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1.发明授权Peelable heat-conductive and pressure-sensitive adhesive and adhesive sheet containing the same 失效可剥离的导热和压敏粘合剂和含有它的粘合片公开(公告)号：US06207272B1
公开(公告)日：2001-03-27
申请号：US09079195
申请日：1998-05-15
IPC分类号： C09J702
CPC分类号： C09J133/08 , C08L2666/28 , C08L2666/54 , C09J7/28 , C09J7/385 , C09J2433/00 , Y10T428/2804 , Y10T428/2891
摘要： A peelable heat-conductive and pressure-sensitive adhesive is disclosed, which comprises: (a) 100 parts by weight of a polymer produced from a monomer mixture comprising from 70 to 100% by weight of one or more alkyl (meth)acrylates in which the alkyl groups on the average have 2 to 14 carbon atoms and from 0 to 30% by weight of one or more monoethylenic monomers copolymerizable therewith, each based on the amount of the monomer mixture; (b) from 20 to 400 parts by weight of a plasticizer having a boiling point of 150° C. or higher; and (c) from 10 to 1,000 parts by weight of a heat-conductive filler. Also disclosed is an adhesive sheet comprising a substrate and, formed on one or each side thereof, a layer of the adhesive. The pressure-sensitive adhesive can exhibit tight adhesion during use and easy peeling after use.
摘要翻译： 公开了一种可剥离的导热和压敏粘合剂，其包括：（a）100重量份由包含70至100重量％的一种或多种（甲基）丙烯酸烷基酯的单体混合物制备的聚合物，其中 烷基平均具有2至14个碳原子和0至30重量％的一种或多种可与其共聚的单烯属单体，各自基于单体混合物的量; （b）20〜400重量份的沸点为150℃以上的增塑剂; 和（c）10〜1,000重量份的导热填料。 还公开了一种粘合片，其包括基底，并且在其一侧或两侧上形成粘合剂层。 压敏粘合剂在使用过程中表现出紧密的粘合性，使用后容易剥离。
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2.发明授权公开(公告)号：US06194063B1
公开(公告)日：2001-02-27
申请号：US09225360
申请日：1999-01-05
IPC分类号： B32B712
CPC分类号： H01L23/3737 , H01L2924/0002 , Y10T428/28 , Y10T428/2848 , Y10T428/31725 , H01L2924/00
摘要： The present invention provides a heat-conductive and pressure-sensitive adhesive sheet comprising an electrical insulating plastic film having formed on one or both of the surfaces thereof (1) at least one thin layer composed of an inorganic material selected from the group consisting of ceramics, metals and metal oxides other than ceramics, and (2) a pressure-sensitive adhesive composition layer formed on the thin layer. The heat-conductive and pressure-sensitive adhesive sheet is excellent in heat-conductivity and pressure-sensitivity, results in no trouble such as complicated procedures in the production process or worsened working environment, exhibits good adhesion between the base material and the pressure-sensitive adhesive composition layer, scarcely undergoes anchoring fracture between the base material even after allowing to stand at high temperatures for a long time, and has good heat resistance.
摘要翻译： 本发明提供了一种导热性和压敏粘合片，其包括在其一个或两个表面上形成的电绝缘塑料膜（1），至少一个由选自以下的无机材料构成的薄层：陶瓷 ，除了陶瓷之外的金属和金属氧化物，和（2）形成在薄层上的压敏粘合剂组合物层。 导热性和压敏粘合片的导热性和压敏性优异，不会产生生产过程中的复杂程序或恶化的工作环境等问题，在基材和压敏粘合剂之间表现出良好的粘附性 粘合剂组合物层，即使在高温下长时间放置之后也几乎不会在基材之间发生锚固断裂，并且具有良好的耐热性。
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3.发明授权
公开(公告)号：US6086994A
公开(公告)日：2000-07-11
申请号：US61142
申请日：1998-04-16
IPC分类号： B32B7/12 , C08L79/08 , C09J5/00 , C09J7/02 , C09J133/06 , H01L21/58 , H01L23/373 , B32B15/04
CPC分类号： H01L24/83 , C09J7/0246 , C09J7/026 , H01L23/3737 , H01L24/28 , C08L79/08 , C09J2201/122 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01074 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/19043 , Y10T428/2809 , Y10T428/2891
摘要： Heat-conductive and pressure-sensitive adhesive sheets which are excellent in heat resistance, scarcely undergo anchoring fracture between the base material and the adhesive layer and, therefore, are usable in fixing electronic parts to heat-radiating members or fixing members in various fields including constructive materials, vehicles, aircrafts and ships. the heat-conductive and pressure-sensitive adhesive sheets are in the form of sheets, tapes, etc. wherein a layer of a heat-conductive and pressure-sensitive adhesive composition, which contains an alkyl (meth)acrylate polymer having hydrophilic groups, is formed on the high frequency sputter-etched surface(s) of a plastic film containing 2 to 50% by volume of a heat-conductive, electrical insulating filler.
