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1.发明授权Crystalline resin cured product, crystalline resin composite material, and method for producing the same 失效结晶性树脂固化物，结晶性树脂复合材料及其制造方法公开(公告)号：US08546510B2
公开(公告)日：2013-10-01
申请号：US12312369
申请日：2007-11-08
CPC分类号： C08G59/245 , C08G59/5033 , C08G59/621 , C08G63/42
摘要： Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.
摘要翻译： 提供一种显示出高导热性，低热膨胀，高耐热性，低吸湿性和良好阻气性的结晶树脂固化产物和由其制备的结晶树脂复合材料。 另外提供了结晶性树脂固化物和结晶性树脂复合材料的制造方法。 结晶性树脂固化物通过芳香族二缩水甘油基化合物或二缩水甘油基树脂与芳香族二羟基化合物或二羟基树脂的反应而得到，并且在差热分析中显示出10J / g以上的熔融热，同时吸热 对应于熔化的峰出现在120〜320℃的范围内。结晶性树脂复合材料通过将结晶性树脂固化物与填料或基材结合而得到。 结晶性树脂固化物具有由-A-O-CH 2 -CH（OH）-CH 2 -O-B-表示的单元，其中A和B是二价芳族基团。
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2.发明申请CRYSTALLINE RESIN CURED PRODUCT, CRYSTALLINE RESIN COMPOSITE MATERIAL, AND METHOD FOR PRODUCING THE SAME 失效结晶树脂固化产品，结晶树脂复合材料及其制造方法公开(公告)号：US20100016473A1
公开(公告)日：2010-01-21
申请号：US12312369
申请日：2007-11-08
CPC分类号： C08G59/245 , C08G59/5033 , C08G59/621 , C08G63/42
摘要： Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.
摘要翻译： 提供一种显示出高导热性，低热膨胀，高耐热性，低吸湿性和良好阻气性的结晶树脂固化产物和由其制备的结晶树脂复合材料。 另外提供了结晶性树脂固化物和结晶性树脂复合材料的制造方法。 结晶性树脂固化物通过芳香族二缩水甘油基化合物或二缩水甘油基树脂与芳香族二羟基化合物或二羟基树脂的反应而得到，并且在差热分析中显示出10J / g以上的熔融热，同时吸热 对应于熔化的峰出现在120〜320℃的范围内。结晶性树脂复合材料通过将结晶性树脂固化物与填料或基材结合而得到。 结晶性树脂固化物具有由-A-O-CH 2 -CH（OH）-CH 2 -O-B-表示的单元，其中A和B是二价芳族基团。
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公开(公告)号：US20100016498A1
公开(公告)日：2010-01-21
申请号：US11919587
申请日：2006-05-08
申请人： Masashi Kaji , Koichiro Ogami , Kazuhiko Nakahara
发明人： Masashi Kaji , Koichiro Ogami , Kazuhiko Nakahara
IPC分类号： C08L63/00
CPC分类号： C08G59/245 , C08G59/621 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is an epoxy resin composition that cures with high thermal conductivity and low thermal expansion and is capable of dissipating heat efficiently and displaying good dimensional stability when applied to encapsulation of semiconductor devices or to printed wiring boards. The epoxy resin composition is formulated from epoxy resins 50 wt % or more of which is a diphenyl ether type epoxy resin represented by the following general formula (1) (wherein n is a number of ≧0 and m is an integer of 1-3) and curing agents 20 wt % or more of which is a diphenyl ether type phenolic resin represented by the following general formula (2) (wherein n is a number of ≧0 and m is an integer of 1-3).
摘要翻译： 公开了一种环氧树脂组合物，其具有高导热性和低热膨胀性，并且当应用于半导体器件或印刷线路板的封装时，能够有效地散热并显示良好的尺寸稳定性。 环氧树脂组合物由50重量％以上的环氧树脂配制，其为由以下通式（1）表示的二苯醚型环氧树脂（其中n为≥0的数，m为1- 3）和20重量％以上的固化剂，其为由以下通式（2）表示的二苯醚型酚醛树脂（其中n为≥0的数，m为1-3的整数）。
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4.发明授权公开(公告)号：US08268940B2
公开(公告)日：2012-09-18
申请号：US12530152
申请日：2008-03-06
申请人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
发明人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
CPC分类号： C08G59/4284 , C08G59/04 , C08G59/245 , C08G73/106 , C08L63/00 , C08L2666/14 , C08L2666/22 , C09J163/00 , C09J179/08 , C09J183/10 , H05K3/386 , H05K2201/0162
摘要： Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.
