公开(公告)号：US20120111622A1

公开(公告)日：2012-05-10

申请号：US13353394

申请日：2012-01-19

申请人： Noritsugu DAIGAKU ,  Takahiro Nonaka ,  Masahiro Oura

发明人： Noritsugu DAIGAKU ,  Takahiro Nonaka ,  Masahiro Oura

IPC分类号： H05K1/02 ,  C09J7/04

CPC分类号： H05K3/0061 ,  C08L23/20 ,  C08L93/00 ,  C08L99/00 ,  C08L2666/26 ,  C09J7/10 ,  C09J7/21 ,  C09J7/38 ,  C09J11/08 ,  C09J133/04 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/263 ,  C09J2433/00 ,  H05K1/0393 ,  H05K3/386 ,  H05K2203/0191 ,  Y10T428/1476

摘要： The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for use in a wiring circuit board, which includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition comprising an acrylic polymer and a tackifier resin containing a phenolic hydroxyl group; and a release liner comprising a releasing treatment layer formed of a silicone release agent. The double-sided pressure-sensitive adhesive tape or sheet of the invention has a good adhesiveness and, even after a high-temperature step, it is capable of exerting an excellent anti-repulsion property. Further, since the release liner can be easily peeled off even after the high-temperature step, the workability is excellent and the productivity is improved.

摘要翻译： 本发明涉及一种用于布线电路板的双面压敏粘合带或片，其包括由包含丙烯酸类聚合物和增粘树脂的压敏粘合剂组合物形成的压敏粘合剂层，所述粘合剂组合物含有 酚羟基; 以及包含由有机硅脱模剂形成的脱模处理层的剥离衬垫。 本发明的双面压敏粘合带或粘合带具有良好的粘合性，即使在高温阶段之后也能发挥优异的抗排斥性。 此外，由于即使在高温阶段之后剥离衬垫也能够容易地剥离，所以可加工性优异，生产率提高。

公开(公告)号：US06261685B1

公开(公告)日：2001-07-17

申请号：US09400182

申请日：1999-09-21

申请人： Kazuhito Hosokawa ,  Masahiro Oura

发明人： Kazuhito Hosokawa ,  Masahiro Oura

IPC分类号： C09J702

CPC分类号： C09J133/14 ,  C08L63/00 ,  C08L2666/14 ,  C09J7/385 ,  C09J2201/128 ,  C09J2201/61 ,  C09J2433/00 ,  C09J2463/00 ,  H05K3/305 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2891

摘要： An adhesive sheet not tacky at ordinary temperatures, exhibiting strong adhesion and high heat resistance by heating under low pressure for a short period of time, having no problem of adhesive protrusion and excellent in storage stability, which comprises a base material having provided on one side or both sides thereof at least one layer of a thermosetting adhesive comprising (1) a non-tacky polymer of a monomer mixture comprising from 70% to 99% by weight of a (meth)acrylic ester represented by formula (I), a homopolymer of which has a glass transition temperature of −30° C. or more, and from 1% to 30% by weight of a monoethylenic unsaturated monomer being copolymerizable therewith and having a functional group capable of reacting with an epoxy resin each based on the monomer mixture and (2) from 5 parts to 30 parts by weight of the epoxy resin per 100 parts by weight of the monomer mixture, and not substantially comprising a curing agent for the epoxy resin:

摘要翻译： 粘合片在常温下不发粘，表现出很强的附着力和耐低温性，在短时间内在低压下加热，没有粘接突出和存储稳定性优良的粘合片，它包括一侧设置的基材 或其两侧的至少一层热固性粘合剂，其包含（1）包含70重量％至99重量％的由式（I）表示的（甲基）丙烯酸酯的单体混合物的非粘性聚合物，均聚物 其玻璃化转变温度为-30℃以上，1重量％〜30重量％的可与其共聚的单烯属不饱和单体，具有能够与基于单体的环氧树脂反应的官能团 混合物和（2）每100重量份单体混合物5至30重量份的环氧树脂，并且基本上不包含用于环氧树脂的固化剂：

公开(公告)号：US06207272B1

公开(公告)日：2001-03-27

申请号：US09079195

申请日：1998-05-15

申请人： Hitoshi Takahira ,  Masahiro Oura ,  Kazuyuki Kitakura ,  Takao Yoshikawa ,  Shigeki Muta

发明人： Hitoshi Takahira ,  Masahiro Oura ,  Kazuyuki Kitakura ,  Takao Yoshikawa ,  Shigeki Muta