摘要翻译： 耐热性优异的导热性和压敏性粘合片几乎不会在基材和粘合剂层之间发生锚固断裂，因此可用于将电子部件固定在各种领域的散热构件或固定构件中，包括 建筑材料，车辆，飞机和船舶。 导热性和压敏粘合片是片状，带状等形式，其中含有具有亲水基团的（甲基）丙烯酸烷基酯聚合物的导热和压敏粘合剂组合物层是 形成在包含2至50体积％的导热电绝缘填料的塑料膜的高频溅射蚀刻表面上。
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4.发明授权公开(公告)号：US06284368B1
公开(公告)日：2001-09-04
申请号：US09155075
申请日：1998-09-21
申请人： Shigeki Muta , Takao Yoshikawa , Masahiro Oura
发明人： Shigeki Muta , Takao Yoshikawa , Masahiro Oura
IPC分类号： C08F244
摘要： Adhesive sheets using an acrylic pressure-sensitive flame-retardant adhesive having excellent properties such as adhesive force and holding power at high temperature and also having a self fire-extinguishing property which instantaneously extinguishes fire, i.e., a flame-retardance, are provided. A photopolymerizable composition comprising a) 100 parts by weight of a monomer (or the oligomer thereof) comprising 70 to 100% by weight of a (meth)acrylic acid alkyl ester having on the average a carbon number of 2 to 14 in the alkyl group and 30 to 0% by weight of a monoethylenically unsaturated monomer copolymerizable with the ester, b) 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) 0.01 to 5 parts by weight of a photopolymerization initiator, and d) 10 to 180 parts by weight of a flame retardant having a melting point of at least 60° C. is prepared, a pressure-sensitive flame-retardant adhesive is prepared from the photopolymerized product of the composition, and the adhesive is formed on one or both surfaces of a substrate.
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5.发明授权公开(公告)号：US06299975B1
公开(公告)日：2001-10-09
申请号：US09234126
申请日：1999-01-19
IPC分类号： B32B712
CPC分类号： C09J133/06 , C08F220/12 , C08L33/06 , C08L2666/44 , C09J7/10 , C09J2201/606 , Y10T428/28 , Y10T428/31504
摘要： A pressure-sensitive adhesive sheet prepared by coating a composition containing a) 100 parts by weight of monomers composed of from 70 to 100% by weight of a (meth)acrylic acid alkyl ester, said alkyl group having from 2 to 14 carbon atoms, and from 0 to 30% by weight of a monoethylenically unsaturated monomer copolymerizing therewith, b) from 0.1 to 5 parts by weight of a radical chain inhibitor, c) from 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, d) from 0.005 to 1 part by weight of a photopolymerization initiator, and e) from 0.01 to 10 parts by weight of a silane coupling agent, on a releasing-treated film having a good surface smoothness and photopolymerizing the coated layer to form a pressure-sensitive adhesive layer having a haze value of 1% or lower and a total light transmission of at least 90%. The pressure-sensitive adhesive sheet is excellent in the transparency, the foaming resistance, the low out-gas property, and the discoloring resistance (heat resistance and weather resistance).
