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    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号：US20100308465A1

    公开(公告)日：2010-12-09

    申请号：US12794012

    申请日：2010-06-04

    申请人： Masami Ogura ,  Takahito Takayanagi ,  Yuko Yamada ,  Jun Kato ,  Tsugio Masuda ,  Tsukasa Aiba ,  Fumitomo Takano

    发明人： Masami Ogura ,  Takahito Takayanagi ,  Yuko Yamada ,  Jun Kato ,  Tsugio Masuda ,  Tsukasa Aiba ,  Fumitomo Takano

    IPC分类号： H01L23/488 ,  H01L21/60

    CPC分类号： H05K1/0204 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/0058 ,  H01L2924/00

    摘要： There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.

    摘要翻译： 提供了一种半导体器件，包括：电路板，其通过将第一和第二金属板分别接合到绝缘基板的两个表面而形成;至少一个半导体元件，其将通过第一和第二金属板接合到第一金属板的外表面 焊料和散热基板，其通过第二焊料与第二金属板的外表面接合，其中第一和第二焊料由相同类型的焊料构成，并且厚度之和的比率 将绝缘基板的厚度的第一金属板和第二金属板设定在预定范围内，以确保第一和第二焊料各自的温度应力的耐久性。

    Semiconductor device
    3.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08045335B2

    公开(公告)日：2011-10-25

    申请号：US12376541

    申请日：2007-07-25

    申请人： Fumitomo Takano ,  Shinya Watanabe ,  Tsukasa Aiba ,  Joji Nakashima ,  Hiroshi Otsuka

    发明人： Fumitomo Takano ,  Shinya Watanabe ,  Tsukasa Aiba ,  Joji Nakashima ,  Hiroshi Otsuka

    IPC分类号： H05K1/11 ,  H01R9/00 ,  H01L21/70

    CPC分类号： H01L25/071 ,  H01L25/18 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor device includes first and second assembled bodies (12A, 12B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar (21) connected to one surface of the first semiconductor chip, a first metal wiring board (24-1) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (24-3) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar (23) connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (24-2) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (24-4) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.

    摘要翻译： 半导体器件包括第一和第二组装体（12A，12B）。 第一组装体设置有第一半导体芯片，连接到第一半导体芯片的一个表面的高压母线（21），连接到第一半导体芯片的另一个表面的第一金属布线板（24-1） 和与第一金属布线板连接的第三金属布线板（24-3）。 第二组装体设置有第二半导体芯片，利用接合线连接到第二半导体芯片的一个表面的低压母线（23），连接到第二半导体芯片的另一个表面的第二金属布线板（24-2） 第二半导体芯片和第四金属布线板（24-4），通过从第二金属布线板的端部返回并与第二金属布线板平行地布置。 第一组装体和第二组装体被布置成堆叠结构，其中组装体被分离。 通过半导体模块结构减小主电路的电感。

    SEMICONDUCTOR DEVICE
    5.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20090257212A1

    公开(公告)日：2009-10-15

    申请号：US12376541

    申请日：2007-07-25

    申请人： Fumitomo Takano ,  Shinya Watanabe ,  Tsukasa Aiba ,  Joji Nakashima ,  Hiroshi Otsuka

    发明人： Fumitomo Takano ,  Shinya Watanabe ,  Tsukasa Aiba ,  Joji Nakashima ,  Hiroshi Otsuka

    IPC分类号： H05K1/14

    CPC分类号： H01L25/071 ,  H01L25/18 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor device includes first and second assembled bodies (12A, 12B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar (21) connected to one surface of the first semiconductor chip, a first metal wiring board (24-1) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (24-3) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar (23) connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (24-2) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (24-4) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.

    摘要翻译： 半导体器件包括第一和第二组装体（12A，12B）。 第一组装体设置有第一半导体芯片，连接到第一半导体芯片的一个表面的高压母线（21），连接到第一半导体芯片的另一个表面的第一金属布线板（24-1） 和与第一金属布线板连接的第三金属布线板（24-3）。 第二组装体设置有第二半导体芯片，利用接合线连接到第二半导体芯片的一个表面的低压母线（23），连接到第二半导体芯片的另一个表面的第二金属布线板（24-2） 第二半导体芯片和第四金属布线板（24-4），通过从第二金属布线板的端部返回并与第二金属布线板平行地布置。 第一组装体和第二组装体被布置成堆叠结构，其中组装体被分离。 通过半导体模块结构减小主电路的电感。

    Information processing apparatus, information processing method, and control program
    7.
    发明授权
    Information processing apparatus, information processing method, and control program 失效
    信息处理装置，信息处理方法和控制程序

    公开(公告)号：US07552432B2

    公开(公告)日：2009-06-23

    申请号：US10889632

    申请日：2004-07-12

    申请人： Tsukasa Aiba

    发明人： Tsukasa Aiba

    IPC分类号： G06F9/445 ,  G06F15/177 ,  G06F3/12

    CPC分类号： G06F9/4411

    摘要： A push installation system including a server and clients connected via a network, the server installing a device driver on one or more clients via the network, is provided. The server includes an acquisition unit for acquiring, via the network, an operating state of each of the clients connected to the network; a determination unit for determining whether or not each of the clients is in a ready-for-installation state, in which installation can be performed, based on the operating state of each of the clients acquired by the acquisition unit; and an installation unit for performing processing, via the network, for installing or updating the device driver on at least one client that is determined to be in the ready-for-installation state.

