Semiconductor device
    3.
    发明申请
    Semiconductor device 审中-公开
    半导体器件

    公开(公告)号:US20060145228A1

    公开(公告)日:2006-07-06

    申请号:US11311268

    申请日:2005-12-20

    IPC分类号: H01L29/94

    摘要: A semiconductor memory device comprising a semiconductor substrate, element isolating regions formed on the semiconductor substrate, an element forming region provided between the element isolating regions on the semiconductor substrate, the element forming region having a protruding portion, a transistor having a channel formed in the protruding portion of the element forming region, and a capacitor formed in or on the semiconductor substrate to be connected to the transistor, wherein the protruding portion in the element forming region includes first and second inclined and opposed planes arranged along a channel width direction of the transistor, and an upper plane provided between the first and second inclined planes.

    摘要翻译: 一种半导体存储器件,包括半导体衬底,形成在半导体衬底上的元件隔离区域,设置在半导体衬底上的元件隔离区域之间的元件形成区域,具有突出部分的元件形成区域, 所述元件形成区域的突出部分和形成在所述半导体衬底中或与所述晶体管连接的电容器,其中所述元件形成区域中的所述突出部分包括沿着所述晶体管的沟道宽度方向布置的第一和第二倾斜和相对的平面 晶体管,以及设置在第一和第二倾斜平面之间的上平面。

    Semiconductor device
    4.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US07391068B2

    公开(公告)日:2008-06-24

    申请号:US11442352

    申请日:2006-05-30

    IPC分类号: H01L29/00

    摘要: A semiconductor device comprising at least one FET formed on the semiconductor substrate, wherein the FET comprises a source region, a drain region, a channel region formed between the source and drain regions and including a plurality of projected epitaxial silicon regions arranged in a width direction of the channel region, each of the projected epitaxial silicon regions having a triangular ridge portion, a gate insulating film formed on the channel region, and a gate electrode formed on the gate insulating film.

    摘要翻译: 一种半导体器件,包括形成在所述半导体衬底上的至少一个FET,其中所述FET包括源极区,漏极区,形成在所述源极和漏极区之间的沟道区,并且包括沿宽度方向布置的多个投影外延硅区 的沟道区域,每个投影的外延硅区域具有三角形脊部分,形成在沟道区域上的栅极绝缘膜和形成在栅极绝缘膜上的栅电极。

    Semiconductor device
    5.
    发明申请
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US20060289905A1

    公开(公告)日:2006-12-28

    申请号:US11442352

    申请日:2006-05-30

    IPC分类号: H01L29/76

    摘要: A semiconductor device comprising at least one FET formed on the semiconductor substrate, wherein the FET comprises a source region, a drain region, a channel region formed between the source and drain regions and including a plurality of projected epitaxial silicon regions arranged in a width direction of the channel region, each of the projected epitaxial silicon regions having a triangular ridge portion, a gate insulating film formed on the channel region, and a gate electrode formed on the gate insulating film.

    摘要翻译: 一种半导体器件,包括形成在所述半导体衬底上的至少一个FET,其中所述FET包括源极区,漏极区,形成在所述源极和漏极区之间的沟道区,并且包括沿宽度方向布置的多个投影外延硅区 的沟道区域,每个投影的外延硅区域具有三角形脊部分,形成在沟道区域上的栅极绝缘膜和形成在栅极绝缘膜上的栅电极。

    Non-volatile semiconductor memory and method for controlling a non-volatile semiconductor memory
    8.
    发明申请
    Non-volatile semiconductor memory and method for controlling a non-volatile semiconductor memory 失效
    非挥发性半导体存储器和用于控制非易失性半导体存储器的方法

    公开(公告)号:US20060237706A1

    公开(公告)日:2006-10-26

    申请号:US11396507

    申请日:2006-04-05

    IPC分类号: H01L47/00

    摘要: A non-volatile semiconductor memory including a plurality of memory cell transistors, each of the plurality of memory cell transistors includes: a source region having a first conductivity type and in contact with a buried insulating layer on a supporting substrate; a drain-region having the first conductivity type and in contact with the buried insulating layer; and a channel region having the first conductivity type and provided between the source region and the drain region so as to contact the buried insulating layer, wherein a thickness of the channel region is more than one nm and not more than a value obtained by adding seven nm to a half value of a gate length of the memory cell transistor.

    摘要翻译: 一种包括多个存储单元晶体管的非易失性半导体存储器,所述多个存储单元晶体管中的每一个包括:具有第一导电类型并与支撑衬底上的埋置绝缘层接触的源极区; 具有第一导电类型并与埋入绝缘层接触的漏极区; 以及具有第一导电类型并且设置在源区和漏区之间以与掩埋绝缘层接触的沟道区,其中沟道区的厚度大于1nm且不大于通过将7 nm到存储单元晶体管的栅极长度的一半值。