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公开(公告)号：US5597767A
公开(公告)日：1997-01-28
申请号：US369838
申请日：1995-01-06
IPC分类号： B81C1/00 , H01L21/301 , H01L21/78 , H01L21/302
CPC分类号： B81C1/00873 , H01L21/78 , B81C2201/053 , Y10S148/012 , Y10S148/028
摘要： A method of separating wafers, such as those used for semiconductor device manufacture, into die. A partly fabricated wafer is covered with a protective coating over its top surface (10). The wafer is then inscribed to define separation lines between die, with the separation lines being of a predetermined depth (12). The protective coating is then removed (14), and at least one processing step is performed at the wafer level (15, 22-24), before the inscribed wafer is separated into die. Then, the wafer is separated into die along the separation lines (17).
摘要翻译： 将诸如用于半导体器件制造的晶片的晶片分离成芯片的方法。 部分制造的晶片在其顶表面（10）上被覆盖有保护涂层。 然后将晶片刻上以限定管芯之间的分隔线，分离线具有预定深度（12）。 然后去除保护涂层（14），并且在将内切晶片分离成模具之前，在晶片级（15,22-24）处执行至少一个处理步骤。 然后，将晶片沿分离线（17）分离成模具。
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公开(公告)号：US5595522A
公开(公告)日：1997-01-21
申请号：US178186
申请日：1994-01-04
申请人： Vikki S. Simpson , Tom G. Gullett , Jerry B. Medders , Arthur R. Clark , Bobby R. Robbins , Danny R. Newton , Lawrence D. Dyer , Douglas W. Bilderback , Clyde A. King
发明人： Vikki S. Simpson , Tom G. Gullett , Jerry B. Medders , Arthur R. Clark , Bobby R. Robbins , Danny R. Newton , Lawrence D. Dyer , Douglas W. Bilderback , Clyde A. King
IPC分类号： B24B9/00 , B24B9/06 , H01L21/304 , B24B49/00
CPC分类号： B24B9/065 , Y10S414/141 , Y10S438/959
摘要： An edge polishing system (20, 320) and method for edge polishing semiconductor wafers is disclosed. The system (20, 320) includes a loader (22, 326), a polisher (24, 328), an unloader (26, 330), and a controller (28, 335). The method includes the steps of loading wafers (28), and spacers (30) into a loader (22) to form a stack (36), moving the stack (36) into a polisher (24) and causing polisher (24) to polish the stack (36), then moving the stack (36) to an unloader (26), which semiautomatically removes the wafers (28) and spacers (30). The system (20) may include a controller (28) for entering the appropriate commands.
摘要翻译： 公开了一种用于边缘抛光半导体晶片的边缘抛光系统（20,320）和方法。 系统（20,320）包括装载机（22,326），抛光机（24,328），卸载机（26,330）和控制器（28,335）。 该方法包括以下步骤：将晶片（28）和间隔件（30）装载到装载机（22）中以形成堆叠（36），将堆叠（36）移动到抛光机（24）中并使抛光机 抛光堆叠（36），然后将堆叠（36）移动到卸载器（26），半卸载器（26）半自动地移除晶片（28）和间隔件（30）。 系统（20）可以包括用于输入适当命令的控制器（28）。
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公开(公告)号：US4935064A
公开(公告)日：1990-06-19
申请号：US173837
申请日：1988-03-28
CPC分类号： C02F1/50 , C02F1/766 , C02F2103/04
摘要： Trace quantities of elemental iodine are added to deionized water used in the manufacture of semiconductor materials and devices in order to sterilize the water and the delivery system of microscopic life forms, and to leave the iodine in the flow all the way through processing except for those process steps where iodine may be detrimental to the process step.
