Apparatus, systems, and methods for on-chip spectroscopy using optical switches

    公开(公告)号:US10852190B2

    公开(公告)日:2020-12-01

    申请号:US16506142

    申请日:2019-07-09

    Abstract: A spectrometer includes an interferometer having a first interference arm and a second interference arm to produce interference patterns from incident light. At least one of the interference arms includes a series of cascaded optical switches connected by two (or more) waveguides of different lengths. Each optical switch directs the incident light into one waveguide or another, thereby changing the optical path length difference between the first interference arm and the second interference arm. This approach can be extended to multi-mode incident light by placing parallel interferometers together, each of which performs spectroscopy of one single mode in the multi-mode incident light. To maintain the compactness of the spectrometer, adjacent interferometers can share one interference arm.

    Athermal Photonic Waveguide With Refractive Index Tuning
    5.
    发明申请
    Athermal Photonic Waveguide With Refractive Index Tuning 有权
    具有折射率调谐的热光子波导

    公开(公告)号:US20130243383A1

    公开(公告)日:2013-09-19

    申请号:US13763090

    申请日:2013-02-08

    CPC classification number: G02B6/03694 G02B6/02033 G02B6/122

    Abstract: In a photonic waveguide, there is provided an undercladding layer and a waveguide core, having a cross-sectional height and width, that is disposed on the undercladding layer. The waveguide core comprises a waveguide core material having a thermo-optic coefficient. A refractive index tuning cladding layer is disposed on top of the waveguide core. The refractive index tuning cladding layer comprises a refractive index tuning cladding material having an adjustable refractive index and an absorption length at a refractive index tuning radiation wavelength. A thermo-optic coefficient compensation cladding layer is disposed on top of the refractive index tuning cladding layer. The thermo-optic coefficient compensation cladding layer comprises a thermo-optic coefficient compensation material having a thermo-optic coefficient that is of opposite sign to the thermo-optic coefficient of the waveguide core material. The thermo-optic coefficient compensation cladding layer provides at least partial compensation for the waveguide core thermo-optic coefficient.

    Abstract translation: 在光子波导中,提供了具有横截面高度和宽度的下封层和波导芯,其设置在下封层上。 波导芯包括具有热光系数的波导芯材料。 折射率调谐包层设置在波导芯的顶部。 折射率调谐包层包括在折射率调谐辐射波长处具有可调折射率和吸收长度的折射率调谐包层材料。 热电系数补偿包层设置在折射率调谐包层的顶部。 热光系数补偿包层包括具有与波导芯材料的热光系数相反的热光系数的热光系数补偿材料。 热光系数补偿包层对波导芯热光系数提供至少部分补偿。

    Microscale photoacoustic spectroscopy, imaging, and microscopy

    公开(公告)号:US11378552B2

    公开(公告)日:2022-07-05

    申请号:US16893612

    申请日:2020-06-05

    Abstract: A microscale photoacoustic sensor uses the detection of ultrasound waves generated by a sample in response to incident light absorption to perform photoacoustic spectroscopy, imaging, and microscopy. The microscale photoacoustic sensor, including components to excite a sample and detect ultrasound waves, may be integrated onto a single chip. The microscale photoacoustic sensor may excite a sample using a metasurface collimator. The metasurface collimator includes an array of diffraction grooves to collimate an excitation beam uniformly out of the plane of the sensor to create a wide and homogeneous beam spot. The microscale photoacoustic sensor may detect ultrasound waves using an optical photoacoustic transducer. The optical photoacoustic transducer includes a resonator on a mechanical membrane to detect ultrasound waves with high sensitivity. The microscale photoacoustic sensor may be used in applications such as deep-tissue neural imaging or microfluidic biological screening.

    Simultaneous electrical and optical connections for flip chip assembly

    公开(公告)号:US11067754B2

    公开(公告)日:2021-07-20

    申请号:US16989448

    申请日:2020-08-10

    Abstract: Optical interconnects can offer higher bandwidth, lower power, lower cost, and higher latency than electrical interconnects alone. The optical interconnect system enables both optical and electrical interconnection, leverages existing fabrication processes to facilitate package-level integration, and delivers high alignment tolerance and low coupling losses. The optical interconnect system provides connections between a photonics integrated chip (PIC) and a chip carrier and between the chip carrier and external circuitry. The system provides a single flip chip interconnection between external circuitry and a chip carrier using a ball grid array (BGA) infrastructure. The system uses graded index (GRIN) lenses and cross-taper waveguide couplers to optically couple components, delivers coupling losses of less than 0.5 dB with an alignment tolerance of ±1 μm, and accommodates a 2.5× higher bandwidth density.

    Apparatus, systems, and methods for on-chip spectroscopy using optical switches

    公开(公告)号:US10386237B2

    公开(公告)日:2019-08-20

    申请号:US15986098

    申请日:2018-05-22

    Abstract: A spectrometer includes an interferometer having a first interference arm and a second interference arm to produce interference patterns from incident light. At least one of the interference arms includes a series of cascaded optical switches connected by two (or more) waveguides of different lengths. Each optical switch directs the incident light into one waveguide or another, thereby changing the optical path length difference between the first interference arm and the second interference arm. This approach can be extended to multi-mode incident light by placing parallel interferometers together, each of which performs spectroscopy of one single mode in the multi-mode incident light. To maintain the compactness of the spectrometer, adjacent interferometers can share one interference arm.

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