Ferrite magnet powder bond magnet
    1.
    发明授权
    Ferrite magnet powder bond magnet 有权
    铁氧体磁铁粉末粘结磁铁

    公开(公告)号:US07384571B2

    公开(公告)日:2008-06-10

    申请号:US11702588

    申请日:2007-02-06

    IPC分类号: H01F1/113

    摘要: A ferrite magnetic powder for bond magnet that experiences only small decrease in coercivity when molded into a bond magnet is provided, which is a ferrite magnetic powder that includes an alkaline-earth metal constituent and exhibits a decrease in coercivity of not greater than 600 Oe when subjected to a prescribed molding test. The magnetic powder can be obtained by mixing a fine ferrite powder of an average particle diameter of greater than 0.50 to 1.0 μm and a coarse ferrite powder of an average particle diameter of greater than 2.50 to 5.0 μm at ratio to incorporate the fine powder at a content ratio of 15-40 wt %.

    摘要翻译: 提供了一种用于粘结磁体的铁氧体磁粉,其在模制成粘结磁体时仅具有小的矫顽力的降低,其是包含碱土金属组分的铁氧体磁性粉末,并且当矫顽力降低时,矫顽磁力降低不超过600Oe 进行规定的成型试验。 可以通过将平均粒径大于0.50〜1.0μm的细小铁氧体粉末和平均粒径大于2.50〜5.0μm的粗大铁素体粉末以比例混合,从而将微粉末 含量比为15-40重量%。

    Bond magnet and ferrite magnetic powder for bond magnet
    3.
    发明授权
    Bond magnet and ferrite magnetic powder for bond magnet 有权
    债券磁铁和铁氧体磁粉用于粘结磁铁

    公开(公告)号:US07255807B2

    公开(公告)日:2007-08-14

    申请号:US10829291

    申请日:2004-04-22

    IPC分类号: H01F1/113

    摘要: A ferrite magnetic powder for bond magnet that experiences only small decrease in coercivity when molded into a bond magnet is provided, which is a ferrite magnetic powder that includes an alkaline-earth metal constituent and exhibits a decrease in coercivity of not greater than 600 Oe when subjected to a prescribed molding test. The magnetic powder can be obtained by mixing a fine ferrite powder of an average particle diameter of greater than 0.50 to 1.0 μm and a coarse ferrite powder of an average particle diameter of greater than 2.50 to 5.0 μm at ratio to incorporate the fine powder at a content ratio of 15-40 wt %.

    摘要翻译: 提供了一种用于粘结磁体的铁氧体磁粉,其在模制成粘结磁体时仅具有小的矫顽力的降低,其是包含碱土金属组分的铁氧体磁性粉末,并且当矫顽力降低时,矫顽磁力降低不超过600Oe 进行规定的成型试验。 可以通过将平均粒径大于0.50〜1.0μm的细小铁氧体粉末和平均粒径大于2.50〜5.0μm的粗大铁素体粉末以比例混合,从而将微粉末 含量比为15-40重量%。

    Driving device for driving an open/close member
    6.
    发明授权
    Driving device for driving an open/close member 失效
    用于驱动开/关构件的驱动装置

    公开(公告)号:US07201430B2

    公开(公告)日:2007-04-10

    申请号:US11138283

    申请日:2005-05-27

    IPC分类号: B60J5/00

    摘要: A driving device for driving an open/close member that is designed to open and close an open portion of a body includes a driving source generating a driving force, a force transmission mechanism disposed between the driving source and the open/close member and serving for transmitting the driving force thereto, and a load regulator for interrupting the driving force transmission when an excessive force is applied to the force transmission mechanism from the open/close member.

    摘要翻译: 用于驱动设计成打开和关闭主体的开口部分的打开/关闭构件的驱动装置包括产生驱动力的驱动源,设置在驱动源和打开/关闭构件之间的力传递机构, 传递驱动力,以及负载调节器,用于当来自开/关构件的力传递机构施加过大的力时中断驱动力传递。

    Opening-closing device for an opening-closing member of a vehicle
    7.
    发明授权
    Opening-closing device for an opening-closing member of a vehicle 有权
    用于车辆的开闭构件的开闭装置

    公开(公告)号:US07140150B2

    公开(公告)日:2006-11-28

    申请号:US10829429

    申请日:2004-04-22

    IPC分类号: E05F11/24

    摘要: An opening-closing device includes a driving source, an opening-closing mechanism for opening and closing an opening-closing member provided at a vehicle body by operation of the driving source, and a clutch positioned between the driving source and the opening-closing mechanism and sifting an energization state can transmit a driving force of the driving source to the opening-closing mechanism and a non-energization state can not transmit the drive force. The clutch includes a drive portion and a driven portion. The drive portion and the driven portion contact each other by a first load which can transmit the driving force from the driving source to the opening-closing mechanism when the clutch is the energization state. The drive portion and the driven portion contact each other by a second load which can not transmits the driving force from the driving source to opening-closing mechanism when the clutch is the non-energization state.