摘要翻译： 公开了一种无卤阻燃粘合树脂组合物，其可用于250℃以下的被粘物的热接触粘合，耐热性，吸湿后的耐焊锡性，加工性优异。 还公开了由所述组合物制备的粘合膜。 阻燃性粘合剂树脂组合物包含65-98重量％的含硅氧烷单元的聚酰亚胺树脂和2-35重量％的具有苊烯取代的萘骨架的环氧树脂。 由阻燃粘合树脂组合物制成的粘合膜适用于多层印刷电路板基板，混合电路板基板用粘合剂和覆盖膜用粘合剂的粘合剂。
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5.发明申请公开(公告)号：US20100063217A1
公开(公告)日：2010-03-11
申请号：US12530152
申请日：2008-03-06
申请人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
发明人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
IPC分类号： C09J139/00
CPC分类号： C08G59/4284 , C08G59/04 , C08G59/245 , C08G73/106 , C08L63/00 , C08L2666/14 , C08L2666/22 , C09J163/00 , C09J179/08 , C09J183/10 , H05K3/386 , H05K2201/0162
摘要： Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.
摘要翻译： 公开了一种无卤阻燃粘合树脂组合物，其可用于250℃以下的被粘物的热接触粘合，耐热性，吸湿后的耐焊锡性，加工性优异。 还公开了由所述组合物制备的粘合膜。 阻燃性粘合剂树脂组合物包含65-98重量％的含硅氧烷单元的聚酰亚胺树脂和2-35重量％的具有苊烯取代的萘骨架的环氧树脂。 由阻燃粘合树脂组合物制成的粘合膜适用于多层印刷电路板基板，混合电路板基板用粘合剂和覆盖膜用粘合剂的粘合剂。
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公开(公告)号：US5834570A
公开(公告)日：1998-11-10
申请号：US917745
申请日：1997-08-27
IPC分类号： C08G59/24 , C08F283/00
CPC分类号： C08G59/245
摘要： An epoxy resin composition of this invention is obtained by solidifying epoxy resins represented by the following general formula (1) (wherein G is glycidyl group and R.sup.1 to R.sup.8 are hydrogen atoms, halogen atoms or hydrocarbon groups with 1 to 6 carbon atoms, and n is an integer of 0 to 10) by crystallization and adding epoxy resin curing agents to the resulting solid. It shows good flow and low moisture absorption, cures with excellent heat resistance at soldering temperature and is useful for a variety of applications, in particular, for encapsulating semiconductor devices. ##STR1##
摘要翻译： 本发明的环氧树脂组合物是将下述通式（1）表示的环氧树脂（其中，G为缩水甘油基，R1〜R8为氢原子，卤素原子或碳原子数为1〜6的烃基）和n 为0〜10的整数），并向所得固体添加环氧树脂固化剂。 它表现出良好的流动性和低吸湿性，在焊接温度下具有优异的耐热性，并且可用于各种应用，特别是用于封装半导体器件。
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7.发明授权公开(公告)号：US07892312B2
公开(公告)日：2011-02-22
申请号：US11498961
申请日：2006-08-04
申请人： Guntur V. Subbarao , Kazuhiko Nakahara , Takayuki Ishikawa , Osamu Ito , Hiroshi Ono , Mayumi Kameyama , Mitsuru Yoshida , Marco Rondon , Idupulapati Madhusudana Rao , Carlos Lascano , Manabu Ishitani
发明人： Guntur V. Subbarao , Kazuhiko Nakahara , Takayuki Ishikawa , Osamu Ito , Hiroshi Ono , Mayumi Kameyama , Mitsuru Yoshida , Marco Rondon , Idupulapati Madhusudana Rao , Carlos Lascano , Manabu Ishitani
IPC分类号： C05D9/02
CPC分类号： C05G3/08 , C05F11/00 , Y02P60/218
摘要： A nitrification inhibitor and a soil improver and a fertilizer containing the same are offered which can be utilized in a wide area from a tropical to a temperate zone, and can be easily obtained from natural origin materials. It is a nitrification inhibitor to inhibit soil nitrification, containing as a main component either one of linoleic acid, α-linolenic acid, γ-linolenic acid, and methyl linoleate, or their mixture of two or more. By incorporating this nitrification inhibitor into a soil improver or a fertilizer, nitrification of soil can be effectively inhibited.
