公开(公告)号：US4937016A

公开(公告)日：1990-06-26

申请号：US304631

申请日：1989-02-01

申请人： Masatoshi Suehiro ,  Masashi Echigo ,  Masami Sakuraba ,  Nobutoshi Kawamura

发明人： Masatoshi Suehiro ,  Masashi Echigo ,  Masami Sakuraba ,  Nobutoshi Kawamura

IPC分类号： H01B1/16 ,  H05K1/09

CPC分类号： H05K1/092 ,  H01B1/16

摘要： A copper conductor composition comprising a copper powder, an inorganic oxide powder, a glass powder and an organic vehicle, said copper powder having an average particle size of 0.5 to 3 .mu.m, a tap density of 3.0 to 5.0 g/cm.sup.3, and an oxygen content of 0.05 to 0.15% by weight. Zinc oxide powder and, optionally, nickel powder are used as the inorganic oxide powder. The composition which contains the copper powder having such an oxygen content as low as 0.05 to 0.15% by weight, can provide copper conductors having excellent conductor properties such as solderability, adhesive strength and matching property to resistances.

摘要翻译： 一种铜导体组合物，其包含铜粉末，无机氧化物粉末，玻璃粉末和有机载体，所述铜粉末的平均粒径为0.5〜3μm，振实密度为3.0〜5.0g / cm 3， 氧含量为0.05〜0.15重量％。 使用氧化锌粉末和任选的镍粉末作为无机氧化物粉末。 含有低至0.05-0.15重量％的氧含量的铜粉末的组合物可以提供具有优异的导电性能的铜导体，例如可焊性，粘合强度和与电阻的匹配性能。

公开(公告)号：US4865772A

公开(公告)日：1989-09-12

申请号：US271543

申请日：1988-11-15

申请人： Masatoshi Suehiro ,  Masashi Echigo ,  Yutaka Mitsune ,  Masami Sakuraba ,  Seiichi Nakatani ,  Tsutomu Nishimura

发明人： Masatoshi Suehiro ,  Masashi Echigo ,  Yutaka Mitsune ,  Masami Sakuraba ,  Seiichi Nakatani ,  Tsutomu Nishimura

IPC分类号： C04B41/88 ,  C23C24/08 ,  H01B1/16 ,  H05K1/09

CPC分类号： H05K1/092 ,  H01B1/16

摘要： A copper-containing thick film conductor composition comprising 55 to 95% by weight of an inorganic powder and 45 to 5% by weight of an organic medium, said inorganic powder comprising 100 parts by weight of a copper powder, 0.05 to 3 parts by weight of a zinc oxide powder, 1 to 7 parts by weight of a lead borate glass powder, 0.2 to 5 parts by weight of a borosilicate glass powder and 0 to 10 parts by weight of a copper snboxide powder having an average particle size of not more than 1.0 .mu.m. The composition of the present invention is excellent in solderability and adhesive strength to the substrate.

摘要翻译： 一种含有55〜95重量％的无机粉末和45〜5重量％的有机介质的含铜厚膜导体组合物，所述无机粉末含有100重量份的铜粉，0.05〜3重量份 的氧化锌粉末，1〜7重量份的硼酸铅玻璃粉末，0.2〜5重量份的硼硅酸盐玻璃粉末和0〜10重量份的平均粒径不大于的锡粉末粉末 超过1.0亩。 本发明的组合物对于基材的可焊性和粘合强度优异。

公开(公告)号：US5035837A

公开(公告)日：1991-07-30

申请号：US544973

申请日：1990-06-28

申请人： Shuji Saeki ,  Masatoshi Suehiro ,  Masashi Echigo ,  Susumu Okada ,  Masami Sakuraba

发明人： Shuji Saeki ,  Masatoshi Suehiro ,  Masashi Echigo ,  Susumu Okada ,  Masami Sakuraba