    摘要翻译： 提供了一种包括通过网络连接的服务器和客户端的推送安装系统，通过网络在一个或多个客户端上安装设备驱动程序的服务器。 服务器包括一个获取单元，用于经由网络获取连接到网络的每个客户端的操作状态; 确定单元，用于基于由所述获取单元获取的每个客户端的操作状态来确定每个客户端是否处于可以进行安装的准备安装状态; 以及安装单元，用于经由网络执行用于在确定处于准备安装状态的至少一个客户端上安装或更新设备驱动程序的处理。

    Printer driver having adaptable default mode
    8.
    发明授权
    Printer driver having adaptable default mode 失效
    具有适应默认模式的打印机驱动程序

    公开(公告)号：US06762771B1

    公开(公告)日：2004-07-13

    申请号：US09135648

    申请日：1998-08-18

    申请人： Toru Niki ,  Tsukasa Aiba

    发明人： Toru Niki ,  Tsukasa Aiba

    IPC分类号： G05G500

    CPC分类号： G06F3/1204 ,  G06F3/1229 ,  G06F3/1284

    摘要： A device driver for use in a computer system includes process steps to detect data corresponding to at least one system resource of the computer system, to determine a default operational mode from a plurality of operational modes of a device based on the data corresponding to at least one system resource, and to provide a user interface for selecting an operational mode from the plurality of operational modes.

    摘要翻译： 用于计算机系统的设备驱动程序包括检测对应于计算机系统的至少一个系统资源的数据的过程步骤，以基于至少对应的数据从设备的多个操作模式确定默认操作模式 一个系统资源，并且提供用于从多个操作模式中选择操作模式的用户界面。

    DEVICE DRIVER UPDATING METHOD AND PROGRAM, INFORMATION PROCESSING APPARATUS AND SERVER APPARATUS USING THE SAME, AND STORAGE FOR STORING DEVICE DRIVER UPDATING PROGRAM
    9.
    发明申请
    DEVICE DRIVER UPDATING METHOD AND PROGRAM, INFORMATION PROCESSING APPARATUS AND SERVER APPARATUS USING THE SAME, AND STORAGE FOR STORING DEVICE DRIVER UPDATING PROGRAM 有权
    设备驱动程序更新方法和程序，信息处理设备和使用该设备的服务器设备以及存储设备驱动程序更新程序的存储

    公开(公告)号：US20100005460A1

    公开(公告)日：2010-01-07

    申请号：US12546776

    申请日：2009-08-25

    申请人： Tsukasa Aiba ,  Hisashi Kato

    发明人： Tsukasa Aiba ,  Hisashi Kato

    IPC分类号： G06F9/44

    CPC分类号： G06F9/4411

    摘要： An information processing apparatus has a storage device that stores a device driver which incorporates access information regarding access to the server apparatus and a property display screen with instruction items for instructing a device driver request; a notification unit that, based on an instruction to the instruction items on the property display screen, refers to the access information and notifies the access information to an application that is capable of processing page information, in order to obtain driver update page information from the server apparatus; and an updating control unit that, based on an instruction to an update instruction section to request automatic update that is provided on a driver update page created based on the driver update page information obtained, controls a process to obtain device driver update information sent from the server apparatus and update the device driver stored in the storage device.

    摘要翻译： 信息处理装置具有存储装置驱动器，其存储有关对服务器装置的访问的访问信息以及具有用于指示设备驱动程序请求的指示项的属性显示画面; 通知单元，根据对属性显示画面上的指示项目的指示，参照访问信息，并将访问信息通知给能够处理页面信息的应用程序，以从 服务器设备 以及更新控制单元，其基于根据所获得的所述驾驶员更新页面信息而创建的驱动器更新页面上提供的请求自动更新的更新指示部的指示，控制从所述驱动器更新页面发送的设备驱动程序更新信息的处理 服务器装置，并更新存储在存储装置中的设备驱动程序。

    Device driver updating method and program, information processing apparatus and server apparatus using the same, and storage for storing device driver updating program
    10.
    发明授权
    Device driver updating method and program, information processing apparatus and server apparatus using the same, and storage for storing device driver updating program 失效
    设备驱动程序更新方法和程序，信息处理装置和使用其的服务器装置，以及用于存储设备驱动程序更新程序的存储器

    公开(公告)号：US07600226B2

    公开(公告)日：2009-10-06

    申请号：US10263463

    申请日：2002-10-02

    申请人： Tsukasa Aiba ,  Hisashi Kato

    发明人： Tsukasa Aiba ,  Hisashi Kato

    IPC分类号： G06F9/44

    CPC分类号： G06F9/4411

    摘要： An information processing apparatus has a storage device that stores a device which incorporates access information regarding access to the server apparatus and a property display screen with instruction items for instructing a device driver request; a notification unit that, based on an instruction to the instruction items on the property display screen, refers to the access information and notifies the access information to an application that is capable of processing page information, in order to obtain driver update page information from the server apparatus; and an updating control unit that, based on an instruction to an update instruction section to request automatic update that is provided on a driver update page created based on the driver update page information obtained, controls a process to obtain device driver update information sent from the server apparatus and update the device driver stored in the storage device.

    摘要翻译： 信息处理装置具有：存储装置，其存储有关对服务器装置的访问的访问信息;以及属性显示画面，具有用于指示设备驱动程序请求的指示项; 通知单元，根据对属性显示画面上的指示项目的指示，参照访问信息，并将访问信息通知给能够处理页面信息的应用程序，以从 服务器设备 以及更新控制单元，其基于根据所获得的所述驾驶员更新页面信息而创建的驱动器更新页面上提供的请求自动更新的更新指示部的指示，控制从所述驱动器更新页面发送的设备驱动程序更新信息的处理 服务器装置，并更新存储在存储装置中的设备驱动程序。