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    Resin molded semiconductor device
    1.
    发明授权
    Resin molded semiconductor device 有权
    树脂模制半导体器件

    公开(公告)号：US07265444B2

    公开(公告)日：2007-09-04

    申请号：US10870023

    申请日：2004-06-18

    申请人： Masahiro Koike ,  Hirochika Narita

    发明人： Masahiro Koike ,  Hirochika Narita

    IPC分类号： H01L23/10 ,  H01L23/34

    CPC分类号： H01L27/14825 ,  H01L23/047 ,  H01L23/10 ,  H01L27/14806 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

    摘要： To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature.A resin molded semiconductor device including a heat sink having a support face with a semiconductor chip mounted thereon electrically connected to a lead frame, a resin molded case forms a space for accommodating the semiconductor chip therein, and has an opening on an upper face thereof defined by side walls including a plurality of linearly arrayed resin projections above a top surface portion of the side walls, and molds the lead frame and heat sink, and a glass cap closing the opening and secured to the resin molded case by a bonding agent layer. The case has a thermal coefficient of expansion matched with that of the heat sink, and mechanical stress between the case and the cap is absorbed by the bonding agent layer having a thickness greater that the height of the linearly arrayed resin projections above the top surface portion of the side walls.

    摘要翻译： 为了通过降低由于温度变化而安装在其上的具有一维CCD元件的CCD器件的屈曲来提供优异的图像。 一种树脂模制半导体器件，包括散热器，该散热器具有安装在其上的半导体芯片的支撑面，电连接到引线框架，树脂模制壳体形成用于容纳半导体芯片的空间，并且在其上表面上具有限定的开口 通过侧壁包括在侧壁的顶表面部分上方的多个线性排列的树脂突起，并且模制引线框架和散热器，以及玻璃盖，其封闭开口并通过粘合剂层固定到树脂模制壳体。 壳体具有与散热器的热膨胀系数相匹配的热膨胀系数，壳体和盖子之间的机械应力被粘合剂层吸收，该粘合剂层的厚度大于顶表面部分上方的线性排列的树脂突起的高度 的侧壁。

    Resin molded semiconductor device and mold
    2.
    发明申请
    Resin molded semiconductor device and mold 有权
    树脂模制半导体器件和模具

    公开(公告)号：US20060071321A1

    公开(公告)日：2006-04-06

    申请号：US11235182

    申请日：2005-09-27

    申请人： Masahiro Koike ,  Hirochika Narita

    发明人： Masahiro Koike ,  Hirochika Narita

    IPC分类号： H01L23/52

    CPC分类号： H01L27/14825 ,  H01L23/047 ,  H01L23/10 ,  H01L27/14806 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

    摘要： To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink 11 having a one-dimensional CCD element 14 mounted thereon. The thermal coefficient of expansion of the heat sink 21 is matched with that of a hollow molded case 12 for integrally molding the heat sink 11 and a lead frame 20. A plurality of projections 21 formed on the side of the hollow molded case 12 are disposed at a bonding interface between the glass cap 13 which closes an upper opening of the hollow molded case 12 and side walls of hollow molded case 12.

    摘要翻译： 为了通过降低由于温度变化而安装在其上的具有一维CCD元件的CCD器件的屈曲来提供优异的图像。 使用黑化处理的铁或铁基合金作为其上安装有一维CCD元件14的散热器11的材料。 散热器21的热膨胀系数与用于一体地模制散热器11和引线框架20的中空模制壳体12的热膨胀系数相匹配。 形成在中空成型壳体12一侧的多个突起21设置在封闭中空成型壳体12的上部开口的玻璃盖13和中空成型壳体12的侧壁之间的接合界面处。

    Resin molded semiconductor device and mold
    3.
    发明授权
    Resin molded semiconductor device and mold 有权
    树脂模制半导体器件和模具

    公开(公告)号：US07448861B2

    公开(公告)日：2008-11-11

    申请号：US11235182

    申请日：2005-09-27

    申请人： Masahiro Koike ,  Hirochika Narita

    发明人： Masahiro Koike ,  Hirochika Narita

    IPC分类号： B29C45/14 ,  H01L21/56

    CPC分类号： H01L27/14825 ,  H01L23/047 ,  H01L23/10 ,  H01L27/14806 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

    摘要： To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink 11 having a one-dimensional CCD element 14 mounted thereon. The thermal coefficient of expansion of the heat sink 21 is matched with that of a hollow molded case 12 for integrally molding the heat sink 11 and a lead frame 20. A plurality of projections 21 formed on the side of the hollow molded case 12 are disposed at a bonding interface between the glass cap 13 which closes an upper opening of the hollow molded case 12 and side walls of hollow molded case 12.

