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公开(公告)号：US20190312355A1
公开(公告)日：2019-10-10
申请号：US15948355
申请日：2018-04-09
Applicant: Massachusetts Institute of Technology
Inventor： Glenn A. Brigham
Abstract: A coincident phase centered antenna and a mechanism for feeding electrical signals to the antenna is disclosed. Each of the four prongs is fed by a respective conductor. Each respective conductor is in electrical communication with a connector or trace located on the bottom surface of the base or supporting printed circuit board. This configuration allows independent signals to be supplied to each of the four prongs in the coincident phase centered antenna. In some embodiments, the prongs are mounted on a metal base. In other embodiments, the prongs are mounted on a printed circuit board.
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公开(公告)号：US20180048061A1
公开(公告)日：2018-02-15
申请号：US15648620
申请日：2017-07-13
Applicant: Massachusetts Institute Of Technology
Inventor： Glenn A. Brigham
CPC classification number: H01Q1/38 , H01Q1/48 , H01Q13/02 , H01Q13/0283 , H01Q13/085
Abstract: A novel system and method for creating a lightweight antenna is disclosed. Each lightweight antenna is formed using a foam material. This foam material is coated with a machinable material, which is machined to the desired dimensions. The machinable material is then plated with a metal. This creates a radiator that has the size and performance of traditional notch antennas, but weighs far less. This foam radiator may be mounted to a variety of substrate types, not limited to microwave laminate materials. Embodiments of mixed substrates or even multi-layered foam substrates are possible. The substrate may be a conventional printed circuit board (PCB), a PCB with sleeved coaxial vias, or a foam substrate. The lightweight antenna may be used in a plurality of applications, including ultra-wideband array systems and space-based applications.
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公开(公告)号：US10476154B2
公开(公告)日：2019-11-12
申请号：US15301585
申请日：2015-08-05
Applicant: Massachusetts Institute of Technology
Inventor： Jonathan Peter Doane , Glenn A. Brigham , Bradley T. Perry
Abstract: Described embodiments provide sidelobe cancellation for Simultaneous Transmit and Receive systems. The sidelobe cancellation system includes an array having a primary aperture and an auxiliary array. The auxiliary array includes a plurality of antenna elements disposed adjacent to at least one side of the primary aperture. Each element of the auxiliary array is coupled to a variable attenuator, a variable phase shifter or a variable true time delay unit. A controller tunes the auxiliary array to cancel sidelobes of the primary aperture by adaptively selecting an attenuation value of the variable attenuator, a phase shift value of the variable phase shifter and a time delay value of the variable true time delay unit for each element of the auxiliary array. The auxiliary array operates as an adaptive finite-impulse response (FIR) filter with each antenna element of the auxiliary array operating as an adaptive tap of the adaptive FIR filter.
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公开(公告)号：US20170034904A1
公开(公告)日：2017-02-02
申请号：US15302645
申请日：2015-04-09
Applicant: Massachusetts Institute Of Technology
Inventor： Glenn A. Brigham
CPC classification number: H05K1/0236 , H01Q15/0006 , H01Q15/141 , H05K1/115 , H05K1/165 , H05K1/181 , H05K3/4038 , H05K3/4697 , H05K2201/10098 , H05K2203/308
Abstract: An assembly that includes a printed circuit board having an air gap, and a method of fabricating the assembly is disclosed. The assembly includes at least one air gap. This air gap is created by using a soluble material during the PCB assembly process. The soluble material can preferably be processed in accordance with traditional PCB fabrication processes. For example, other materials can be bonded to the soluble material. Additionally, the soluble material is capable of withstanding a drilling process. After the PCB assembly is complete, the soluble material is then dissolved, leaving an air gap where the soluble material once existed. This assembly may be useful in configurations where an antenna, EBG material or other electronic structure is to be disposed above the top surface of the printed circuit board.
Abstract translation: 公开了一种包括具有气隙的印刷电路板的组件，以及制造该组件的方法。 组件包括至少一个气隙。 在PCB组装过程中通过使用可溶性材料产生这种气隙。 可溶性材料可以优选根据传统的PCB制造工艺进行加工。 例如，其它材料可以结合到可溶性材料上。 此外，可溶性材料能够承受钻孔过程。 在PCB组件完成之后，溶解的材料然后溶解，留下一旦存在可溶性材料的气隙。 该组件可用于将天线，EBG材料或其他电子结构设置在印刷电路板的顶表面上方的配置中。
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公开(公告)号：US20150014045A1
公开(公告)日：2015-01-15
申请号：US14306768
申请日：2014-06-17
Applicant: Massachusetts Institute of Technology
Inventor： Glenn A. Brigham , Richard J. Stanley , Bradley Thomas Perry , Patrick J. Bell
CPC classification number: H05K3/42 , H05K1/0222 , H05K1/115 , H05K1/116 , H05K3/0094 , H05K3/4685 , H05K2201/0959 , H05K2201/09745 , H05K2201/10242 , H05K2203/03 , H05K2203/0703 , H05K2203/30 , Y10T29/49123
Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.
