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公开(公告)号：US07651940B2
公开(公告)日：2010-01-26
申请号：US10537286
申请日：2003-12-02
IPC分类号： H01L21/4763
CPC分类号： H05K3/4617 , H05K3/20 , H05K2203/0733 , H05K2203/1152 , H05K2203/1189
摘要： A conductor portion is formed on the surface of a support member. After the conductor portion is formed, a copper foil on which resin is attached is moved downward from above the conductor portion to pressurize the conductor portion while covering it. the copper foil with the resin is pressed to the height of the conductor potion while using the conductor portion as a stopper. Thus, it is possible to make the height of the insulating layer equal to the height of the conductor portion.
摘要翻译： 导体部分形成在支撑构件的表面上。 在导体部分形成之后，其上附着有树脂的铜箔从导体部分的上方向下移动，同时覆盖导体部分。 在使用导体部作为止动件的同时，将具有树脂的铜箔压到导体部分的高度。 因此，可以使绝缘层的高度等于导体部分的高度。
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公开(公告)号：US07543375B2
公开(公告)日：2009-06-09
申请号：US10549571
申请日：2004-03-18
IPC分类号： H01K3/10
CPC分类号： B23K26/382 , B23K26/389 , B23K26/40 , B23K2103/16 , B23K2103/42 , B23K2103/50 , H05K1/0366 , H05K3/0035 , H05K3/421 , H05K3/423 , H05K2201/0347 , H05K2201/0394 , H05K2203/0733 , H05K2203/1476 , Y10T29/49155 , Y10T29/49165
摘要： A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via hole formed through laser irradiation from the other surface side of the base material; a first plating layer formed by using the conductor layer as an electrode so as to cover the core material, which is exposed on an inner wall surface of the via hole; an electroless plating layer which is formed on the upper side of the first plating layer and which is in close contact with the inner wall surface of the via hole; and a second plating layer formed by using the conductor layer as an electrode so as to cover the electroless plating layer. A conductor part is formed in the via hole.
摘要翻译： 一种电子部件的制造方法电子部件包括：配置有芯材的基材，在其至少一个面上具有导体层; 从基材的另一面侧通过激光照射形成的通孔; 通过使用导体层作为电极以覆盖露出在通孔的内壁表面上的芯材形成的第一镀层; 化学镀层，其形成在所述第一镀层的上侧，并且与所述通孔的内壁面紧密接触; 以及通过使用导体层作为电极以覆盖化学镀层而形成的第二镀层。 导体部分形成在通孔中。
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公开(公告)号：US20060086531A1
公开(公告)日：2006-04-27
申请号：US10540249
申请日：2003-12-17
CPC分类号： H05K3/4647 , H05K3/4652 , H05K2203/0733 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155
摘要： Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting portion penetrating the insulating layer. In the method, a first step of forming a wiring pattern and a columnar conductor and a second step of forming a layer having a uniform thickness by bonding an insulating sheet from above and pressing the insulating sheet to the height of the columnar conductor with the columnar conductor as a stopper so as to conform the thickness of the insulating sheet to the height of the columnar conductor are repeated.
摘要翻译： 提供一种制造具有多个布线图案的电子部件的方法和插入在布线图案之间的绝缘层，并且用于通过穿透绝缘层的层间连接部分在布线图案之间建立电连接。 在该方法中，形成布线图案和柱状导体的第一步骤和通过从上方粘合绝缘片而形成具有均匀厚度的层的第二步骤，并且用柱状物将绝缘片压制成柱状导体的高度 导体作为止动器，以使绝缘片的厚度与柱状导体的高度一致。
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公开(公告)号：US07237331B2
公开(公告)日：2007-07-03
申请号：US10540249
申请日：2003-12-17
IPC分类号： H05K3/36
CPC分类号： H05K3/4647 , H05K3/4652 , H05K2203/0733 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155
摘要： Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting portion penetrating the insulating layer. In the method, a first step of forming a wiring pattern and a columnar conductor and a second step of forming a layer having a uniform thickness by bonding an insulating sheet from above and pressing the insulating sheet to the height of the columnar conductor with the columnar conductor as a stopper so as to conform the thickness of the insulating sheet to the height of the columnar conductor are repeated.