摘要翻译： 提供了一种硝化抑制剂和土壤改良剂以及含有该化合物的肥料，可用于从热带到温带的广泛区域，并且可以容易地从天然来源材料获得。 它是抑制土壤硝化的硝化抑制剂，它含有亚油酸，α-亚麻酸，γ-亚麻酸，亚油酸甲酯中的一种或两种以上的混合物作为主要成分。 通过将这种硝化抑制剂掺入土壤改良剂或肥料中，可以有效地抑制土壤的硝化作用。
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公开(公告)号：US5032806A
公开(公告)日：1991-07-16
申请号：US496912
申请日：1990-03-21
申请人： Kazuhiko Nakahara
发明人： Kazuhiko Nakahara
IPC分类号： H01P1/185
CPC分类号： H01P1/185
摘要： A loaded line phase shifter using striplines diposed on a semiconductor substrate includes a main stripline having an electrical length of one-half wavelength, loaded striplines connected to respective ends of the main stripline, a field effect transistor having its source electrode and its drain electrode connected to the respective load lines, a bias circuit connected to the gate electrode of the field effect transistor for controlling the bias voltage applied to the gate electrode, and a resonant stripline connected between the source electrode and the drain electrode.
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9.发明申请Mounting Condition Determining Method, Mounting Condition Determining Device, and Mounter 审中-公开安装条件确定方法，安装条件确定装置和贴片机公开(公告)号：US20070293969A1
公开(公告)日：2007-12-20
申请号：US11664417
申请日：2006-02-08
申请人： Wataru Hirai , Yasuhiro Maenishi , Hiroaki Kurata , Chikashi Konishi , Kazuhiko Nakahara , Masakatsu Fujita , Takuya Yamazaki , Takaaki Yokoi
发明人： Wataru Hirai , Yasuhiro Maenishi , Hiroaki Kurata , Chikashi Konishi , Kazuhiko Nakahara , Masakatsu Fujita , Takuya Yamazaki , Takaaki Yokoi
CPC分类号： H05K13/0885 , H05K13/085
摘要： According to the present invention, mounting conditions are determined to become closer to a setting value of a parameter regarding electricity consumption. The present invention provides a method of determining mounting conditions under which a piece of equipment mounts a component onto a substrate. The method includes: obtaining a setting value of a parameter regarding electricity consumption required to mount the component; obtaining an actual value of the parameter based on current mounting conditions; and determining new mounting conditions based on a result of comparing the setting value with the actual value.
摘要翻译： 根据本发明，确定安装条件更接近关于电力消耗的参数的设定值。 本发明提供了一种确定安装条件的方法，在该条件下，一件设备将部件安装到基板上。 该方法包括：获得关于安装部件所需的关于电力消耗的参数的设定值; 基于当前安装条件获取参数的实际值; 以及基于将设定值与实际值进行比较的结果来确定新的安装条件。
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公开(公告)号：US5502421A
公开(公告)日：1996-03-26
申请号：US409043
申请日：1995-03-23
申请人： Kazuhiko Nakahara
发明人： Kazuhiko Nakahara
CPC分类号： H03H11/245
摘要： A variable attenuation microwave attenuator includes input and output terminals, a high-pass filter having an electrical length of 90.degree. and transmitting signals with frequencies higher than a cut-off frequency, a first variable resistor connected between the input terminal and an input end of the high-pass filter, and a second variable resistor connected between an output end of the high-pass filter and the output terminal, wherein input signals applied to the input terminal are attenuated by the first and second variable resistors before and after the high-pass filter. Therefore, the variable attenuator can be a lumped parameter circuit, i.e., the high-pass filter including two inductors and a capacitor, without using a transmission line as in the prior art device, so that the size of the device is significantly reduced. Further, since the resistance values of the first and second variable resistors do not change discretely but change continuously, a lot of different values of attenuation can be obtained with high precision. As a result, the gain (attenuation amount) can be controlled with high precision.
摘要翻译： 可变衰减微波衰减器包括输入和输出端子，电气长度为90度的高通滤波器和传输频率高于截止频率的信号;第一可变电阻器，连接在输入端子和输入端子的输入端之间 高通滤波器和连接在高通滤波器的输出端和输出端之间的第二可变电阻器，其中施加到输入端子的输入信号由高频滤波器之前和之后的第一和第二可变电阻器衰减， 通过滤波器。 因此，可变衰减器可以是集中参数电路，即包括两个电感器和电容器的高通滤波器，而不使用如现有技术的器件中的传输线，使得器件的尺寸显着降低。 此外，由于第一和第二可变电阻器的电阻值不是离散地改变而是连续变化，所以可以以高精度获得大量不同的衰减值。 结果，可以高精度地控制增益（衰减量）。
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