IPC分类号： C09J702

CPC分类号： C09J133/08 ,  C08L2666/28 ,  C08L2666/54 ,  C09J7/28 ,  C09J7/385 ,  C09J2433/00 ,  Y10T428/2804 ,  Y10T428/2891

摘要： A peelable heat-conductive and pressure-sensitive adhesive is disclosed, which comprises: (a) 100 parts by weight of a polymer produced from a monomer mixture comprising from 70 to 100% by weight of one or more alkyl (meth)acrylates in which the alkyl groups on the average have 2 to 14 carbon atoms and from 0 to 30% by weight of one or more monoethylenic monomers copolymerizable therewith, each based on the amount of the monomer mixture; (b) from 20 to 400 parts by weight of a plasticizer having a boiling point of 150° C. or higher; and (c) from 10 to 1,000 parts by weight of a heat-conductive filler. Also disclosed is an adhesive sheet comprising a substrate and, formed on one or each side thereof, a layer of the adhesive. The pressure-sensitive adhesive can exhibit tight adhesion during use and easy peeling after use.

摘要翻译： 公开了一种可剥离的导热和压敏粘合剂，其包括：（a）100重量份由包含70至100重量％的一种或多种（甲基）丙烯酸烷基酯的单体混合物制备的聚合物，其中 烷基平均具有2至14个碳原子和0至30重量％的一种或多种可与其共聚的单烯属单体，各自基于单体混合物的量; （b）20〜400重量份的沸点为150℃以上的增塑剂; 和（c）10〜1,000重量份的导热填料。 还公开了一种粘合片，其包括基底，并且在其一侧或两侧上形成粘合剂层。 压敏粘合剂在使用过程中表现出紧密的粘合性，使用后容易剥离。

公开(公告)号：US20120111612A1

公开(公告)日：2012-05-10

申请号：US13382377

申请日：2010-06-23

申请人： Rie Kuwahara ,  Masahiro Oura ,  Takahiro Nonaka ,  Noritsugu Daigaku

发明人： Rie Kuwahara ,  Masahiro Oura ,  Takahiro Nonaka ,  Noritsugu Daigaku

IPC分类号： H05K1/00 ,  C09J133/08 ,  C08F220/10

CPC分类号： C09J161/14 ,  C08G8/36 ,  C08L33/08 ,  C08L61/14 ,  C09J7/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  H01L2924/00013 ,  H05K3/386 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： The present invention provides a thermosetting adhesive tape or sheet having a thermosetting adhesive layer, which can be stored stably at room temperature, and, when thermally cured, can exert excellent adhesiveness and high thermal stability after exposure to heat and moist, because the resin in the adhesive rapidly reacts upon curing. The thermosetting adhesive tape or sheet according to the present invention includes a thermosetting adhesive layer which has a gel fraction of less than 70%, a difference in gel fraction between before and after storage at 40° C. for 7 days [(gel fraction after storage at 40° C. for 7 days)−(gel fraction before storage at 40° C. for 7 days)] of 15% or less, and a gel fraction after curing at 150° C. for 1 hour of 90% or more.

摘要翻译： 本发明提供一种具有热固性粘合剂层的热固性粘合带或片材，其可以在室温下稳定地储存，并且当热固化时，可以在暴露于热和潮湿之后发挥优异的粘合性和高的热稳定性，因为树脂在 粘合剂在固化时迅速反应。 根据本发明的热固性粘合带或片材包括凝胶分数低于70％的热固性粘合剂层，在40℃下保存7天之前的凝胶分数之间的凝胶分数差异[（凝胶分数 在40℃下保存7天） - （在40℃下储存7天的凝胶分数）]为15％以下，在150℃下固化1小时后的凝胶分数为90％或 更多。

公开(公告)号：US07927697B2

公开(公告)日：2011-04-19

申请号：US11783631

申请日：2007-04-11

申请人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

发明人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

IPC分类号： B32B7/12 ,  B32B27/30

CPC分类号： H05K3/007 ,  C09J7/21 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2433/00 ,  H05K1/0393 ,  H05K2203/0152 ,  H05K2203/0191 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2891

摘要： The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C. within 260 to 300 seconds and the solder reflow step finishes within 370 seconds after start of the solder reflow step for the double-sided pressure-sensitive adhesive tape or sheet.