    摘要翻译： 为了通过降低由于温度变化而安装在其上的具有一维CCD元件的CCD器件的屈曲来提供优异的图像。 使用黑化处理的铁或铁基合金作为其上安装有一维CCD元件14的散热器11的材料。 散热器21的热膨胀系数与用于一体地模制散热器11和引线框架20的中空模制壳体12的热膨胀系数相匹配。 形成在中空成型壳体12一侧的多个突起21设置在封闭中空成型壳体12的上部开口的玻璃盖13和中空成型壳体12的侧壁之间的接合界面处。

    Solid-state image sensing apparatus and package of same
    4.
    发明授权
    Solid-state image sensing apparatus and package of same 有权
    固态摄像装置及其封装相同

    公开(公告)号：US07868447B2

    公开(公告)日：2011-01-11

    申请号：US12390714

    申请日：2009-02-23

    申请人： Hirochika Narita

    发明人： Hirochika Narita

    IPC分类号： H01L23/495

    CPC分类号： H04N1/03 ,  H01L23/49541 ,  H01L23/49544 ,  H01L23/49555 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/16195 ,  H04N2201/02456 ,  H04N2201/02466 ,  H04N2201/02483 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10689 ,  H05K2201/10757 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： Warpage and twist of a solid-state image sensing apparatus is controlled, thereby preventing displacement occurring to the solid-state image sensing apparatus when it is mounted on a printed circuit board. The solid-state image sensing apparatus comprises a plurality of outer leads, and the outer leads each comprises a horizontal portion protruding in the horizontal direction from a side face of a package body for encasing a solid-state image sensing chip therein, an end portion extending in a direction orthogonal to the horizontal portion, and disposed directly below the horizontal portion, a mid portion positioned between the horizontal portion, and the end portion, a first bend formed between the horizontal portion, and the mid portion, and a second bend formed between the mid portion, and the end portion.

    摘要翻译： 控制固态图像感测装置的翘曲和扭曲，从而防止固体摄像装置安装在印刷电路板上时产生的位移。 固体摄像装置包括多个外部引线，外部引线各自包括水平部分，该水平部分从封装体的侧面在水平方向上突出，用于将固态图像感测芯片包封在其中，端部 在垂直于水平部分的方向上延伸并且设置在水平部分正下方，位于水平部分和端部之间的中间部分，形成在水平部分和中间部分之间的第一弯曲部分和第二弯曲部分 形成在中间部分和端部之间。

    Device for releasing heat generated in the amplifier unit of a solid-state image sensing element
    6.
    发明授权
    Device for releasing heat generated in the amplifier unit of a solid-state image sensing element 有权
    用于释放在固态摄像元件的放大器单元中产生的热量的装置

    公开(公告)号：US08031244B2

    公开(公告)日：2011-10-04

    申请号：US11970546

    申请日：2008-01-08

    申请人： Hirochika Narita

    发明人： Hirochika Narita

    IPC分类号： H04N5/225

    CPC分类号： H01L27/14618 ,  H01L31/024 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A solid-state imaging device with an improved heat release-ability for releasing a heat generated in the amplifier unit of the solid-state image sensing element includes an elongated substrate (molded case 18), a metallic layer 16 exposed in a surface of the molded case 18 and extending along an elongating direction of the molded case 18, and an elongated solid-state image sensing element 20 mounted on the metallic layer 16, in which a thickness in a region of a metallic layer 16 right under an amplifier unit of the solid-state image sensing element 20 is larger than thicknesses in other regions of the metallic layer 16.

    摘要翻译： 具有用于释放在固态图像感测元件的放大器单元中产生的热量的改善的放热能力的固态成像装置包括细长基板（模制壳体18），暴露在该表面中的金属层16 模制壳体18沿着模制壳体18的延伸方向延伸，并且安装在金属层16上的细长的固态图像感测元件20，金属层16的放大单元正下方的金属层16的区域中的厚度 固态图像感测元件20大于金属层16的其它区域中的厚度。

    SOLID-STATE IMAGING DEVICE
    7.
    发明申请
    SOLID-STATE IMAGING DEVICE 有权
    固态成像装置

    公开(公告)号：US20080174684A1

    公开(公告)日：2008-07-24

    申请号：US11970546

    申请日：2008-01-08

    申请人： Hirochika Narita

    发明人： Hirochika Narita

    IPC分类号： H04N3/14 ,  H04N5/225

    CPC分类号： H01L27/14618 ,  H01L31/024 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The invention provides a solid-state imaging device with an improved heat release-ability for releasing a heat generated in the amplifier unit of the solid-state image sensing element.The solid-state imaging device 10 of the present invention includes an elongated substrate (molded case 18), a metallic layer 16 exposed in a surface of the molded case 18 and extending along an elongating direction of the molded case 18, and an elongated solid-state image sensing element 20 mounted on the metallic layer 16, in which a thickness in a region of a metallic layer 16 right under an amplifier unit of the solid-state image sensing element 20 is larger than thicknesses in other regions of the metallic layer 16.

