公开(公告)号：US20130161817A1

公开(公告)日：2013-06-27

申请号：US13690634

申请日：2012-11-30

申请人： Maxim Integrated Products, Inc.

发明人： Viren Khandekar ,  Karthik Thambidurai ,  Ahmad Ashrafzadeh ,  Amit Kelkar ,  Hien D. Nguyen

IPC分类号： H01L23/29 ,  H01L23/50 ,  H01L21/56

CPC分类号： H01L21/76877 ,  H01L21/56 ,  H01L21/561 ,  H01L23/28 ,  H01L23/29 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/50 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/02379 ,  H01L2224/03462 ,  H01L2224/0348 ,  H01L2224/03903 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05541 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/11422 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/05552

摘要： Semiconductor package device, such as wafer-level package semiconductor devices, are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to support the pillar.

摘要翻译： 描述了诸如晶片级封装半导体器件的半导体封装器件，其具有用于提供电互连性的柱。 在一个实现中，晶片级封装器件包括集成电路芯片，其具有形成在集成电路芯片上的至少一个柱。 支柱被配置为提供与集成电路芯片的电互连性。 晶片级封装器件还包括被配置为支撑柱的封装结构。

公开(公告)号：US08860222B2

公开(公告)日：2014-10-14

申请号：US13690634

申请日：2012-11-30

申请人： Maxim Integrated Products, Inc.

发明人： Viren Khandekar ,  Karthik Thambidurai ,  Ahmad Ashrafzadeh ,  Amit Kelkar ,  Hien D. Nguyen

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/50

CPC分类号： H01L21/76877 ,  H01L21/56 ,  H01L21/561 ,  H01L23/28 ,  H01L23/29 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/50 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/02379 ,  H01L2224/03462 ,  H01L2224/0348 ,  H01L2224/03903 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05541 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/11422 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/05552

摘要： Semiconductor package device, such as wafer-level package semiconductor devices, are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to support the pillar.

摘要翻译： 描述了诸如晶片级封装半导体器件的半导体封装器件，其具有用于提供电互连性的柱。 在一个实现中，晶片级封装器件包括集成电路芯片，其具有形成在集成电路芯片上的至少一个柱。 支柱被配置为提供与集成电路芯片的电互连性。 晶片级封装器件还包括被配置为支撑柱的封装结构。