公开(公告)号：US20120020609A1

公开(公告)日：2012-01-26

申请号：US12673102

申请日：2008-09-03

申请人： Masaaki Kasai ,  Hayami Hosokawa ,  Naru Yasuda ,  Hiroshi Sameshima ,  Yoshitaka Tatara ,  Naoki Yoshitake

发明人： Masaaki Kasai ,  Hayami Hosokawa ,  Naru Yasuda ,  Hiroshi Sameshima ,  Yoshitaka Tatara ,  Naoki Yoshitake

IPC分类号： G02B6/122

CPC分类号： G02B6/1221 ,  B41J19/20 ,  G02B6/43 ,  H01R35/02 ,  H04B10/25 ,  H04M1/0214 ,  H04M1/0274 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/148

摘要： An optical wiring mounted on an electronic device has a light transmission path for transmitting an optical signal. A function layer that reduces friction generated when coming in contact with a structural body in the electronic device to lower than when the light transmission path comes in contact with the structural body, and that bends according to deformation of the light transmission path, is arranged.

摘要翻译： 安装在电子设备上的光线路具有用于发送光信号的光传输路径。 功能层，其与电子设备中的结构体接触而产生的摩擦产生的摩擦力低于当光传输路径与结构体接触时的摩擦力，并且根据光传输路径的变形而弯曲。

公开(公告)号：US20110052130A1

公开(公告)日：2011-03-03

申请号：US12674459

申请日：2008-08-27

申请人： Naoki Yoshitake ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hayami Hosokawa

发明人： Naoki Yoshitake ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hayami Hosokawa

IPC分类号： G02B6/10 ,  B32B27/08 ,  B32B7/12

CPC分类号： G02B6/1221 ,  B29B13/023 ,  B29C65/02 ,  B29C65/1406 ,  B29C65/8207 ,  B29C66/0242 ,  B29C66/0244 ,  B29C66/0342 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/71 ,  B29C66/737 ,  B29C66/73774 ,  B29C66/73921 ,  B29C66/91411 ,  B29C66/91645 ,  B29C66/91921 ,  B29K2023/12 ,  B29K2067/00 ,  B29K2075/00 ,  B29K2079/08 ,  B29K2995/0018 ,  B29K2995/004 ,  B29K2995/0041 ,  B29L2011/0066 ,  B29L2031/3431 ,  B29L2031/767 ,  G02B6/138 ,  G02B6/3604 ,  G02B6/43 ,  H04M1/0214 ,  H04M1/026 ,  H04M1/22 ,  Y10T428/31511 ,  Y10T428/31565 ,  Y10T428/31663 ,  Y10T428/31797 ,  B29K2067/003 ,  B29K2033/08 ,  B29K2023/18 ,  B29K2023/06

摘要： An organic device has a substrate made of polymer, and a polymer layer adhered on the substrate. A crystallization degree of an adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of an interior of the substrate. In a manufacturing method for manufacturing an organic device including a substrate made of polymer; and having a polymer layer adhered on the substrate, the manufacturing method includes performing a low crystallization process on an adhesive surface with the polymer layer in the substrate to have a crystallization degree lower than a crystallization degree of an interior of the substrate.

摘要翻译： 有机器件具有由聚合物制成的衬底，并且粘附在衬底上的聚合物层。 与基板中的聚合物层的粘合剂表面的结晶度小于基板内部的结晶度。 在制造包括由聚合物制成的基板的有机器件的制造方法中， 并且具有粘附在基板上的聚合物层，所述制造方法包括在基板中的聚合物层的粘合剂表面上执行低结晶化处理以使结晶度低于基板内部的结晶度。

公开(公告)号：US07113683B2

公开(公告)日：2006-09-26

申请号：US11312663

申请日：2005-12-20

申请人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

发明人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

IPC分类号： G02B6/10 ,  G02B6/12

CPC分类号： G02B6/4246 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/138 ,  G02B6/30 ,  H01L31/14

摘要： A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

摘要翻译： 一种制造光波导器件的方法包括提供用于固定光纤的光纤引导件和用于在硅衬底的波导固定区域外部提供元件安装台的光学元件放置部分。 在硅衬底的波导固定区域的外部形成金属薄膜。 在通过将成为上包层的接合树脂将光波导基板结合到硅基板的整个上表面之后，沿着波导固定区域的边缘切割光波导基板，并且光波导基板 去除波导固定区域外部，露出光纤引导件和光学元件放置部分。