IPC分类号： C04B41/88 ,  B22F1/00 ,  C04B35/45 ,  C04B35/636 ,  C22C32/00 ,  H01B1/16 ,  H05K1/09

CPC分类号： H05K1/092 ,  B22F1/0059 ,  C04B35/45 ,  C04B35/6365 ,  C22C32/0021 ,  H01B1/16

摘要： A copper paste composition for low temperature firing on a ceramic substrate is comprised of inorganic components and organic vehicle components. The inorganic components mainly consist of cooper powder, cuprous oxide powder, cupric oxide powder and glass powder. The mixing ratio off the inorganic components of this composition is 100 parts by weight of copper powder, about 10 to 15 parts by weight of cuprous oxide powder, about 12 to 17 parts by weight of cupric oxide powder, and about 7 to 12 parts by weight of glass powder. The mixing ratio of the inorganic components with the organic vehicle components is about 95 to 70 parts by weight of the organic vehicle components. Also the the average particle size of the copper powder is in a range of about 0.5 to 3 .mu.m and the oxygen content of the copper powder is about 0.05 to 0.15 weight percent.

公开(公告)号：US4906404A

公开(公告)日：1990-03-06

申请号：US267592

申请日：1988-11-07

申请人： Masatoshi Suehiro ,  Masashi Echigo ,  Masami Sakuraba ,  Yutaka Mitsune ,  Seiichi Nakatani ,  Tsutomu Nishimura

发明人： Masatoshi Suehiro ,  Masashi Echigo ,  Masami Sakuraba ,  Yutaka Mitsune ,  Seiichi Nakatani ,  Tsutomu Nishimura

IPC分类号： H01B1/22 ,  H01L23/498 ,  H05K1/09

CPC分类号： H05K1/092 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002

摘要： A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.

摘要翻译： 具有改善的可焊性以及良好粘合性的铜导体组合物，其包含铜粉末，无机粘合剂和诸如W，Mo，Ti，Ta，Nb或Cr的金属的硼化物或硅化物。 即使组合物重复进行烧制操作，可焊性也保持在良好的水平。

公开(公告)号：US06183875B2

公开(公告)日：2001-02-06

申请号：US09178998

申请日：1998-10-26

申请人： Xiao-Shan Ning ,  Choju Nagata ,  Masami Sakuraba ,  Toshikazu Tanaka ,  Katsuaki Suganuma ,  Masami Kimura

发明人： Xiao-Shan Ning ,  Choju Nagata ,  Masami Sakuraba ,  Toshikazu Tanaka ,  Katsuaki Suganuma ,  Masami Kimura

IPC分类号： B32B704

CPC分类号： H05K3/0061 ,  C04B41/5155 ,  C04B41/81 ,  C04B41/88 ,  H01L21/4871 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  Y10T428/31678 ,  H01L2924/00

摘要： An electronic circuit substrate including an aluminum-ceramic composite material having an electronic circuit formed on aluminum or an aluminum alloy plate of the aluminum-ceramic composite material which is prepared directly solidifying molten aluminum or an aluminum alloy on at least a portion of a ceramic substrate.

摘要翻译： 一种电子电路基板，包括具有在铝上形成的电子电路的铝 - 陶瓷复合材料或所述铝 - 陶瓷复合材料的铝合金板，其在至少一部分陶瓷基板上直接固化熔融铝或铝合金 。

公开(公告)号：US06399019B1

公开(公告)日：2002-06-04

申请号：US09639835

申请日：2000-08-16

申请人： Masami Sakuraba ,  Masami Kimura ,  Masaya Takahara ,  Junji Nakamura

发明人： Masami Sakuraba ,  Masami Kimura ,  Masaya Takahara ,  Junji Nakamura

IPC分类号： C22C506

CPC分类号： H05K3/38 ,  B23K35/025 ,  B23K35/3006 ,  B32B18/00 ,  B32B2311/12 ,  B32B2315/02 ,  C04B35/10 ,  C04B35/581 ,  C04B35/584 ,  C04B35/6365 ,  C04B37/026 ,  C04B2235/3232 ,  C04B2235/404 ,  C04B2235/407 ,  C04B2237/125 ,  C04B2237/40 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/704 ,  C04B2237/706 ,  Y10S228/903 ,  Y10T29/49826 ,  Y10T29/49885 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/12597 ,  Y10T428/12611 ,  Y10T428/12896

摘要： A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centent comprises 90.0˜99.5% of an Ag powder, 0˜9.5% of a Cu powder and 0.5˜4.0% of an active metal powder, and 0.0˜0.9% of a titanium oxide powder if necessary.