摘要翻译： 在制造半导体材料和器件的去离子水中加入痕量的元素碘，以便对水和微生物形式的输送系统进行消毒，并将碘在流中一直通过加工，除了那些 碘可能对工艺步骤有害的工艺步骤。
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公开(公告)号：US5289661A
公开(公告)日：1994-03-01
申请号：US995447
申请日：1992-12-23
申请人： Joel B. Jones , Lawrence D. Dyer
发明人： Joel B. Jones , Lawrence D. Dyer
CPC分类号： B24B9/065
摘要： An apparatus and method of contouring the edge of a semiconductor wafer in a fiduciary mark notch utilizes a contouring wheel or burr having a smaller diameter than the diameter of the fiduciary mark notch.
摘要翻译： 在受托标记凹口中轮廓化半导体晶片的边缘的装置和方法利用具有比受信标记凹口的直径小的直径的轮廓轮或毛刺。
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公开(公告)号：US4498345A
公开(公告)日：1985-02-12
申请号：US432619
申请日：1982-10-04
CPC分类号： G01M5/005 , B23D59/002 , B28D5/028 , G01N3/20 , Y10T83/855
摘要： A system for measuring the flexure of a saw blade in situ includes in one embodiment a non-contact displacement sensor and means for directing a fluid flow at the blade adjacent the sensor. The deflection of the blade by the fluid flow is detected by the sensor which generates a signal related to blade flexure. The system indicates when a saw blade is correctly tensioned or when retensioning is required.
摘要翻译： 用于测量锯片原位弯曲的系统包括在一个实施例中为非接触位移传感器和用于引导邻近传感器的叶片处的流体流动的装置。 通过流体流动的叶片的偏转由传感器检测，该传感器产生与叶片挠曲相关的信号。 系统指示锯片何时正确张紧或需要重新拉紧时。
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6.发明授权Method of reducing wafer particles after partial saw using a superhard protective coating 失效使用超硬保护涂层在部分锯片之后还原晶粒的方法
公开(公告)号：US6063696A
公开(公告)日：2000-05-16
申请号：US72399
申请日：1998-05-04
CPC分类号： H01L21/78
摘要： A method of fabricating a monolithic device, preferably a micromechanical device, from a wafer (20) by carefully selecting the composition of two or more layers of photoresist (52,54). The present invention uses a superhard protective layer such as DLC or TiW deposited over the partially fabricated device prior to a partial-saw. This superhard protective layer reduces the generation of defects in the underlying photoresist layers, and allows a wet chemical HF acid to etch away particles and damage of the underlying oxide edges. A 6% BHF solution can be utilized. The present invention substantially improves the yield of micromechanical devices.
摘要翻译： 通过仔细选择两层或更多层光致抗蚀剂（52,54）的组成，从晶片（20）制造单片器件（优选微机械器件）的方法。 本发明在部分锯之前使用在部分制造的器件上沉积的超硬保护层，例如DLC或TiW。 该超硬保护层减少了底层光致抗蚀剂层中的缺陷的产生，并且允许湿化学HF酸蚀刻掉颗粒并损坏下面的氧化物边缘。 可以使用6％的BHF溶液。 本发明大大提高了微机械装置的产量。
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公开(公告)号：US5817569A
公开(公告)日：1998-10-06
申请号：US855750
申请日：1997-05-08
IPC分类号： H01L21/301 , H01L21/306 , H01L21/78 , H01L21/46
CPC分类号： H01L21/02052 , H01L21/78
摘要： A method of fabricating a monolithic device, preferably a micromechanical device, from a wafer (20) by carefully selecting the composition of two or more layers of photoresist (52,54). The present invention comprises choosing compatible photoresist layers to avoid generating defects in the layers of photoresist which could allow a wet chemical HF acid etch process to damage an underlying micromechanical device. The present invention allows a very strong solution of hydrofluoric acid to be utilized to remove particles and debris after a partial-saw process, and to remove a damaged portion of an underlying CMOS layer (22) at a region (68) proximate a kerf (62). Using an HF solution having a concentration of about 6% is desired. The present invention substantially improves the yield of micromechanical devices.
