摘要:
A wide-bandwidth variable attenuator/modulator incorporating a region of material comprising a combination of a ferromagnetic/nonmagnetic material which exhibits a Giant Magnetoresistance (GMR) effect.
摘要:
High breakdown voltages for AlInAs layers in InP-based devices, such as a gate layer in an InP HEMT or a collector layer in a heterojunction bipolar transistor, are achieved by growing the AlInAs layer by MBE at a substrate temperature about 70.degree.-125.degree. C. below the temperature at which a 2.times.4 reflective high energy diffraction pattern is observed. This corresponds to a growth temperature range of about 415.degree.-470.degree. C. for a 540.degree. 2.times.4 reconstruction temperature. Preferred growth temperatures within these ranges are 80.degree. C. below the 2.times.4 reconstruction temperature, or about 460.degree. C. Higher breakdown voltages are obtained than when the AlInAs layer is grown at either higher or lower temperatures.
摘要:
This disclosure is directed to devices and methods for generating light with electrode-less plasma lamps. More particularly, the present invention provides plasma lamps driven by a radio-frequency source without the use of electrodes inside the bulb, and a pulse-width modulation device that provides RF power regulation, and related methods. The bulb comprises gaseous material with metal halides and/or light emitters that, when powered, substantially stays in an arc shape state. The switching pulse-width modulation device is operable at specific modulation frequencies, duty cycles, and durations to stabilize or control the arc state/mode, which enables consistent and high efficiencies.
摘要:
An electrodeless plasma lamp includes a bulb containing a gas-fill and light emitter(s) excited to produce light using radio-frequency (RF) energy. Input and output coupling elements separated from each other by a gap couple RF energy from an RF source to the bulb. One end of the input coupling element is electrically connected to an RF source while the other end is connected to ground. One end of the output coupling element is connected to ground while the other end is connected to the bulb.
摘要:
An electrodeless plasma lamp array structure uses multiple plasma lamps to produce large amounts of electromagnetic radiation (visible, IR, UV, or a combination of visible, IR, and UV). An M by N array configuration is powered by either a single RF power source or multiple RF power sources. The array incorporates controllers to adjust the power delivered from the RF power source to each lamp within the array. By adjusting the delivered RF power, the intensity of electromagnetic radiation that is emitted from each lamp is controlled independently allowing for the creation of an array of lamps that emit electromagnetic radiation of varying intensity levels at different places within the array. Using lamps with different color temperatures as part of the array allows the color temperature and the color rendering index of the illumination to achieve different lighting conditions.
摘要翻译:无电极等离子体灯阵列结构使用多个等离子体灯产生大量的电磁辐射(可见光,IR,UV或可见光,IR和UV的组合)。 M / N阵列配置由单个RF电源或多个RF电源供电。 该阵列包含控制器,用于调整从RF电源传送到阵列内的每个灯的功率。 通过调节传送的RF功率,独立地控制从每个灯发射的电磁辐射的强度,允许产生在阵列内的不同位置发射不同强度水平的电磁辐射的灯阵列。 使用具有不同色温的灯作为阵列的一部分允许照明的色温和显色指数达到不同的照明条件。
摘要:
An electrode-less plasma lamps, comprising generally of a bulb containing a gas-fill that is excited to produce light using radio-frequency (RF) energy. In specific embodiments, the use of grounded coupling-elements with integrated bulb assemblies simplifies manufacturability, improves resonant frequency control, and enables the use of solid, partially filled, and hollow lamp bodies.
摘要:
A microwave/millimeter wave circuit structure supports discrete circuit elements by flip-chip mounting to an interconnection network on a low cost non-ceramic and non-semiconductor dielectric substrate, preferably Duroid. The necessary precise alignment of the circuit elements with contact pads on the substrate network required for the high operating frequencies is facilitated by oxidizing the interconnection network, but providing the contact pads from a non-oxidizable material to establish a preferential solder bump wetting for the pads. Alternately, the contact bumps on the flip-chips can be precisely positioned through corresponding openings in a passivation layer over the interconnection network. For thin circuit substrates that are too soft for successful flip-chip mounting, stiffening substrates are laminated to the circuit substrates. In a self-contained antenna application in which two of the circuit substrates are laminated together, with an antenna on one side and circuitry on the other side, a metallic ground plane between the substrates also serves a stiffening function.
摘要:
An epitaxial structure and method of manufacture for a single heterojunction bipolar transistor capable of being utilized in high-speed and high-power applications. Preferably, the epitaxial structure comprises an N-type collector made from InP, a P-type base made from InP, and an N-type emitter made from a semiconductor material of approximately 39 mole percent AlP and approximately 61 mole percent Sb.
摘要:
An epitaxial structure and method of manufacture for a single heterojunction bipolar transistor capable of being utilized in high-speed and high-power applications. Preferably, the epitaxial structure comprises an N-type collector made from InP, a P-type base made from InP, and an N-type emitter made from a semiconductor material of approximately 39 mole percent AlP and approximately 61 mole percent Sb.