公开(公告)号：US08017876B2

公开(公告)日：2011-09-13

申请号：US11571821

申请日：2005-07-08

申请人： Masateru Ichikawa ,  Kunihiro Naoe ,  Shoji Ajimura

发明人： Masateru Ichikawa ,  Kunihiro Naoe ,  Shoji Ajimura

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K3/244 ,  C25D3/30 ,  C25D5/50 ,  C25D7/00 ,  H01L2924/0002 ,  H05K1/118 ,  H05K2203/1105 ,  Y10T29/49147 ,  H01L2924/00

摘要： In a terminal portion having a copper or a copper alloy wiring according to one embodiment, the terminal portion being of a flexible print circuit board or a flexible flat cable and for connecter-fitting to a connector by being pressed by a connector pin, the copper or the copper alloy wiring having a pure tin or a lead-free tin alloy plating layer formed thereon is thermally treated so as to form an inter-metal compound including copper and tin on the copper or the copper alloy wiring, and a remaining thickness of the pure tin or the lead-free tin alloy plating layer is from 0.2 μm to 1.6 μm, wherein as an initial plating layer, a thickness of the pure tin or the lead-free tin alloy plating layer formed on the copper or the copper alloy wiring is from 1.5 μm to 5.0 μm, and a thickness of the inter-metal compound including copper and tin is from 0.1 μm to 3.5 μm.

摘要翻译： 在根据一个实施例的具有铜或铜合金布线的端子部分中，端子部分是柔性印刷电路板或柔性扁平电缆，并且通过被连接器针按压而连接到连接器，铜 或者在其上形成有纯锡或无铅锡合金镀层的铜合金布线进行热处理，以在铜或铜合金布线上形成包含铜和锡的金属间化合物，并且剩余的厚度 纯锡或无铅锡合金镀层为0.2μm〜1.6μm，作为初始镀层，形成在铜或铜合金上的纯锡或无铅锡合金镀层的厚度 布线为1.5μm〜5.0μm，包含铜和锡的金属间化合物的厚度为0.1μm〜3.5μm。

公开(公告)号：US20070256856A1

公开(公告)日：2007-11-08

申请号：US11571821

申请日：2005-07-08

申请人： Masateru Ichikawa ,  Kunihiro Naoe ,  Shoji Ajimura

发明人： Masateru Ichikawa ,  Kunihiro Naoe ,  Shoji Ajimura

IPC分类号： H05K1/09

CPC分类号： H05K3/244 ,  C25D3/30 ,  C25D5/50 ,  C25D7/00 ,  H01L2924/0002 ,  H05K1/118 ,  H05K2203/1105 ,  Y10T29/49147 ,  H01L2924/00

摘要： In a terminal portion according to one embodiment of the present invention, the terminal portion being of a flexible print circuit board or a flexible flat cable and for connecter-fitting, a copper or a copper alloy wiring having a pure tin or a tin alloy plating layer formed thereon is thermally treated so as to form an inter-metal compound including copper and tin on the copper or the copper alloy wiring, and that a remaining thickness of the pure tin or the tin alloy plating layer is from 0.2 μm to 1.6 μm.

摘要翻译： 在根据本发明的一个实施例的端子部分中，端子部分是柔性印刷电路板或柔性扁平电缆，并用于连接器，具有纯锡或锡合金电镀的铜或铜合金布线 在其上形成的层被热处理以在铜或铜合金布线上形成包括铜和锡的金属间化合物，并且纯锡或锡合金镀层的剩余厚度为0.2μm至1.6μm 。

公开(公告)号：US08199516B2

公开(公告)日：2012-06-12

申请号：US12411035

申请日：2009-03-25

申请人： Yuu Ishii ,  Kunihiro Naoe

发明人： Yuu Ishii ,  Kunihiro Naoe

IPC分类号： H05K7/10

CPC分类号： H05K3/4046 ,  H01L2224/16225 ,  H01R12/52 ,  H01R13/24 ,  H05K1/0313 ,  H05K1/036 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/09081 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2201/10416 ,  H05K2201/10734 ,  H05K2203/063 ,  Y10T29/49124

摘要： An electronic component mounting board, including: a substrate base made of a flat-plate-like elastic body, the substrate base having a plurality of through-holes in a manner spaced a predetermined distance apart from each other; conductive members, each of which has a main unit portion filled in the through-hole, the main unit portion having a first protrusion portion and a second protrusion portion respectively on a first end and a second end thereof, with the first protrusion portion arranged so as to protrude from a first surface of the substrate base and the second protrusion portion arranged so as to protrude from a second surface of the substrate base; a flexible substrate that is arranged on the first surface of the substrate base and that has first opening portions for penetration of the first protrusion portions; and a plurality of oval electrodes arranged on the substrate, each of which has a second opening portion for penetration of the first protrusion portion, in which the electrodes are arranged in a manner spaced apart from each other, and each of the second opening portions is formed on a first end side of each of the electrodes.