摘要翻译： 提供一种制造具有多个布线图案的电子部件的方法和插入在布线图案之间的绝缘层，并且用于通过穿透绝缘层的层间连接部分在布线图案之间建立电连接。 在该方法中，形成布线图案和柱状导体的第一步骤和通过从上方粘合绝缘片而形成具有均匀厚度的层的第二步骤，并且用柱状物将绝缘片材压制成柱状导体的高度 导体作为止动器，以使绝缘片的厚度与柱状导体的高度一致。
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公开(公告)号：US20060223307A1
公开(公告)日：2006-10-05
申请号：US10549571
申请日：2004-03-18
IPC分类号： H01L21/4763
CPC分类号： B23K26/382 , B23K26/389 , B23K26/40 , B23K2103/16 , B23K2103/42 , B23K2103/50 , H05K1/0366 , H05K3/0035 , H05K3/421 , H05K3/423 , H05K2201/0347 , H05K2201/0394 , H05K2203/0733 , H05K2203/1476 , Y10T29/49155 , Y10T29/49165
摘要： Provided are a process for producing an electronic component which is superior in heat dissipation property, helps to achieve low resistivity, and makes it possible to prevent detachment of the conductor part from the base material, and an electronic component produced by such a process. The electronic component includes: a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via hole formed through laser irradiation from the other surface side of the base material; a first plating layer formed by using the conductor layer as an electrode so as to cover the core material, which is exposed on an inner wall surface of the via hole; an electroless plating layer which is formed on the upper side of the first plating layer and which is in close contact with the inner wall surface of the via hole; and a second plating layer formed by using the conductor layer as an electrode so as to cover the electroless plating layer. A conductor part is formed in the via hole by the first plating layer, the electroless plating layer, and the second plating layer.
摘要翻译： 提供了一种制造电子元件的方法，其具有优异的散热性能，有助于实现低电阻率，并且可以防止导体部件脱离基材，以及通过这种工艺制造的电子部件。 电子部件包括：配备有芯材料并在其至少一个表面上具有导体层的基材; 从基材的另一面侧通过激光照射形成的通孔; 通过使用导体层作为电极以覆盖露出在通孔的内壁表面上的芯材形成的第一镀层; 化学镀层，其形成在所述第一镀层的上侧，并且与所述通孔的内壁面紧密接触; 以及通过使用导体层作为电极以覆盖化学镀层而形成的第二镀层。 通过第一镀层，无电镀层和第二镀层在导通孔中形成导体部。
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公开(公告)号：US07987590B2
公开(公告)日：2011-08-02
申请号：US10546873
申请日：2004-02-26
IPC分类号： H01K3/22
CPC分类号： H05K3/4647 , H05K2203/066 , H05K2203/1189 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158
摘要： An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin having a uniform thickness with the height of the columnar conductor being a reference to cover the conductor portion. In such method for manufacturing an electronic part, a projecting portion is formed outside a part formation area. In this substrate sheet, the amount of the resin required for forming the layer is computed based on the proportion of the volume taken up by the conductor portion in a domain including the projecting portion, and the thickness of the insulating sheet is set in accordance with the computed resin amount.
摘要翻译： 包括树脂的绝缘片从上面附着到由布线图案和柱状导体构成的导体部分上。 然后使用柱状导体作为止动器将绝缘片施加压力和热量，以形成具有均匀厚度的树脂层，其中柱状导体的高度作为参考以覆盖导体部分。 在电子部件的制造方法中，在部件形成区域的外部形成突出部。 在该基板中，基于由导体部在包含突出部的区域中占据的体积的比例来计算形成层所需的树脂量，并且根据绝缘片的厚度设定绝缘片的厚度 计算树脂量。
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公开(公告)号：US20060258057A1
公开(公告)日：2006-11-16
申请号：US10546873
申请日：2004-02-26
IPC分类号： H01L21/00
CPC分类号： H05K3/4647 , H05K2203/066 , H05K2203/1189 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158
摘要： An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin having a uniform thickness with the height of the columnar conductor being a reference to cover the conductor portion. In such method for manufacturing an electronic part, a projecting portion is formed outside a part formation area. In this substrate sheet, the amount of the resin required for forming the layer is computed based on the proportion of the volume taken up by the conductor portion in a domain including the projecting portion, and the thickness of the insulating sheet is set in accordance with the computed resin amount.
摘要翻译： 包括树脂的绝缘片从上面附着到由布线图案和柱状导体构成的导体部分上。 然后使用柱状导体作为止动器将绝缘片施加压力和热量，以形成具有均匀厚度的树脂层，其中柱状导体的高度作为参考以覆盖导体部分。 在电子部件的制造方法中，在部件形成区域的外部形成突出部。 在该基板中，基于由导体部在包含突出部的区域中占据的体积的比例来计算形成层所需的树脂量，并且根据绝缘片的厚度设定绝缘片的厚度 计算树脂量。
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公开(公告)号：US20060057819A1
公开(公告)日：2006-03-16
申请号：US10537286
申请日：2003-12-02
IPC分类号： H01L21/46
CPC分类号： H05K3/4617 , H05K3/20 , H05K2203/0733 , H05K2203/1152 , H05K2203/1189
摘要： A conductor portion is formed on the surface of a support member. After the conductor portion is formed, a copper foil on which resin is attached is moved downward from above the conductor portion to pressurize the conductor portion while covering it. the copper foil with the resin is pressed to the height of the conductor potion while using the conductor portion as a stopper. Thus, it is possible to make the height of the insulating layer equal to the height of the conductor portion.