    摘要翻译： 本发明提供一种具有改善的放热能力的固态成像装置，用于释放在固体摄像元件的放大器单元中产生的热量。 本发明的固态成像装置10包括细长基板（模制壳体18），暴露在模制壳体18的表面并沿着模制壳体18的延伸方向延伸的金属层16和细长固体 安装在金属层16上的状态图像感测元件20，其中位于固态图像感测元件20的放大器单元正下方的金属层16的区域中的厚度大于金属层的其它区域中的厚度 16。

    Solid state pickup device excellent in heat-resistance and method of manufacturing the device
    8.
    发明授权
    Solid state pickup device excellent in heat-resistance and method of manufacturing the device 有权
    耐热性优异的固态拾取装置及其制造方法

    公开(公告)号：US6144107A

    公开(公告)日：2000-11-07

    申请号：US275822

    申请日：1999-03-25

    申请人： Hirochika Narita

    发明人： Hirochika Narita

    IPC分类号： H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L27/14 ,  H01L31/0203

    CPC分类号： H01L31/0203 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181

    摘要： A solid state pickup device to which the present invention is applicable comprises a base member (1a) and a solid state pickup chip (3) having a bottom surface, a receiving surface for receiving light signal, and a side surface. The solid state pickup chip is glued on the base member by using a first adhesive (7). The solid state pickup device further comprises a solid package (6) formed around the base member and the solid state pickup chip having transparency. Herein, the first adhesive has flexibility. The solid state pickup device still further comprises a covering member (5) formed around the receiving and the side surfaces of the solid state pickup chip having transparency and flexibility.

    摘要翻译： 本发明可应用的固态拾取装置包括：底部构件（1a）和具有底面的固态拾取芯片（3），用于接收光信号的接收表面和侧表面。 通过使用第一粘合剂（7）将固态拾取芯片胶合在基底构件上。 固体拾取装置还包括形成在基底构件周围的固体封装（6）和具有透明度的固态拾取芯片。 这里，第一粘合剂具有柔性。 固体拾取装置还包括形成在接收体周围的覆盖部件（5）和具有透明性和柔性的固态拾取芯片的侧表面。

    Method of manufacturing a solid-state image-sensing device including filling up a gap with insulating resin, and solid-state image-sensing device
    10.
    发明授权
    Method of manufacturing a solid-state image-sensing device including filling up a gap with insulating resin, and solid-state image-sensing device 有权
    制造固体摄像装置的方法，包括用绝缘树脂填充间隙，以及固态图像感测装置

    公开(公告)号：US07348532B2

    公开(公告)日：2008-03-25

    申请号：US11433502

    申请日：2006-05-15

    申请人： Hirochika Narita ,  Ryuya Kuroda

    发明人： Hirochika Narita ,  Ryuya Kuroda

    IPC分类号： H01L27/00

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014

    摘要： Method of manufacturing a solid-state image-sensing device includes: forming a composite lead frame which is a lead unit separated from a metal substrate surface by connecting a pair of lead frames having rectangular outer frame units, lead units formed integrally with the outer frame units within the frames, and bump units formed at one surface of the outer frame units, via the bump units of the lead frames on surfaces of both ends of the long plate-shaped metal substrate, filling up a gap between the surface of the metal substrate and the lead units with insulating resin, and forming an outer frame body by molding part of the composite lead frame so as to expose the connecting units and the lead unit to the outside, mounting a long plate-shaped solid state image sensing element on the composite lead frame, and cutting off the connecting units exposed to the outside.

    摘要翻译： 制造固体摄像装置的方法包括：通过连接具有矩形外框单元的一对引线框架，形成与金属基板表面分离的引导单元的复合引线框架，与外框架一体形成的引导单元 框架内的单元和形成在外框单元的一个表面处的凸块单元经由长板状金属基板的两端的表面上的引线框架的凸块单元填充金属表面之间的间隙 基板和具有绝缘树脂的引线单元，并且通过模制复合引线框架的一部分来形成外框体，以将连接单元和引线单元暴露于外部，将长板状固态图像感测元件安装在 复合引线框架，并切断暴露于外部的连接单元。