摘要翻译： 一种电子部件安装板，包括：由平板状弹性体制成的基板基板，所述基板基部具有彼此隔开预定距离的多个通孔; 导电构件，每个导电构件具有填充在通孔中的主单元部分，主单元部分分别在第一端部和第二端部上分别具有第一突出部分和第二突出部分，第一突出部分布置成 从基板基板的第一表面突出并且第二突出部分布置成从基板基底的第二表面突出; 柔性基板，布置在基板基体的第一表面上，并且具有用于使第一突出部分穿透的第一开口部分; 以及布置在所述基板上的多个椭圆形电极，每个所述椭圆形电极具有用于使所述第一突起部分穿透的第二开口部分，其中所述电极以彼此间隔开的方式布置，并且每个所述第二开口部分 形成在每个电极的第一端侧。

公开(公告)号：US20090236123A1

公开(公告)日：2009-09-24

申请号：US12409350

申请日：2009-03-23

申请人： Yoshiyasu Isobe ,  Kunihiro Naoe

发明人： Yoshiyasu Isobe ,  Kunihiro Naoe

IPC分类号： H01B7/08 ,  B32B15/01 ,  H01B1/00

CPC分类号： H01B1/026 ,  Y10T428/12715

摘要： Disclosed is a plated flat conductor including a flat conductor of copper or a copper alloy and a plated layer formed on a surface of the flat conductor. The plated layer includes a first intermetallic compound layer of Cu3Sn disposed on the surface of the flat conductor, a second intermetallic compound layer of Cu6Sn5 formed on the first intermetallic compound, and a superficial layer formed on the second intermetallic compound layer. The superficial layer is plating material of pure tin or a tin alloy and has an average thickness from about 0.3 μm to 1.0 μm and a maximum thickness of about 1.0 μm or less. A volume ratio of the second intermetallic compound layer to the first intermetallic compound layer is about 1.5 or more.

摘要翻译： 公开了一种电镀扁平导体，其包括铜或铜合金的扁平导体和形成在扁平导体的表面上的镀层。 镀层包括设置在扁平导体表面上的Cu 3 Sn的第一金属间化合物层，形成在第一金属间化合物上的Cu 6 Sn 5的第二金属间化合物层和形成在第二金属间化合物层上的表面层。 表层是纯锡或锡合金的电镀材料，平均厚度为约0.3μm至1.0μm，最大厚度为约1.0μm或更小。 第二金属间化合物层与第一金属间化合物层的体积比为约1.5以上。

公开(公告)号：US20090242242A1

公开(公告)日：2009-10-01

申请号：US12411035

申请日：2009-03-25

申请人： Yuu ISHII ,  Kunihiro Naoe

发明人： Yuu ISHII ,  Kunihiro Naoe

IPC分类号： H05K1/02 ,  H05K3/00

CPC分类号： H05K3/4046 ,  H01L2224/16225 ,  H01R12/52 ,  H01R13/24 ,  H05K1/0313 ,  H05K1/036 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/09081 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2201/10416 ,  H05K2201/10734 ,  H05K2203/063 ,  Y10T29/49124

摘要： An electronic component mounting board, including: a substrate base made of a flat-plate-like elastic body, the substrate base having a plurality of through-holes in a manner spaced a predetermined distance apart from each other; conductive members, each of which has a main unit portion filled in the through-hole, the main unit portion having a first protrusion portion and a second protrusion portion respectively on a first end and a second end thereof, with the first protrusion portion arranged so as to protrude from a first surface of the substrate base and the second protrusion portion arranged so as to protrude from a second surface of the substrate base; a flexible substrate that is arranged on the first surface of the substrate base and that has first opening portions for penetration of the first protrusion portions; and a plurality of oval electrodes arranged on the substrate, each of which has a second opening portion for penetration of the first protrusion portion, in which the electrodes are arranged in a manner spaced apart from each other, and each of the second opening portions is formed on a first end side of each of the electrodes.

摘要翻译： 一种电子部件安装板，包括：由平板状弹性体制成的基板基板，所述基板基部具有彼此隔开预定距离的多个通孔; 导电构件，每个导电构件具有填充在通孔中的主单元部分，主单元部分分别在第一端部和第二端部上分别具有第一突出部分和第二突出部分，第一突出部分布置成 从基板基板的第一表面突出并且第二突出部分布置成从基板基底的第二表面突出; 柔性基板，布置在基板基体的第一表面上，并且具有用于使第一突出部分穿透的第一开口部分; 以及布置在所述基板上的多个椭圆形电极，每个所述椭圆形电极具有用于使所述第一突起部分穿透的第二开口部分，其中所述电极以彼此间隔开的方式布置，并且每个所述第二开口部分 形成在每个电极的第一端侧。

公开(公告)号：US07999187B2

公开(公告)日：2011-08-16

申请号：US12409350

申请日：2009-03-23

申请人： Yoshiyasu Isobe ,  Kunihiro Naoe

发明人： Yoshiyasu Isobe ,  Kunihiro Naoe

IPC分类号： H01B7/08

CPC分类号： H01B1/026 ,  Y10T428/12715

摘要： Disclosed is a plated flat conductor including a flat conductor of copper or a copper alloy and a plated layer formed on a surface of the flat conductor. The plated layer includes a first intermetallic compound layer of Cu3Sn disposed on the surface of the flat conductor, a second intermetallic compound layer of Cu6Sn5 formed on the first intermetallic compound, and a superficial layer formed on the second intermetallic compound layer. The superficial layer is plating material of pure tin or a tin alloy and has an average thickness from about 0.3 μm to 1.0 μm and a maximum thickness of about 1.0 μm or less. A volume ratio of the second intermetallic compound layer to the first intermetallic compound layer is about 1.5 or more.

摘要翻译： 公开了一种电镀扁平导体，其包括铜或铜合金的扁平导体和形成在扁平导体的表面上的镀层。 镀层包括设置在扁平导体表面上的Cu 3 Sn的第一金属间化合物层，形成在第一金属间化合物上的Cu 6 Sn 5的第二金属间化合物层和形成在第二金属间化合物层上的表面层。 表层是纯锡或锡合金的电镀材料，平均厚度为约0.3μm〜1.0μm，最大厚度为约1.0μm以下。 第二金属间化合物层与第一金属间化合物层的体积比为约1.5以上。