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公开(公告)号：US4937016A
公开(公告)日：1990-06-26
申请号：US304631
申请日：1989-02-01
摘要： A copper conductor composition comprising a copper powder, an inorganic oxide powder, a glass powder and an organic vehicle, said copper powder having an average particle size of 0.5 to 3 .mu.m, a tap density of 3.0 to 5.0 g/cm.sup.3, and an oxygen content of 0.05 to 0.15% by weight. Zinc oxide powder and, optionally, nickel powder are used as the inorganic oxide powder. The composition which contains the copper powder having such an oxygen content as low as 0.05 to 0.15% by weight, can provide copper conductors having excellent conductor properties such as solderability, adhesive strength and matching property to resistances.
摘要翻译： 一种铜导体组合物，其包含铜粉末，无机氧化物粉末，玻璃粉末和有机载体，所述铜粉末的平均粒径为0.5〜3μm，振实密度为3.0〜5.0g / cm 3， 氧含量为0.05〜0.15重量％。 使用氧化锌粉末和任选的镍粉末作为无机氧化物粉末。 含有低至0.05-0.15重量％的氧含量的铜粉末的组合物可以提供具有优异的导电性能的铜导体，例如可焊性，粘合强度和与电阻的匹配性能。
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公开(公告)号：US4865772A
公开(公告)日：1989-09-12
申请号：US271543
申请日：1988-11-15
申请人： Masatoshi Suehiro , Masashi Echigo , Yutaka Mitsune , Masami Sakuraba , Seiichi Nakatani , Tsutomu Nishimura
发明人： Masatoshi Suehiro , Masashi Echigo , Yutaka Mitsune , Masami Sakuraba , Seiichi Nakatani , Tsutomu Nishimura
摘要： A copper-containing thick film conductor composition comprising 55 to 95% by weight of an inorganic powder and 45 to 5% by weight of an organic medium, said inorganic powder comprising 100 parts by weight of a copper powder, 0.05 to 3 parts by weight of a zinc oxide powder, 1 to 7 parts by weight of a lead borate glass powder, 0.2 to 5 parts by weight of a borosilicate glass powder and 0 to 10 parts by weight of a copper snboxide powder having an average particle size of not more than 1.0 .mu.m. The composition of the present invention is excellent in solderability and adhesive strength to the substrate.
摘要翻译： 一种含有55〜95重量％的无机粉末和45〜5重量％的有机介质的含铜厚膜导体组合物，所述无机粉末含有100重量份的铜粉，0.05〜3重量份 的氧化锌粉末，1〜7重量份的硼酸铅玻璃粉末，0.2〜5重量份的硼硅酸盐玻璃粉末和0〜10重量份的平均粒径不大于的锡粉末粉末 超过1.0亩。 本发明的组合物对于基材的可焊性和粘合强度优异。
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公开(公告)号：US5035837A
公开(公告)日：1991-07-30
申请号：US544973
申请日：1990-06-28
CPC分类号： H05K1/092 , B22F1/0059 , C04B35/45 , C04B35/6365 , C22C32/0021 , H01B1/16
摘要： A copper paste composition for low temperature firing on a ceramic substrate is comprised of inorganic components and organic vehicle components. The inorganic components mainly consist of cooper powder, cuprous oxide powder, cupric oxide powder and glass powder. The mixing ratio off the inorganic components of this composition is 100 parts by weight of copper powder, about 10 to 15 parts by weight of cuprous oxide powder, about 12 to 17 parts by weight of cupric oxide powder, and about 7 to 12 parts by weight of glass powder. The mixing ratio of the inorganic components with the organic vehicle components is about 95 to 70 parts by weight of the organic vehicle components. Also the the average particle size of the copper powder is in a range of about 0.5 to 3 .mu.m and the oxygen content of the copper powder is about 0.05 to 0.15 weight percent.
