公开(公告)号：US20220187021A1

公开(公告)日：2022-06-16

申请号：US17546497

申请日：2021-12-09

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology Co., Ltd.

Inventor： Manuel Sohn ,  Alex Wansidler ,  Dieter Hezler ,  Joseph Cibere ,  Rolf Bremensdorfer ,  Martin Zucker ,  Pete Lembesis ,  Michael Yang

IPC: F27D3/16 ,  F27D21/00 ,  F27D1/00 ,  F27D21/02

Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.

公开(公告)号：US20170196046A1

公开(公告)日：2017-07-06

申请号：US15380139

申请日：2016-12-15

Applicant: Mattson Technology, Inc.

Inventor： Rolf Bremensdorfer ,  Dave Camm ,  Pete Lembesis ,  Joseph Cibere

IPC: H05B3/00 ,  H01J61/30 ,  H05B31/00 ,  H01L21/67

CPC classification number: H05B3/0047 ,  H01J61/0732 ,  H01J61/526 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67248 ,  H05B31/0057

Abstract: Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.

公开(公告)号：US12120780B2

公开(公告)日：2024-10-15

申请号：US17215369

申请日：2021-03-29

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology, Co. LTD

Inventor： Rolf Bremensdorfer ,  Dave Camm ,  Pete Lembesis ,  Joseph Cibere

IPC: H05B3/00 ,  H01J61/073 ,  H01J61/52 ,  H01L21/67 ,  H05B31/00

CPC classification number: H05B3/0047 ,  H01J61/0732 ,  H01J61/526 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67248 ,  H05B31/0057

Abstract: Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.

公开(公告)号：US20210307115A1

公开(公告)日：2021-09-30

申请号：US17215369

申请日：2021-03-29

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology, Co. LTD

Inventor： Rolf Bremensdorfer ,  Dave Camm ,  Pete Lembesis ,  Joseph Cibere

IPC: H05B3/00 ,  H01L21/67 ,  H01J61/52 ,  H01J61/073

Abstract: Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.

公开(公告)号：US20240055242A1

公开(公告)日：2024-02-15

申请号：US18494486

申请日：2023-10-25

Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. ,  Mattson Technology, Inc.

Inventor： Dixit Desai ,  Alex Wansidler ,  Dieter Hezler ,  Joseph Cibere ,  Rolf Bremensdorfer ,  Pete Lembesis ,  Michael Yang

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J37/32119 ,  H01J37/32449 ,  H01J37/32651 ,  H01J2237/20214

Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.

公开(公告)号：US11837447B2

公开(公告)日：2023-12-05

申请号：US17242383

申请日：2021-04-28

Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. ,  Mattson Technology, Inc.

Inventor： Dixit Desai ,  Alex Wansidler ,  Dieter Hezler ,  Joseph Cibere ,  Rolf Bremensdorfer ,  Pete Lembesis ,  Michael Yang

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J37/32119 ,  H01J37/32449 ,  H01J37/32651 ,  H01J2237/20214

Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.

公开(公告)号：US20220189747A1

公开(公告)日：2022-06-16

申请号：US17242383

申请日：2021-04-28

Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. ,  Mattson Technology, Inc.

Inventor： Dixit Desai ,  Alex Wansidler ,  Dieter Hezler ,  Joseph Cibere ,  Rolf Bremensdorfer ,  Pete Lembesis ,  Michael Yang

IPC: H01J37/32

Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.

公开(公告)号：US12183558B2

公开(公告)日：2024-12-31

申请号：US18494486

申请日：2023-10-25

Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. ,  Mattson Technology, Inc.

Inventor： Dixit Desai ,  Alex Wansidler ,  Dieter Hezler ,  Joseph Cibere ,  Rolf Bremensdorfer ,  Pete Lembesis ,  Michael Yang

IPC: H01J37/32

Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.

公开(公告)号：US10966286B2

公开(公告)日：2021-03-30

申请号：US15380139

申请日：2016-12-15

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology Co., Ltd.

Inventor： Rolf Bremensdorfer ,  Dave Camm ,  Pete Lembesis ,  Joseph Cibere

IPC: H05B3/00 ,  H01L21/67 ,  H01J61/52 ,  H01J61/073 ,  H05B31/00

Abstract: Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.

公开(公告)号：US20200161162A1

公开(公告)日：2020-05-21

申请号：US16667986

申请日：2019-10-30

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology, Co., LTD

Inventor： Michael X. Yang ,  Ryan M. Pakulski ,  Pete Lembesis

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677

Abstract: Systems and methods for processing workpieces, such as semiconductor workpieces are provided. In one example implementation, an apparatus includes a first processing chamber comprising a first processing station and a second processing station. The first processing station and the second processing station are separated by a first distance. The apparatus includes one or more second processing chambers. The one or more second processing chambers collectively comprising a third processing station and a fourth processing station. The third processing station and the fourth processing station are separated by a second distance. The second distance is different from the first distance. A workpiece handling robot is configured to pick up the at least one first workpiece and the at least one second workpiece from the first and second processing stations and to drop off the at least one first workpiece and the second workpiece at the third and fourth processing stations.