摘要翻译： 本发明涉及一种用于布线电路板的双面压敏粘合带或片，其包括由含有丙烯酸类聚合物和链转移物质的压敏粘合剂组合物形成的压敏粘合剂层，其中 压敏粘合剂层具有以下特征：初始阶段的凝胶分数为40〜70重量％，以下的回流焊步骤后的粘合剂层的凝胶分数（重量％）与第 初始阶段的粘合剂层的凝胶分数（重量％）为10以下。 回流焊步骤满足以下热处理条件。 表面温度在130〜180秒内达到175±10℃，表面温度在200〜250秒内达到230±10℃，表面温度达到255±15℃ 在260〜300秒钟内，并且焊料回流步骤在对双面压敏粘合带或片材进行的焊料回流步骤开始后的370秒内完成。

公开(公告)号：US20070237949A1

公开(公告)日：2007-10-11

申请号：US11783631

申请日：2007-04-11

申请人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

发明人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

IPC分类号： B32B3/00 ,  B32B18/00 ,  B32B7/12

CPC分类号： H05K3/007 ,  C09J7/21 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2433/00 ,  H05K1/0393 ,  H05K2203/0152 ,  H05K2203/0191 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2891

摘要： The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C. within 260 to 300 seconds and the solder reflow step finishes within 370 seconds after start of the solder reflow step for the double-sided pressure-sensitive adhesive tape or sheet.

摘要翻译： 本发明涉及一种用于布线电路板的双面压敏粘合带或片，其包括由含有丙烯酸类聚合物和链转移物质的压敏粘合剂组合物形成的压敏粘合剂层，其中 压敏粘合剂层具有以下特征：初始阶段的凝胶分数为40〜70重量％，以下的回流焊步骤后的粘合剂层的凝胶分数（重量％）与第 初始阶段的粘合剂层的凝胶分数（重量％）为10以下。 回流焊步骤满足以下热处理条件。 表面温度在130〜180秒内达到175±10℃，表面温度在200〜250秒内达到230±10℃，表面温度达到255±15℃ 在260〜300秒钟内，并且焊料回流步骤在对双面压敏粘合带或片材进行的焊料回流步骤开始后的370秒内完成。

公开(公告)号：US6086994A

公开(公告)日：2000-07-11

申请号：US61142

申请日：1998-04-16

申请人： Masahiro Oura ,  Kazuyuki Kitakura ,  Shigeki Muta ,  Takao Yoshikawa

发明人： Masahiro Oura ,  Kazuyuki Kitakura ,  Shigeki Muta ,  Takao Yoshikawa

IPC分类号： B32B7/12 ,  C08L79/08 ,  C09J5/00 ,  C09J7/02 ,  C09J133/06 ,  H01L21/58 ,  H01L23/373 ,  B32B15/04

CPC分类号： H01L24/83 ,  C09J7/0246 ,  C09J7/026 ,  H01L23/3737 ,  H01L24/28 ,  C08L79/08 ,  C09J2201/122 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/19043 ,  Y10T428/2809 ,  Y10T428/2891

摘要： Heat-conductive and pressure-sensitive adhesive sheets which are excellent in heat resistance, scarcely undergo anchoring fracture between the base material and the adhesive layer and, therefore, are usable in fixing electronic parts to heat-radiating members or fixing members in various fields including constructive materials, vehicles, aircrafts and ships. the heat-conductive and pressure-sensitive adhesive sheets are in the form of sheets, tapes, etc. wherein a layer of a heat-conductive and pressure-sensitive adhesive composition, which contains an alkyl (meth)acrylate polymer having hydrophilic groups, is formed on the high frequency sputter-etched surface(s) of a plastic film containing 2 to 50% by volume of a heat-conductive, electrical insulating filler.

摘要翻译： 耐热性优异的导热性和压敏性粘合片几乎不会在基材和粘合剂层之间发生锚固断裂，因此可用于将电子部件固定在各种领域的散热构件或固定构件中，包括 建筑材料，车辆，飞机和船舶。 导热性和压敏粘合片是片状，带状等形式，其中含有具有亲水基团的（甲基）丙烯酸烷基酯聚合物的导热和压敏粘合剂组合物层是 形成在包含2至50体积％的导热电绝缘填料的塑料膜的高频溅射蚀刻表面上。

公开(公告)号：US20090263606A1

公开(公告)日：2009-10-22

申请号：US12426339

申请日：2009-04-20

申请人： Takahiro NONAKA ,  Noritsugu DAIGAKU ,  Rie KUWAHARA ,  Masahiro OURA ,  Sadaji SUTOU

发明人： Takahiro NONAKA ,  Noritsugu DAIGAKU ,  Rie KUWAHARA ,  Masahiro OURA ,  Sadaji SUTOU

IPC分类号： B32B7/06 ,  B32B27/08

CPC分类号： C09J133/08 ,  B32B5/18 ,  B32B7/06 ,  B32B7/12 ,  B32B27/065 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/304 ,  B32B27/306 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/308 ,  B32B2307/402 ,  B32B2307/72 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/08 ,  C08L61/06 ,  C08L2666/16 ,  C09J7/38 ,  C09J7/40 ,  C09J2201/606 ,  C09J2400/226 ,  C09J2423/005 ,  C09J2423/045 ,  C09J2433/00 ,  C09J2461/00 ,  H05K1/0393 ,  H05K3/386 ,  Y10T428/1452

