摘要:
At least two separate single-crystal silicon layers are formed in a micromechanical substrate which has a diaphragm in a partial region. The diaphragm has a thickness of less than 20 μm and includes part of a first of the single-crystal silicon layers. The substrate construction also includes a heating element configured to generate a temperature of more than 650° C. in at least part of the diaphragm. The substrate includes at least one diffusion barrier layer that reduces the oxidation of the first single-crystal silicon layer.
摘要:
At least two separate single-crystal silicon layers are formed in a micromechanical substrate which has a diaphragm in a partial region. The diaphragm has a thickness of less than 20 μm and includes part of a first of the single-crystal silicon layers. The substrate construction also includes a heating element configured to generate a temperature of more than 650° C. in at least part of the diaphragm. The substrate includes at least one diffusion barrier layer that reduces the oxidation of the first single-crystal silicon layer.
摘要:
A connection device for random connection of a first member of first transmission/reception units with a second number of second transmission/reception units has a switching matrix that includes a third number of controllable micromechanical switching elements that are respectively activatable to establish a connection between one of the first transmission/reception units and one of the second transmission/reception units. A control circuit selectively activates the respective micromechanical switching elements to selectively establish respective connections between the first number of first transmission/reception units and the second number of transmission/reception units.
摘要:
A connection device for random connection of a first member of first transmission/reception units with a second number of second transmission/reception units has a switching matrix that includes a third number of controllable micromechanical switching elements that are respectively activatable to establish a connection between one of the first transmission/reception units and one of the second transmission/reception units. A control circuit selectively activates the respective micromechanical switching elements to selectively establish respective connections between the first number of first transmission/reception units and the second number of transmission/reception units.
摘要:
A method for producing an electronic assembly and an electronic assembly which has been correspondingly produced are specified. In this case, CMOS structures are formed in a semiconductor substrate to form a circuit and, after the CMOS structures have been formed, at least one electrical conductor is introduced, in a low-temperature process into an opening in the semiconductor substrate in such a manner that the electrical conductor is formed between a first side and a second side, which is opposite the first side, of the semiconductor substrate to connect the circuit. The electronic assembly allows a close arrangement of electronics and detectors and is suitable, for example, for a medical apparatus.