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公开(公告)号：US4906404A
公开(公告)日：1990-03-06
申请号：US267592
申请日：1988-11-07
申请人： Masatoshi Suehiro , Masashi Echigo , Masami Sakuraba , Yutaka Mitsune , Seiichi Nakatani , Tsutomu Nishimura
发明人： Masatoshi Suehiro , Masashi Echigo , Masami Sakuraba , Yutaka Mitsune , Seiichi Nakatani , Tsutomu Nishimura
IPC分类号： H01B1/22 , H01L23/498 , H05K1/09
CPC分类号： H05K1/092 , H01B1/22 , H01L23/49883 , H01L2924/0002
摘要： A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.
摘要翻译： 具有改善的可焊性以及良好粘合性的铜导体组合物，其包含铜粉末，无机粘合剂和诸如W，Mo，Ti，Ta，Nb或Cr的金属的硼化物或硅化物。 即使组合物重复进行烧制操作，可焊性也保持在良好的水平。
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5.发明授权Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5977490A
公开(公告)日：1999-11-02
申请号：US780329
申请日：1997-01-08
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译： 用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂 含有2个以上环氧树脂的室温粘度为15Pa·sec以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000Pa·s以下，挥发量为2.0重量％以下 。 提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。 导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。 使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。 然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。
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公开(公告)号：US6080336A
公开(公告)日：2000-06-27
申请号：US330921
申请日：1999-06-11
CPC分类号： H05K1/095 , C08K9/02 , H01B1/22 , H05K3/4069
摘要： A conductive paste composition, which is superior in electrical connection reliability and has properties required for a via-filling conductive paste composition is disclosed. The via-filling conductive paste composition contains a solvent in an amount of not more than 5 parts by weight per 100 parts by weight of the total amount of components A to D:A: 86 to 95 parts by weight of silver-coated copper particles made by coating surfaces of copper particles having an average particle diameter of 1 to 10 .mu.m with silver, a proportion of silver to the total amount of copper particles and coated silver being from 0.5 to 20% by weight,B: 2 to 8 parts by weight of a liquid epoxy resin having two or more epoxy groups,C: 2 to 8 parts by weight of a resol-type phenol resin, andD: 0.5 to 5 parts by weight of a curing agent for an epoxy resin, wherein the composition has a viscosity not more than 1000 Pa.multidot.s.
摘要翻译： 公开了一种导电性糊剂组合物，其具有优异的电连接可靠性并且具有通孔填充导电糊组合物所需的性能。 通孔填充导电性糊剂组合物含有相对于成分A〜D的总量100重量份为5重量份以下的溶剂：A：86〜95重量份的银包覆铜粒子 通过用银涂覆平均粒径为1〜10μm的铜颗粒的表面而制得，银的总量相对于铜颗粒的总量为0.5〜20重量％，B：2〜8重量份 的具有两个或更多个环氧基的液体环氧树脂，C：2至8重量份的甲阶酚醛型酚醛树脂，D：0.5至5重量份的环氧树脂固化剂，其中 组合物的粘度不超过1000个百分点。
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7.发明授权Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5733467A
公开(公告)日：1998-03-31
申请号：US814026
申请日：1997-03-10
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 / g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译： 用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂 含有2个以上环氧树脂的室温粘度为15Pa·sec以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000Pa·s以下，挥发量为2.0重量％以下 。 提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。 导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。 使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。 然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。
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8.发明授权Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5914358A
公开(公告)日：1999-06-22
申请号：US649189
申请日：1996-05-17
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译： 用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂 含有2个以上环氧树脂的室温粘度为15Pa·s以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000帕秒以下，挥发量为2.0重量％以下。 提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。 导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。 使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。 然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。
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9.发明授权Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste 失效用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板
公开(公告)号：US5652042A
公开(公告)日：1997-07-29
申请号：US330733
申请日：1994-10-28
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译： 用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂 含有2个以上环氧树脂的室温粘度为15Pa·s以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000帕秒以下，挥发量为2.0重量％以下。 提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。 导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。 使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。 然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。
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