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公开(公告)号：US07808107B2
公开(公告)日：2010-10-05
申请号：US12453383
申请日：2009-05-08
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H01L23/48
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
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公开(公告)号：US07982314B2
公开(公告)日：2011-07-19
申请号：US12805261
申请日：2010-07-21
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H01L23/48
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
摘要翻译： 构成电路的电路元件和布线以及与这种电路电连接的第一电极设置在半导体衬底的一个主表面上。 除了第一电极的表面上的开口之外，在电路上形成有机绝缘膜。 第一和第二外部连接电极设置在有机绝缘膜上。 用于将第一和第二外部连接电极和第一电极电连接的至少一个导电层被放置在有机绝缘膜上。
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公开(公告)号：US20100308458A1
公开(公告)日：2010-12-09
申请号：US12805261
申请日：2010-07-21
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H01L23/498
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
摘要翻译： 构成电路的电路元件和布线以及与这种电路电连接的第一电极设置在半导体衬底的一个主表面上。 除了第一电极的表面上的开口之外，在电路上形成有机绝缘膜。 第一和第二外部连接电极设置在有机绝缘膜上。 用于将第一和第二外部连接电极和第一电极电连接的至少一个导电层被放置在有机绝缘膜上。
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公开(公告)号：US07547971B2
公开(公告)日：2009-06-16
申请号：US11202352
申请日：2005-08-12
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H01L23/48
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
摘要翻译： 构成电路的电路元件和布线以及与这种电路电连接的第一电极设置在半导体衬底的一个主表面上。 除了第一电极的表面上的开口之外，在电路上形成有机绝缘膜。 第一和第二外部连接电极设置在有机绝缘膜上。 用于将第一和第二外部连接电极和第一电极电连接的至少一个导电层被放置在有机绝缘膜上。
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公开(公告)号：US20090219069A1
公开(公告)日：2009-09-03
申请号：US12453383
申请日：2009-05-08
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H03L7/06 , H01L23/498 , G06F1/04
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
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公开(公告)号：US20060006480A1
公开(公告)日：2006-01-12
申请号：US11202352
申请日：2005-08-12
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H01L29/76
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
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公开(公告)号：US06963136B2
公开(公告)日：2005-11-08
申请号：US10362661
申请日：2001-12-17
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H01L21/60 , H01L23/485 , H01L23/528 , H01L29/40
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
摘要翻译： 构成电路的电路元件和布线以及与这种电路电连接的第一电极设置在半导体衬底的一个主表面上。 除了第一电极的表面上的开口之外，在电路上形成有机绝缘膜。 第一和第二外部连接电极设置在有机绝缘膜上。 用于将第一和第二外部连接电极和第一电极电连接的至少一个导电层被放置在有机绝缘膜上。
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