摘要翻译： 一种压敏粘合片，其通过涂布组合物制备，所述组合物含有：100重量份由70至100重量％的（甲基）丙烯酸烷基酯，所述具有2至14个碳原子的烷基， 和0至30重量％的与其共聚的单烯属不饱和单体，b）0.1至5重量份的自由基链抑制剂，c）0.02至5重量份作为交联的多官能（甲基）丙烯酸酯 试剂，d）0.005〜1重量份的光聚合引发剂，以及e）0.01〜10重量份的硅烷偶联剂，在具有良好表面光滑度的脱模处理膜和光聚合涂层上形成 雾度值为1％以下，总透光率为90％以上的粘合剂层。 粘合片的透明性，耐发泡性，低气体性，耐褪色性（耐热性和耐候性）优异。
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公开(公告)号：US07119437B2
公开(公告)日：2006-10-10
申请号：US10737122
申请日：2003-12-17
申请人： Koji Morita , Takao Yoshikawa , Takayuki Murai
发明人： Koji Morita , Takao Yoshikawa , Takayuki Murai
IPC分类号： H01L23/34
CPC分类号： H01L25/072 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/48747 , H01L2224/49 , H01L2224/73265 , H01L2224/85447 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.
摘要翻译： 电子基板用于在其上安装多个半导体芯片。 衬底包括第一导电构件，第二导电构件和绝缘层。 第一导电构件电连接到半导体芯片之一。 第二导电构件电连接到另一个半导体芯片。 绝缘层被布置成将第二导电构件与第一导电构件电隔离。 第一导电构件是在其上支撑绝缘层，半导体芯片和第二导电构件的导电基底。
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7.发明授权公开(公告)号：US06337128B1
公开(公告)日：2002-01-08
申请号：US09210602
申请日：1998-12-15
IPC分类号： B32B712
CPC分类号： B32B27/30 , B32B17/10018 , B32B17/10743 , C08L33/06 , C09J7/22 , C09J7/26 , C09J7/38 , C09J2201/606 , Y10T428/249953 , Y10T428/249969 , Y10T428/249982 , Y10T428/249983 , Y10T428/249985 , Y10T428/28 , Y10T428/2852 , Y10T428/2891
摘要： The present invention provides a pressure-sensitive adhesion sheet being excellent in moisture and heat resistance and having a high adhesion to inorganic materials such as glass and tile, particularly a high adhesion even under high temperature and high humidity conditions, without using a silane coupling agent. The pressure-sensitive adhesion sheet for a silicone oxide-containing material comprises a base material having formed on at least one surface thereof a layer composed of an acrylic pressure-sensitive adhesive, wherein the base material is selected from a foamed base material having a water absorption rate less than 15% by weight after having been immersed in warm water having a temperature of 40° C. for 24 hours and a plastic film having a water vapor permeability of 500 g or less/m2/24 hours, and the acrylic pressure-sensitive adhesive to be used in combination with the base material selected is specified.
摘要翻译： 本发明提供一种耐湿性和耐热性优异且对玻璃和瓦片等无机材料附着性高的粘合片，即使在高温高湿条件下也具有高附着力，而不使用硅烷偶联剂 。 用于含氧化硅氧化物的材料的压敏粘合片包括在其至少一个表面上形成由丙烯酸类压敏粘合剂构成的层的基材，其中所述基材选自具有水的发泡基材 浸渍在温度为40℃的温水中24小时后的吸收率小于15重量％，水蒸气透过度为500g / m 2 / m 2/24小时的塑料膜，丙烯酸压力 规定与所选择的基材组合使用的敏感粘合剂。
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公开(公告)号：US07228673B2
公开(公告)日：2007-06-12
申请号：US10518244
申请日：2004-06-25
CPC分类号： B65B1/16 , A23L7/122 , A23L7/191 , A23L19/18 , A23L27/70 , A23P20/12 , B65B9/20 , B65B9/2028 , B65B31/045 , B65B39/12 , B65B51/306 , B65B61/28 , B65B2220/14
摘要： The present invention provides a seasoning processing system capable of uniform seasoning and, moreover, having superior cleanability. A seasoning processing system (2) according to the present invention comprises a seasoning dispersion apparatus (20) and a vertical pillow-type bag manufacturing and packaging apparatus (30). The seasoning dispersion apparatus (20) disperses powdered seasoning to be adhered to supplied intermediate articles (X . . . X) from an end part (22b), which is a dispersing mouth, of a second conduit (22). The vertical pillow-type bag manufacturing and packaging apparatus (30) introduces and packages inside a bag shaped packaging material (Fc) seasoned articles (X2. . . X2) to which the powdered seasoning has been adhered. Furthermore, the end part (22b), which is the dispersing mouth,of the second conduit (22) is provided and arranged so that it is positioned inside the bag shaped packaging material (Fc). A first electrical charging mechanism is provided to charge the seasoning with a polarity and a second electrical charging mechanism is provided to a transverse sealing mechanism of the packaging material to charge the packaging material with the same polarity as the seasoning. In this manner the seasoning and the packaging material repel each other during the sealing operation.