摘要： The present invention provides a thermosetting adhesive or pressure-sensitive adhesive tape or sheet including: a thermosetting adhesive or pressure-sensitive adhesive layer formed of a thermosetting adhesive or pressure-sensitive adhesive composition containing an acrylic polymer (X) constituted of, as essential monomer components, an alkyl (meth)acrylate (a) in which the alkyl moiety thereof has from 2 to 14 carbon atoms and a cyano group-containing monomer (b), and a phenol resin (Y); and provided on at least one surface of the thermosetting adhesive or pressure-sensitive adhesive layer, a release liner including a plastic film substrate and a release layer provided on at least one side of the plastic film substrate, the release layer containing low density polyethylene as a major component and having a thickness of 5 μm or more and less than 20 μm.

摘要翻译： 本发明提供一种热固性粘合剂或压敏粘合带或片，其包括：由热固性粘合剂或压敏粘合剂组合物形成的热固性粘合剂或压敏粘合剂层，所述热固性粘合剂或压敏粘合剂组合物含有作为必需单体的丙烯酸类聚合物（X） 组分，其中烷基部分具有2至14个碳原子的（甲基）丙烯酸烷基酯（a）和含氰基单体（b）和酚醛树脂（Y）; 并且设置在热固性粘合剂或压敏粘合剂层的至少一个表面上，包含塑料膜基材的剥离衬垫和设置在塑料膜基材的至少一侧上的剥离层，所述剥离层包含低密度聚乙烯作为 主要成分为5μm以上且小于20μm的厚度。

公开(公告)号：US20050266195A1

公开(公告)日：2005-12-01

申请号：US11129499

申请日：2005-05-16

申请人： Takahiro Nonaka ,  Shinji Inokuchi ,  Masahiro Oura

发明人： Takahiro Nonaka ,  Shinji Inokuchi ,  Masahiro Oura

IPC分类号： C09J7/02 ,  B32B9/00

CPC分类号： C09J7/403 ,  C09J7/385 ,  C09J2201/28 ,  C09J2423/005 ,  Y10T428/14 ,  Y10T428/1438 ,  Y10T428/24355 ,  Y10T428/28 ,  Y10T428/2804

摘要： The release liner includes a release layer constituted of at least one polyolefin resin, wherein the release layer has surface irregularities. The surface irregularities of the release layer may be constituted of recesses and protrusions which are irregularly different in shape and have been disposed in irregular arrangement. The release layer preferably has a surface roughness Ra of 1-3 μm. As the polyolefin resin constituting the release layer can be used at least one polyolefin resin selected from the group consisting of polyethylenes, polypropylene, polybutenes, poly(4-methyl-1-pentene), and copolymers of ethylene with one or more α-olefins having 3-10 carbon atoms.

摘要翻译： 剥离衬垫包括由至少一种聚烯烃树脂构成的剥离层，其中剥离层具有表面凹凸。 剥离层的表面凹凸可以由形状不规则且凹凸不平的凹凸构成。 剥离层优选具有1-3μm的表面粗糙度Ra。 构成脱模层的聚烯烃树脂可以使用选自聚乙烯，聚丙烯，聚丁烯，聚（4-甲基-1-戊烯）中的至少一种聚烯烃树脂，以及乙烯与一种或多种α-烯烃的共聚物 具有3-10个碳原子。

公开(公告)号：US06284368B1

公开(公告)日：2001-09-04

申请号：US09155075

申请日：1998-09-21

申请人： Shigeki Muta ,  Takao Yoshikawa ,  Masahiro Oura

发明人： Shigeki Muta ,  Takao Yoshikawa ,  Masahiro Oura

IPC分类号： C08F244

摘要： Adhesive sheets using an acrylic pressure-sensitive flame-retardant adhesive having excellent properties such as adhesive force and holding power at high temperature and also having a self fire-extinguishing property which instantaneously extinguishes fire, i.e., a flame-retardance, are provided. A photopolymerizable composition comprising a) 100 parts by weight of a monomer (or the oligomer thereof) comprising 70 to 100% by weight of a (meth)acrylic acid alkyl ester having on the average a carbon number of 2 to 14 in the alkyl group and 30 to 0% by weight of a monoethylenically unsaturated monomer copolymerizable with the ester, b) 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) 0.01 to 5 parts by weight of a photopolymerization initiator, and d) 10 to 180 parts by weight of a flame retardant having a melting point of at least 60° C. is prepared, a pressure-sensitive flame-retardant adhesive is prepared from the photopolymerized product of the composition, and the adhesive is formed on one or both surfaces of a substrate.