摘要翻译： 通过使用通过将10-14重量份的载体添加到100重量份的粉末制备的糊状物中的钎焊材料将金属板接合到陶瓷基板来制造金属陶瓷复合材料替代物，其中固体 中心包括90.0〜99.5％的Ag粉末，0〜9.5％的Cu粉末和0.5〜4.0％的活性金属粉末，以及0.0〜0.9％的氧化钛粉末，如果需要的话。

公开(公告)号：US08852465B2

公开(公告)日：2014-10-07

申请号：US13057744

申请日：2009-07-07

申请人： Masashi Nakayama ,  Nobuo Ochiai ,  Takashi Hinotsu ,  Yutaka Nakayama ,  Masami Sakuraba ,  Wataru Fujimori

发明人： Masashi Nakayama ,  Nobuo Ochiai ,  Takashi Hinotsu ,  Yutaka Nakayama ,  Masami Sakuraba ,  Wataru Fujimori

IPC分类号： H01B1/22 ,  H01L31/18 ,  H01B1/12 ,  H01L31/0224 ,  H01L31/068 ,  H01L31/0216 ,  H05K1/09

CPC分类号： H01L31/022425 ,  H01B1/22 ,  H01L31/02168 ,  H01L31/068 ,  H01L31/18 ,  H05K1/092 ,  Y02E10/52 ,  Y02E10/547

摘要： In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.

摘要翻译： 为了提供一种不会增加用于形成太阳能电池器件的电极的接触电阻的导电膏，该导电膏的特征在于含有导电颗粒，有机粘合剂，溶剂，玻璃 玻璃料，以及包含碱土金属，低熔点金属或附着于低熔点金属的化合物的有机化合物。

公开(公告)号：US06221511B1

公开(公告)日：2001-04-24

申请号：US09036855

申请日：1998-03-09

申请人： Masami Sakuraba ,  Masami Kimura ,  Masaya Takahara ,  Junji Nakamura

发明人： Masami Sakuraba ,  Masami Kimura ,  Masaya Takahara ,  Junji Nakamura

IPC分类号： B32B1504

CPC分类号： H05K3/38 ,  B23K35/025 ,  B23K35/3006 ,  B32B18/00 ,  B32B2311/12 ,  B32B2315/02 ,  C04B35/10 ,  C04B35/581 ,  C04B35/584 ,  C04B35/6365 ,  C04B37/026 ,  C04B2235/3232 ,  C04B2235/404 ,  C04B2235/407 ,  C04B2237/125 ,  C04B2237/40 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/704 ,  C04B2237/706 ,  Y10S228/903 ,  Y10T29/49826 ,  Y10T29/49885 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/12597 ,  Y10T428/12611 ,  Y10T428/12896

摘要： In the present invention, a metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centent comprises 90.0˜99.5% of an Ag powder, 0˜9.5% of a Cu powder and 0.5˜4.0% of an active metal powder, and 0.0˜0.9% of a titanium oxide powder if necessary.

摘要翻译： 在本发明中，金属陶瓷复合替代品通过使用通过将10-14重量份的载体加入到100重量份的载体中而制备的糊状形式的钎焊材料将金属板接合到陶瓷基板来制造， 其中固体含量为90.0〜99.5％的Ag粉末，0〜9.5％的Cu粉末和0.5〜4.0％的活性金属粉末，以及0.0〜0.9％的氧化钛粉末。

公开(公告)号：US5955686A

公开(公告)日：1999-09-21

申请号：US850183

申请日：1997-05-02

申请人： Masami Sakuraba ,  Masami Kimura ,  Junji Nakamura ,  Takashi Ono

发明人： Masami Sakuraba ,  Masami Kimura ,  Junji Nakamura ,  Takashi Ono

IPC分类号： B23K35/30 ,  B23K35/32 ,  C04B37/02 ,  H05K1/03 ,  H05K3/38 ,  C22C5/06 ,  C22C5/00

CPC分类号： B23K35/3006 ,  C04B37/026 ,  H05K3/38 ,  B23K35/327 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/706 ,  C04B2237/86 ,  H05K1/0306