公开(公告)号：US20060110098A1

公开(公告)日：2006-05-25

申请号：US11312663

申请日：2005-12-20

申请人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

发明人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

IPC分类号： G02B6/12

CPC分类号： G02B6/4246 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/138 ,  G02B6/30 ,  H01L31/14

摘要： A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

公开(公告)号：US07013055B2

公开(公告)日：2006-03-14

申请号：US10611684

申请日：2003-07-01

申请人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

发明人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

IPC分类号： G02B6/12 ,  G02B6/10

CPC分类号： G02B6/4246 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/138 ,  G02B6/30 ,  H01L31/14

摘要： A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

摘要翻译： 一种制造光波导器件的方法包括提供用于固定光纤的光纤引导件和用于在硅衬底的波导固定区域外部提供元件安装台的光学元件放置部分。 在硅衬底的波导固定区域的外部形成金属薄膜。 在通过将成为上包层的接合树脂将光波导基板结合到硅基板的整个上表面之后，沿着波导固定区域的边缘切割光波导基板，并且光波导基板 去除波导固定区域外部，露出光纤引导件和光学元件放置部分。

公开(公告)号：US07174081B2

公开(公告)日：2007-02-06

申请号：US11313171

申请日：2005-12-20

申请人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

发明人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

IPC分类号： G02B6/10 ,  G02B6/12

CPC分类号： G02B6/4246 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/138 ,  G02B6/30 ,  H01L31/14

摘要： An optical waveguide device includes a first substrate, where the first substrate includes a first plate and an optical waveguide region disposed on the first plate, and where the optical waveguide region includes a core for transmitting light and a cladding surrounding the core. The optical waveguide device further includes a second substrate, where the second substrate includes a second plate having a spacer. Additionally, a surface including the optical waveguide region of the first substrate opposes a surface including the spacer of the second substrate, the spacer is formed the region which is out of the core of the first substrate, a top surface of the spacer is in contact with the first substrate, the first substrate and the second substrate are bound with adhesive material, and the entire surface of the core is in contact with the adhesive material.

摘要翻译： 光波导器件包括第一衬底，其中第一衬底包括第一板和布置在第一板上的光波导区，并且其中光波导区包括用于透射光的芯和围绕芯的包层。 光波导器件还包括第二衬底，其中第二衬底包括具有间隔物的第二板。 此外，包括第一基板的光波导区域的表面与包括第二基板的间隔件的表面相对，间隔件形成在第一基板的芯的外部的区域中，间隔件的顶表面接触 利用第一基板，第一基板和第二基板与粘合剂材料结合，并且芯的整个表面与粘合材料接触。

公开(公告)号：US20060104587A1

公开(公告)日：2006-05-18

申请号：US11313171

申请日：2005-12-20

申请人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

发明人： Kazuyuki Hayamizu ,  Yoshiyuki Komura ,  Yukari Terakawa ,  Hayami Hosokawa ,  Toshiyuki Takahashi ,  Masayoshi Higuchi ,  Yoshitaka Tatara ,  Naru Yasuda ,  Hiroto Nozawa

IPC分类号： G02B6/10

CPC分类号： G02B6/4246 ,  G02B6/12007 ,  G02B6/125 ,  G02B6/138 ,  G02B6/30 ,  H01L31/14

摘要： A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

公开(公告)号：US20100054672A1

公开(公告)日：2010-03-04

申请号：US12568146

申请日：2009-09-28

申请人： Junichi Tanaka ,  Akihiko Sano ,  Toshiaki Okuno ,  Yoshihisa Ishida ,  Akira Enami ,  Hiroshi Sameshima ,  Naru Yasuda ,  Hayami Hosokawa

发明人： Junichi Tanaka ,  Akihiko Sano ,  Toshiaki Okuno ,  Yoshihisa Ishida ,  Akira Enami ,  Hiroshi Sameshima ,  Naru Yasuda ,  Hayami Hosokawa

IPC分类号： G02B6/36

CPC分类号： G02B6/43 ,  G02B6/4201 ,  G02B6/4214

摘要： A connection member (21), which electrically connects a package (14) on which an optical element that converts an electric signal to an optical signal or converts an optical signal to an electric signal and at least one end portion including an incident/releasing port for an optical signal of an optical waveguide (11) that is optically coupled with the optical element to transmit the optical signal are mounted, and a second substrate (2) to each other, is provided with a holding unit having elasticity, which holds the package (14), and a connection unit that is connected to the substrate (2).