摘要翻译： 本发明提供一种能够均匀调味的调味处理系统，而且具有优异的可清洁性。 根据本发明的调味处理系统（2）包括调味分散设备（20）和垂直枕式袋制造和包装设备（30）。 调味分散装置（20）从作为分散口的端部（22b）分散第二导管（22）的供给的中间制品（X ... X）的粉状调味料。 立式枕式袋制造包装装置（30）将已经粘贴有调味料的袋状包装材料（Fc）经验化物品（X 2 ... X 2）引入并包装。 此外，作为第二导管（22）的分散口的端部（22a）设置并布置成使其位于袋形包装材料（Fc）的内部。 提供了第一充电机构，以极性对调料进行充电，并且向包装材料的横向密封机构提供第二充电机构，以与调味料具有相同的极性来对包装材料充电。 以这种方式，在密封操作期间，调味料和包装材料彼此排斥。
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公开(公告)号：US20050087849A1
公开(公告)日：2005-04-28
申请号：US10737122
申请日：2003-12-17
申请人： Koji Morita , Takao Yoshikawa , Takayuki Murai
发明人： Koji Morita , Takao Yoshikawa , Takayuki Murai
CPC分类号： H01L25/072 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/48747 , H01L2224/49 , H01L2224/73265 , H01L2224/85447 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.
摘要翻译： 电子基板用于在其上安装多个半导体芯片。 衬底包括第一导电构件，第二导电构件和绝缘层。 第一导电构件电连接到半导体芯片之一。 第二导电构件电连接到另一个半导体芯片。 绝缘层被布置成将第二导电构件与第一导电构件电隔离。 第一导电构件是在其上支撑绝缘层，半导体芯片和第二导电构件的导电基底。
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10.发明授权公开(公告)号：US06228965B1
公开(公告)日：2001-05-08
申请号：US09319105
申请日：1999-06-01
申请人： Shigeki Muta , Masahiro Ohura , Takao Yoshikawa
发明人： Shigeki Muta , Masahiro Ohura , Takao Yoshikawa
IPC分类号： C08F22010
CPC分类号： C09J9/00 , C08L33/06 , C08L2666/54 , C09J7/22 , C09J7/38 , C09J133/06 , C09J2201/122 , C09J2201/128 , C09J2201/606 , Y10T428/31692 , Y10T428/31721 , Y10T428/31743 , Y10T428/3175 , Y10T428/31797
摘要： An adhesive sheet (2) in which heat-conductive and pressure-sensitive adhesive layers (22, 23) which comprise a) a copolymer of a monomer mixture containing main monomers comprising as main component an alkyl (meth)acrylate carrying an alkyl group having from 2 to 14 carbon atoms on average and from 1 to 30% by weight, based on the above main monomers, of a polar monomer having a glass transition point, as a homo-polymer, of ° C. or lower; and b) from 10 to 300 parts by weight, per 100 parts by weight of the copolymer, of a heat-conductive filler are formed on both surfaces of a heat-conductive base material (21) is inserted between an electronic part (1) and a heat-radiating member (3) to thereby adhere and fix the heat-radiating member (3) to the electronic part (1) while providing a high heat-conductivity with the heat-conductive and pressure-sensitive adhesive layers (22, 23).
摘要翻译： 一种粘合片（2），其中导热和压敏粘合剂层（22,23）包括a）含有主要单体的单体混合物的共聚物，所述单体混合物含有作为主要组分的带有烷基的（甲基）丙烯酸烷基酯， 平均为2至14个碳原子，1至30重量％，基于上述主要单体，具有℃或更低的均聚物的具有玻璃化转变点的极性单体; 和b）在导电性基材（21）的两面上形成有10〜300重量份/ 100重量份的共聚物，导电性填料形成在电子部件（1） 和散热构件（3），从而将散热构件（3）粘附并固定到电子部件（1）上，同时向导电和压敏粘合剂层（22,22）提供高的导热性， 23）。
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