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4 条记录 (耗时 0.015 秒)

    Non-lead glass
    1.
    发明授权
    Non-lead glass 有权
    非铅玻璃

    公开(公告)号：US08178453B2

    公开(公告)日：2012-05-15

    申请号：US12695187

    申请日：2010-01-28

    申请人： Masamichi Tanida ,  Yuki Yokoyama ,  Shinji Honda

    发明人： Masamichi Tanida ,  Yuki Yokoyama ,  Shinji Honda

    IPC分类号： C03C3/062 ,  C03C8/02 ,  C03C8/24

    CPC分类号： H01M8/0282 ,  C03C3/087 ,  C03C3/093 ,  C03C8/04 ,  C03C8/24 ,  H01M8/1231

    摘要： To provide a glass containing little B2O3, whereby when its powder is fired, its thermal expansion curve does not have an inflection point, a non-lead glass is provided containing, as represented by mol % based on the following oxides, from 35 to 41.5% of SiO2, from 8 to 25% of MgO, more than 27 to 35% of CaO, from 0 to 2% of SrO, from 0 to 4% of BaO, from 5 to 15% of ZnO and from 4.5 to 10% of Al2O3, wherein the total content of these components is at least 97%, and when SrO and BaO are contained, the total content of SrO and BaO is at most 2%; as well as a non-lead glass containing, as represented by mol % based on the following oxides, from 39.5 to 41.5% of SiO2, from 10 to less than 13% of MgO, from 18 to 22% of CaO, more than 12 to 15% of SrO, from 0 to 1% of BaO, from 6 to 11% of ZnO and from 4.5 to 7% of Al2O3, wherein the total content of these components is at least 97%.

    摘要翻译： 为了提供含有少量B 2 O 3的玻璃，当其粉末烧成时，其热膨胀曲线不具有拐点，提供非铅玻璃，其以如下氧化物的摩尔％表示，为35〜41.5 SiO 2的％，MgO的8〜25％，CaO的27〜35％，SrO的0〜2％，BaO的0〜4％，ZnO的5〜15％，以及4.5〜10％ 的Al 2 O 3，其中这些成分的总含量为97％以上，当含有SrO和BaO时，SrO和BaO的总含量为2％以下。 以及由以下氧化物的摩尔％表示的非铅玻璃，SiO 2的39.5〜41.5％，MgO的10〜小于13％，CaO的18〜22％，超过12重量％ 至15％的SrO，0至1％的BaO，6至11％的ZnO和4.5至7％的Al 2 O 3，其中这些组分的总含量为至少97％。

    Integrated circuit packages
    4.
    发明授权
    Integrated circuit packages 失效

    公开(公告)号：US06469257B2

    公开(公告)日：2002-10-22

    申请号：US10026924

    申请日：2001-12-18

    申请人： Shinji Honda

    发明人： Shinji Honda

    IPC分类号： H05K109

    CPC分类号： H05K3/303 ,  G01R1/0483 ,  H01L2224/32225 ,  H01L2924/15311 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613

    摘要： An integrated circuit package is mounted on a socket pedestal. External terminals such as ball electrodes may be provided in an array on a mounting surface. Recessed sections can also be provided in the mounting surface in a peripheral section of a region where the external terminals are arranged. The recessed sections can be used for positioning. When the integrated circuit package is subject to an electrical characteristic test (or a burn-in test), the recessed sections can be coupled to protrusions provided on a side of a socket and positioned. As a result, the external terminals can be securely and accurately connected to socket terminals. Thus, integrated circuit packages are provided which have arrayed electrodes for face-down mounting, and which improves the connection accuracy with respect to a socket for conducting electrical characteristic tests.