摘要翻译： 一种连接构件（21），其将将电信号转换为光信号的光学元件或将光信号转换为电信号的封装（14）电连接，并且至少包括入射/释放端口 安装与光学元件光学耦合以传输光信号的光波导（11）的光信号，并且第二基板（2）彼此配置有具有弹性的保持单元，其保持 封装（14），以及连接到所述基板（2）的连接单元。

公开(公告)号：US07865046B2

公开(公告)日：2011-01-04

申请号：US12296516

申请日：2007-04-13

申请人： Junichi Tanaka ,  Akihiko Sano ,  Toshiaki Okuno ,  Yoshihisa Ishida ,  Akira Enami ,  Hiroshi Sameshima ,  Naru Yasuda ,  Hayami Hosokawa

发明人： Junichi Tanaka ,  Akihiko Sano ,  Toshiaki Okuno ,  Yoshihisa Ishida ,  Akira Enami ,  Hiroshi Sameshima ,  Naru Yasuda ,  Hayami Hosokawa

IPC分类号： G02B6/30 ,  G02B6/36

CPC分类号： G02B6/43 ,  G02B6/4201 ,  G02B6/4214

摘要： A connection member electrically connects an optical element configured to convert an electric signal to an optical signal or to convert an optical signal to an electric signal, a first substrate including an incident/releasing port of an optical transmission path for an optical signal at least one end portion thereof, and a second substrate to each other. The optical transmission path is optically coupled with the optical element to transmit the optical the connection. The connection member includes a connection unit connected to the second substrate and a holding unit having elasticity and holding the first substrate. The holding unit is provided with an electrode at a connecting position to the first substrate, and the holding unit holds the first substrate by connecting the first substrate to the electrode.

摘要翻译： 连接构件电连接被配置为将电信号转换为光信号的光学元件或将光信号转换为电信号，第一基板包括用于光信号的光传输路径的入射/释放端口，至少一个 端部，第二基板。 光传输路径与光学元件光学耦合以传输光学连接。 连接构件包括连接到第二基板的连接单元和具有弹性并保持第一基板的保持单元。 保持单元在与第一基板的连接位置处设置有电极，并且保持单元通过将第一基板连接到电极来保持第一基板。

公开(公告)号：US20100202732A1

公开(公告)日：2010-08-12

申请号：US12671345

申请日：2008-08-06

申请人： Hiroshi Sameshima ,  Naru Yasuda ,  Hayami Hosokawa

发明人： Hiroshi Sameshima ,  Naru Yasuda ,  Hayami Hosokawa

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4214 ,  G02B6/4201 ,  G02B6/4242 ,  G02B6/4251

摘要： In a package (5) formed by a supporting portion (5a) for supporting a light emitting portion (7) or a light receiving portion (9) for emitting or receiving an optical signal, and a lid (5b) for covering the supporting portion (5a); the supporting portion (5a) or the lid (5b) includes a light guide mounting surface (22) for supporting at least one end including an incident/exit port of the optical signal in a film light guide (4) for optically coupling with the light emitting portion (7) or the light receiving portion (9) and transmitting the optical signal; and a length (D) in a Z-direction serving as a perpendicular direction with respect to the light guide mounting surface (22) from the light guide mounting surface (22) of the supporting portion (5a) or the lid (5b) to the lid (5b) or the supporting portion (5a) facing the light guide mounting surface (22) is longer than a length (d) in the Z-direction in a region of the film light guide (4) supported by the light guide mounting surface (22). The light guide package having a structure in which the deformation and the damage of the core are less likely to occur even when subjected to impact by vibration and the like is thereby provided.

摘要翻译： 在由用于支撑发光部分（7）的支撑部分（5a）或用于发射或接收光信号的光接收部分（9）形成的封装（5）中，以及用于覆盖支撑部分 （5a）; 支撑部分（5a）或盖子（5b）包括一个光导安装表面（22），用于在薄膜光导（4）中支撑包括光信号的入射/出射端口的至少一端，用于与 发光部（7）或光接收部（9），并发送光信号; 以及从支撑部（5a）或盖（5b）的导光体安装面（22）向相对于导光体安装面（22）的垂直方向的Z方向的长度（D）〜 面对导光体安装面（22）的盖（5b）或支撑部（5a）比由光导支撑的薄膜光导（4）的区域的Z方向的长度（d）长 安装表面（22）。 因此，具有即使受到振动等的冲击也不易发生芯的变形和损伤的结构的导光组件。