摘要翻译： 导体部分形成在支撑构件的表面上。 在导体部分形成之后，其上附着有树脂的铜箔从导体部分的上方向下移动，同时覆盖导体部分。 在使用导体部作为止动件的同时，将具有树脂的铜箔压到导体部分的高度。 因此，可以使绝缘层的高度等于导体部分的高度。
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公开(公告)号：US10023925B2
公开(公告)日：2018-07-17
申请号：US14112584
申请日：2012-05-11
申请人： Kaoru Kawasaki
发明人： Kaoru Kawasaki
IPC分类号： C21D1/18 , C21D6/00 , C22C38/02 , C22C38/04 , C22C38/06 , C21D7/13 , C21D9/00 , C21D9/46 , C21D1/673 , C22C38/00 , C22C38/20 , C22C38/22 , C22C38/24 , C22C38/26 , C22C38/28 , C22C38/32 , B21B27/06 , B21B37/74 , B21J1/06 , B21D22/02
摘要： A hot stamped article has a component composition containing, in terms of % by mass, 0.002% to 0.1% of C, 0.01% to 0.5% of Si, 0.5% to 2.5% of Mn+Cr, 0.1% or less of P, 0.01% or less of S, 0.05% or less of t-Al, 0.005% or less of N, and 0.0005% to 0.004% of B which is optionally contained in a case where the Mn+Cr is 1.0% or more, the remainder being Fe and unavoidable impurities. The hot stamped article has a microstructure composed of, in terms of an area ratio, 0% or more and less than 90% of martensite, 10% to 100% of bainite, and less than 0.5% of unavoidable inclusion structures, or a microstructure composed of, in terms of an area ratio, 99.5% to 100% of bainitic ferrite, and less than 0.5% of unavoidable inclusion structures.
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公开(公告)号：US08052807B2
公开(公告)日：2011-11-08
申请号：US12185423
申请日：2008-08-04
申请人： Naoki Yoshinaga , Nobuhiro Fujita , Manabu Takahashi , Koji Hashimoto , Shinya Sakamoto , Kaoru Kawasaki , Yasuhiro Shinohara , Takehide Senuma
发明人： Naoki Yoshinaga , Nobuhiro Fujita , Manabu Takahashi , Koji Hashimoto , Shinya Sakamoto , Kaoru Kawasaki , Yasuhiro Shinohara , Takehide Senuma
CPC分类号： C22C38/02 , C21D8/0226 , C21D8/0236 , C21D8/04 , C21D9/48 , C21D2211/002 , C21D2211/008 , C22C38/001 , C22C38/002 , C22C38/04 , C22C38/06 , C23C2/02 , C25D5/34
摘要： The present invention provides a steel sheet excellent in workability, which may be used for components of an automobile or the like, and a method for producing the same. More specifically, according to one exemplary embodiment of the present invention, a steel sheet excellent in workability, including in mass, 0.08 to 0.25% C, 0.001 to 1.5% Si, 0.01 to 2.0% Mn, 0.001 to 0.06% P, at most 0.05% S, 0.001 to 0.007% N, 0.008 to 0.2% Al, at least 0.01% Fe. The steel sheet having an average r-value of at least 1.2, an r-value in the rolling direction of at least 1.3, an r-value in the direction of 45 degrees to the rolling direction of at least 0.9, and an r-value in the direction of a right angle to the rolling direction of at least 1.2.
摘要翻译： 本发明提供可以用于汽车等的部件的加工性优异的钢板及其制造方法。 更具体地说，根据本发明的一个示例性实施方案，可加工性优异的钢板，包括：0.08〜0.25％的C，0.001〜1.5％的Si，0.01〜2.0％的Mn，0.001〜0.06％的P， 0.05％S，0.001至0.007％N，0.008至0.2％Al，至少0.01％Fe。 钢板的平均r值为1.2以上，轧制方向的r值为1.3以上，轧制方向为45度的r值为0.9以上，r- 在与滚动方向成直角的方向上的值至少为1.2。
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