摘要： A brazing material having 0.25-0.9 wt % of titanium oxide added to a basic formula consisting of 60-94.25 wt % Ag, 5-30 wt % Cu and 0.5-4.5 wt % of an active metal is processed to form a paste, which is applied to an AlN substrate and overlaid with a copper plate and heat treated to form a joint between the AlN substrate and the copper plate. A resist is applied to the copper plate to form a circuit pattern, which is etched to form a metallized circuit, thereby producing a metal-ceramics composite substrate capable of operation on high electrical power. The substrate is improved in various characteristics of a power module device over the composite substrates produced by using the conventional brazing materials.

摘要翻译： 将具有0.25-0.9重量％氧化钛的钎焊材料加入到由60-94.25重量％Ag，5-30重量％Cu和0.5-4.5重量％活性金属组成的碱性配方中，形成糊状物 施加到AlN基板上并用铜板覆盖并进行热处理以在AlN基板和铜板之间形成接头。 将抗蚀剂施加到铜板上以形成电路图案，其被蚀刻以形成金属化电路，从而制造能够在高电功率下操作的金属陶瓷复合基板。 在通过使用常规钎焊材料制造的复合基底上的功率模块装置的各种特性中改善了基板。

公开(公告)号：US6054762A

公开(公告)日：2000-04-25

申请号：US917327

申请日：1997-08-25

申请人： Masami Sakuraba ,  Masami Kimura ,  Junji Nakamura ,  Masaya Takahara

发明人： Masami Sakuraba ,  Masami Kimura ,  Junji Nakamura ,  Masaya Takahara

IPC分类号： C04B37/02 ,  H01L23/12 ,  H01L23/13 ,  H01L23/15 ,  H01L23/373 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38 ,  H01L23/06 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L23/3735 ,  C04B37/026 ,  H01L23/13 ,  H01L23/15 ,  H05K1/0271 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/70 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K2201/09145 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K3/38

摘要： A paste of active metallic brazing material is applied to the entire surface of each side of aluminum nitride or alumina ceramic substrate 1; circuit forming copper plate 3 having a thickness of 0.3 mm is placed in contact with one surface of the substrate and a heat dissipating copper plate 4 having a thickness of 0.25 mm placed in contact with the other surface; the individual members are compressed together and heated at 850.degree. C. in a vacuum furnace to form a joint; an etching resist is applied to the circuit forming copper plate and etching is performed with an iron chloride solution to form a circuit pattern and the unwanted brazing material is removed from the marginal portions; a second resist layer is applied and etched with an iron chloride solution to form a second marginal step; a third resist layer is similarly applied and etched to form a third marginal step; the completed circuit board having three marginal steps of which the lowest one is solely or partly made of the brazing material can withstand 1,500 heat cycles, which is the result that has ben unattainable by the prior art. Having such high heat cycle characteristics, the circuit board is suitable for use as semiconductor substrate in automobiles, electric trains and other applications that require high output power.

摘要翻译： 在氮化铝或氧化铝陶瓷基板1的各侧的整个表面上涂敷活性金属钎料的糊状物， 将厚度为0.3mm的电路形成铜板3放置成与基板的一个表面接触，并且将厚度为0.25mm的散热铜板4放置成与另一个表面接触; 将各个构件压缩在一起，并在真空炉中在850℃下加热以形成接头; 将抗蚀剂施加到形成铜电路的电路上，用氯化铁溶液进行蚀刻以形成电路图案，并且从边缘部分去除不想要的钎焊材料; 施加第二抗蚀剂层并用氯化铁溶液蚀刻以形成第二边缘步骤; 类似地施加和蚀刻第三抗蚀剂层以形成第三边缘步骤; 完成的电路板具有三个边缘台阶，其中最低的一个仅由或部分由钎焊材料制成，可承受1500次热循环，这是现有技术无法实现的结果。 具有这样高的热循环特性，电路板适用于需要高输出功率的汽车，电动列车和其他应用中的半导体衬底。