限定曲率。 这样可以通过一个扁平的充电环来对研磨板进行充电。 所使用的基底通常是玻璃并且已经在两侧溅射金属化。 然后将抗蚀剂图案化，在两侧的金属化中留下暴露的图案。

公开(公告)号：US5189363A

公开(公告)日：1993-02-23

申请号：US583261

申请日：1990-09-14

Applicant: Mark F. Bregman ,  Paul R. Hoffman ,  Peter G. Ledermann ,  Paul A. Moskowitz ,  Roger A. Pollak ,  Timothy C. Reiley ,  Mark B. Ritter

Inventor： Mark F. Bregman ,  Paul R. Hoffman ,  Peter G. Ledermann ,  Paul A. Moskowitz ,  Roger A. Pollak ,  Timothy C. Reiley ,  Mark B. Ritter

IPC: G01R31/26 ,  G01R1/073

CPC classification number: G01R1/0735

Abstract: A system for testing chips uses a patterned tape having a patterned array of cantilevered contact leads. The tape serves as an interface between the chip under test and a testing unit by providing conductive leads from the I/O terminals on the chip to an off-chip measuring system. The leads on the array may have balls, tips or other shapes on the end to provide contact with the terminals and compensate for height differences. The tape is a single frame or has a series of arrays each positioned around an opening where the chip will be located when a particular pattern is positioned over that chip for test. The pattern on the tape may be the same array or a different array. The tape is indexed to a new pattern when the old one is damaged or no longer needed. Alignment with the chip is by optical sensing and physical pin movement. The tape may have a flap protruding into an aperture and deflectable to provide for planar contact of the leads to the device under test.

公开(公告)号：US5120418A

公开(公告)日：1992-06-09

申请号：US664388

申请日：1991-03-04

Applicant: Sung K. Kang ,  Michael J. Palmer ,  Timothy C. Reiley ,  Robert D. Topa

Inventor： Sung K. Kang ,  Michael J. Palmer ,  Timothy C. Reiley ,  Robert D. Topa

IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/603

CPC classification number: H01L24/80 ,  B23K20/023 ,  B23K20/233 ,  B23K33/00 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14

Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separatre independently powered anodes, is provided.

Abstract translation: 用于集成电路封装中的热压接的接触构件在导体端具有均匀的织构可变形层，硬度值在Knoop尺度上大约为90的软金的范围内，粗糙的表面形态具有大约 1微米调制频率和脊之间的深度为平均集成电路板的1/4至1/2。 可变形层通过在0.03-0.05mA / sq.cm范围内的强电负电镀浴中镀金而制成。 当前密度。 提供了用于电镀不同区域的电镀装置，具有不同的电负性条件，具有独立供电的阳极。

公开(公告)号：US5028983A

公开(公告)日：1991-07-02

申请号：US263835

申请日：1988-10-27

Applicant: Harry R. Bickford ,  Mark F. Bregman ,  Thomas M. Cipolla ,  John Gow, III ,  Peter G. Ledermann ,  Ekkehard F. Miersch ,  Leonard T. Olson ,  David P. Pagnani ,  Timothy C. Reiley ,  Uh-Po E. Tsou ,  Walter V. Vilkelis

Inventor： Harry R. Bickford ,  Mark F. Bregman ,  Thomas M. Cipolla ,  John Gow, III ,  Peter G. Ledermann ,  Ekkehard F. Miersch ,  Leonard T. Olson ,  David P. Pagnani ,  Timothy C. Reiley ,  Uh-Po E. Tsou ,  Walter V. Vilkelis

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L23/49861 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3011

Abstract: Electronic device packaging structures useful for electrically interconnecting an electronic device to a substrate. The structure contains at least two metallization layers with dielectric layers between adjacent to metallization layers. The dielectric layers can have variable thickness. Beam leads can project inwardly in cantilevered fashion over a central aperture through the dielectric layers. The inner ends of the beam leads lie substantially in one plane and can be bonded to contact pads on integrated circuit electronic devices. Beam leads can project outwardly from the metallization layers over outer edges of the dielectric layers for bonding to contact pads on a substrate. Signal leads on metallization layers can be symmetrically arranged between ground and voltage leads to provide optimal impedance properties. These structures are useful for tape automated bonding applications.