    摘要翻译: 开闭装置包括驱动源,用于通过驱动源的操作来打开和关闭设置在车身上的开闭部件的开闭机构,以及位于驱动源和开闭机构之间的离合器 并且筛选通电状态可以将驱动源的驱动力传递到打开 - 关闭机构,并且非通电状态不能传递驱动力。 离合器包括驱动部和被驱动部。 驱动部分和从动部分通过第一负载彼此接触,当负载处于通电状态时,第一负载能够将驱动力传递到开闭机构。 驱动部分和被驱动部分通过第二负载彼此接触,当第二负载在离合器处于非通电状态时不能将驱动力传递到打开 - 关闭机构。

    Wafer polishing method
    8.
    发明授权
    Wafer polishing method 有权
    晶圆抛光方法

    公开(公告)号:US07014536B2

    公开(公告)日:2006-03-21

    申请号:US11000187

    申请日:2004-12-01

    申请人: Toshiyuki Sakai

    发明人: Toshiyuki Sakai

    IPC分类号: B24B1/00

    CPC分类号: B24B37/042

    摘要: A wafer polishing method which can prevent polishing swarfs from entering the gap between the periphery of a wafer and a protective tape when the back surface of the wafer is dry polished with a polishing pad after the protective tape is affixed onto the front surface of the wafer, the method comprising the steps of cutting an arcuate chamfered portion formed at the periphery of the wafer to form a precipice at the periphery of the wafer; affixing the protective tape onto the surface to be held on the chuck table of a polishing machine, of the wafer; and placing the wafer on the chuck table in such a manner that the side of the protective tape comes into contact with the chuck table to dry polish the surface of the wafer with a polishing means.

    摘要翻译: 一种晶片抛光方法,当将保护带固定在晶片的前表面上之后,当晶片的背面用抛光垫进行干式抛光时,能够防止抛光切屑进入晶片周边与保护带之间的间隙 所述方法包括以下步骤:切割形成在所述晶片周围的弧形倒角部分,以在所述晶片的周边形成悬臂; 将保护带固定在待保持在晶片的抛光机的卡盘台上的表面上; 并且将晶片放置在卡盘台上,使得保护带的一侧与卡盘台接触,以抛光装置对晶片的表面进行干式抛光。

    Wafer polishing method
    9.
    发明申请
    Wafer polishing method 有权
    晶圆抛光方法

    公开(公告)号:US20050118933A1

    公开(公告)日:2005-06-02

    申请号:US11000187

    申请日:2004-12-01

    申请人: Toshiyuki Sakai

    发明人: Toshiyuki Sakai

    IPC分类号: B24B37/30 H01L21/304 B24B1/00

    CPC分类号: B24B37/042

    摘要: A wafer polishing method which can prevent polishing swarfs from entering the gap between the periphery of a wafer and a protective tape when the back surface of the wafer is dry polished with a polishing pad after the protective tape is affixed onto the front surface of the wafer, the method comprising the steps of cutting an arcuate chamfered portion formed at the periphery of the wafer to form a precipice at the periphery of the wafer; affixing the protective tape onto the surface to be held on the chuck table of a polishing machine, of the wafer; and placing the wafer on the chuck table in such a manner that the side of the protective tape comes into contact with the chuck table to dry polish the surface of the wafer with a polishing means.

    摘要翻译: 一种晶片抛光方法,当将保护带固定在晶片的前表面上之后,当晶片的背面用抛光垫进行干式抛光时,能够防止抛光切屑进入晶片周边与保护带之间的间隙 所述方法包括以下步骤:切割形成在所述晶片周围的弧形倒角部分,以在所述晶片的周边形成悬臂; 将保护带固定在待保持在晶片的抛光机的卡盘台上的表面上; 并且将晶片放置在卡盘台上,使得保护带的一侧与卡盘台接触,以抛光装置对晶片的表面进行干式抛光。