Abstract translation: 公开了一种印刷电路板和一种制造印刷电路板的方法。 印刷电路板包括至少一个同轴通孔。 中空通孔设置在印刷电路板中。 围绕所述中空通孔的圆周形成金属套筒。 内部导电路径设置在中空通孔中。 此外，绝缘材料设置在导电路径和金属套筒之间的中空通孔中。 导电路径用于连接布置在印刷电路板的两个不同层上的信号迹线。 在一些实施例中，这些信号迹线承载频率高于1GHz的信号，尽管本公开不限于该实施例。
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Patent Agency Ranking
公开(公告)号：US10833423B2
公开(公告)日：2020-11-10
申请号：US16288986
申请日：2019-02-28
Applicant: Massachusetts Institute of Technology
Inventor： Glenn A. Brigham
Abstract: In this novel geometry, the 3D radiator unit cell has been designed with flat sided unit cells. Each 3D radiator unit cell incorporates a curf border of sacrificial material. This border permits independent sub-array size and shape. It also allows a gap between sub-arrays while retaining contiguous unit cell spacing giving flexibility to array size, shape and line replaceable unit capabilities.
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公开(公告)号：US10321557B2
公开(公告)日：2019-06-11
申请号：US15302645
申请日：2015-04-09
Applicant: Massachusetts Institute Of Technology
Inventor： Glenn A. Brigham
IPC: H01K3/10 , H05K1/02 , H01Q15/00 , H05K3/46 , H05K1/11 , H05K1/18 , H05K3/40 , H05K1/16 , H01Q15/14
Abstract: An assembly that includes a printed circuit board having an air gap, and a method of fabricating the assembly is disclosed. The assembly includes at least one air gap. This air gap is created by using a soluble material during the PCB assembly process. The soluble material can preferably be processed in accordance with traditional PCB fabrication processes. For example, other materials can be bonded to the soluble material. Additionally, the soluble material is capable of withstanding a drilling process. After the PCB assembly is complete, the soluble material is then dissolved, leaving an air gap where the soluble material once existed. This assembly may be useful in configurations where an antenna, EBG material or other electronic structure is to be disposed above the top surface of the printed circuit board.
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公开(公告)号：US10249943B2
公开(公告)日：2019-04-02
申请号：US15302638
申请日：2015-04-09
Applicant: Massachusetts Institute Of Technology
Inventor： Glenn A. Brigham
Abstract: An assembly that includes a printed circuit board and a foam dielectric material, and a method of fabricating the assembly is disclosed. The assembly includes at least one layer of a foam dielectric material, which has properties similar to those of air. This layer of foam dielectric material is disposed between a top sublaminate and a bottom sublaminate. The bottom sublaminate may be a traditional printed circuit board, comprising an arbitrary number of layers. The top sublaminate may be a single layer, or may be multiple layers and may include an antenna. The foam dielectric material serves to provide mechanical support for the top sublaminate and the central conductor. The foam dielectric material also provides physical separation between the bottom sublaminate and the antenna.
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公开(公告)号：US09635761B2
公开(公告)日：2017-04-25
申请号：US14306768
申请日：2014-06-17
Applicant: Massachusetts Institute of Technology
Inventor： Glenn A. Brigham , Richard J. Stanley , Bradley Thomas Perry , Patrick J. Bell
CPC classification number: H05K3/42 , H05K1/0222 , H05K1/115 , H05K1/116 , H05K3/0094 , H05K3/4685 , H05K2201/0959 , H05K2201/09745 , H05K2201/10242 , H05K2203/03 , H05K2203/0703 , H05K2203/30 , Y10T29/49123
Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.
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公开(公告)号：US20200028242A1
公开(公告)日：2020-01-23
申请号：US15439511
申请日：2017-02-22
Applicant: Massachusetts Institute Of Technology
Inventor： Glenn A. Brigham , David M. Bragdon , Edward M. Froehlich
Abstract: A novel system for supporting a plurality of notch antenna elements is disclosed. This system allows the creation of higher power ultra-wideband step notch arrays. The system also provides electrical connection to each of the notch antenna elements via respective coaxial cables or other direct connections. These coaxial cables connect to coaxial connectors disposed on a substrate that supports the notch antenna elements. Each coaxial connector is in electrical communication with one of the notch antenna elements. By replacing the printed circuit board traditionally used, higher power can be supplied to the notch antenna elements.
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