摘要翻译： 通过仔细选择两层或更多层光致抗蚀剂（52,54）的组成，从晶片（20）制造单片器件（优选微机械器件）的方法。 本发明包括选择兼容的光致抗蚀剂层以避免在光致抗蚀剂层中产生缺陷，这可能允许湿化学HF酸蚀刻工艺损坏下面的微机械装置。 本发明允许使用非常强的氢氟酸溶液在部分锯切过程之后去除颗粒和碎屑，并且在靠近切口的区域（68）去除下面的CMOS层（22）的损坏部分（ 62）。 需要使用浓度为约6％的HF溶液。 本发明大大提高了微机械装置的产量。
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公开(公告)号：US5240557A
公开(公告)日：1993-08-31
申请号：US891536
申请日：1992-06-01
申请人： Lawrence D. Dyer , Dempsey McGregor , Robert M. Montgomery , Jerry B. Medders , Michael R. Head , Tom G. Gullett
发明人： Lawrence D. Dyer , Dempsey McGregor , Robert M. Montgomery , Jerry B. Medders , Michael R. Head , Tom G. Gullett
IPC分类号： H01L21/304 , H01L21/306 , H01L21/673 , H01L21/677
CPC分类号： H01L21/67781 , Y10S414/137
摘要： An apparatus stacks semiconductor wafers and spacers and clamps them in an axial alignment for mounting in a semiconductor wafer edge polishing machine. After edge polishing, the apparatus separates the wafers and spacers and delivers them respectively into separate cassettes for further processing or recycling.
摘要翻译： 装置堆叠半导体晶片和间隔物并将其夹紧在轴向对准中以安装在半导体晶片边缘抛光机中。 在边缘抛光之后，设备分离晶片和间隔物并将它们分别输送到单独的盒中用于进一步处理或回收。
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公开(公告)号：US5424224A
公开(公告)日：1995-06-13
申请号：US5713
申请日：1993-01-19
申请人： Franklin L. Allen , Eugene C. Davis , Lawrence D. Dyer , Jerry B. Medders , Vikki S. Simpson , Jerry D. Smith , Michael Cunningham , John B. Robbins
发明人： Franklin L. Allen , Eugene C. Davis , Lawrence D. Dyer , Jerry B. Medders , Vikki S. Simpson , Jerry D. Smith , Michael Cunningham , John B. Robbins
IPC分类号： B24B9/06 , H01L21/304 , H01L21/306
CPC分类号： H01L21/02008 , B24B9/065 , Y10S438/959
摘要： The protection to the backside of the semiconductor wafer is accomplished by applying a layer of silicon oxide or silicon nitride or other deposited material to the back surface of a semiconductor wafer to protect against particles, scratches, and etching by mild caustic solutions. The layer remains in place during all three processes, edge pre-polish, mirror edge polish, and wafer polish.
摘要翻译： 通过将半导体晶片的背面施加一层氧化硅或氮化硅或其它沉积材料来保护半导体晶片的背面，以防止颗粒，划痕和用温和的苛性碱溶液蚀刻。 在所有三个过程中，该层保持原位，边缘预抛光，镜面抛光和晶圆抛光。
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公开(公告)号：US5274959A
公开(公告)日：1994-01-04
申请号：US990001
申请日：1992-12-11
申请人： Lawrence D. Dyer , Anthony E. Stephens , Frank Allen , Keith M. Easton , James A. Kennon , Jerry B. Medders , Frederick O. Meyer, III
发明人： Lawrence D. Dyer , Anthony E. Stephens , Frank Allen , Keith M. Easton , James A. Kennon , Jerry B. Medders , Frederick O. Meyer, III
CPC分类号： B24B9/065
摘要： A system and method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.
摘要翻译： 用于抛光多个半导体晶片的边缘的系统和方法使一叠晶片相对抛光一个或多个焊盘旋转，使得晶片边缘和边缘的两侧被抛光成镜面光洁度。 抛光垫具有一系列凹槽，晶片边缘通过该沟槽抛光晶片边缘的侧面，或者使用两个焊盘，一个具有凹槽，一个没有凹槽。
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