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公开(公告)号：US5597767A
公开(公告)日：1997-01-28
申请号：US369838
申请日：1995-01-06
IPC分类号： B81C1/00 , H01L21/301 , H01L21/78 , H01L21/302
CPC分类号： B81C1/00873 , H01L21/78 , B81C2201/053 , Y10S148/012 , Y10S148/028
摘要： A method of separating wafers, such as those used for semiconductor device manufacture, into die. A partly fabricated wafer is covered with a protective coating over its top surface (10). The wafer is then inscribed to define separation lines between die, with the separation lines being of a predetermined depth (12). The protective coating is then removed (14), and at least one processing step is performed at the wafer level (15, 22-24), before the inscribed wafer is separated into die. Then, the wafer is separated into die along the separation lines (17).
摘要翻译： 将诸如用于半导体器件制造的晶片的晶片分离成芯片的方法。 部分制造的晶片在其顶表面（10）上被覆盖有保护涂层。 然后将晶片刻上以限定管芯之间的分隔线，分离线具有预定深度（12）。 然后去除保护涂层（14），并且在将内切晶片分离成模具之前，在晶片级（15,22-24）处执行至少一个处理步骤。 然后，将晶片沿分离线（17）分离成模具。
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公开(公告)号：US5452138A
公开(公告)日：1995-09-19
申请号：US68019
申请日：1993-05-27
CPC分类号： G09F9/372
摘要： A deformable mirror device comprises a plurality of groups of colored mirrors responsive to electronic signals. Each group of mirrors is coated with a mixture of resist and dye thereby reflecting specified wavelengths of visible light.
摘要翻译： 可变形反射镜装置包括响应于电子信号的多组有色反射镜。 每组镜子都涂上抗蚀剂和染料的混合物，从而反射出特定波长的可见光。
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公开(公告)号：US06724518B2
公开(公告)日：2004-04-20
申请号：US10331495
申请日：2002-12-30
申请人： Thomas J. Meyer , Brett A. Mangrum , Mark F. Reed , James D. Huffman , Michael A. Mignardi , Wei-Yan Shih
发明人： Thomas J. Meyer , Brett A. Mangrum , Mark F. Reed , James D. Huffman , Michael A. Mignardi , Wei-Yan Shih
IPC分类号： G02B2600
摘要： A system and method of providing a micromirror pixel 400 that is highly resistant to bright failure states. The micromirror 400 uses an asymmetric yoke 402 to ensure the mirror is only attracted to the address electrode in one rotation direction. The landing mechanism on the other side of the torsion binge axis also is altered to allow the pixel to over rotate in the “off” direction. The over rotation ensures that light reflected by the mirror when in the off direction will miss the projection lens pupil, allowing the corresponding pixel to remain dark in both an operational and failed state.
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公开(公告)号：US5393706A
公开(公告)日：1995-02-28
申请号：US1378
申请日：1993-01-07
IPC分类号： B28D5/00 , B81C1/00 , B81C99/00 , H01L21/301 , H01L21/304 , H01L21/78 , H01L21/302
CPC分类号： B81C1/00896 , B28D5/0011 , B28D5/0023 , B28D5/0047 , H01L21/304 , H01L21/3043 , H01L21/78 , Y10S148/028 , Y10T156/1064 , Y10T225/12
摘要： A process for partially sawing the streets on semiconductor wafers. After sawing the streets can be covered by a protective material, and then the wafer continues its processing as before. After the wafer is broken, the protective material may or may not be removed. Additionally, the wafer may be broken into individual chips using a wedge piece that has a number of individual wedges on it, where the individual wedges press against the partially sawn streets, causing the wafer to break.
摘要翻译： 在半导体晶片上部分锯切街道的过程。 锯切之后，街道可以被保护材料覆盖，然后晶片像以前一样继续其处理。 在晶片破裂之后，保护材料可能会被剥离，也可能不会被去除。 此外，可以使用在其上具有多个单独的楔块的楔形块将晶片破碎成单独的芯片，其中各个楔块压靠部分锯割的街道，导致晶片断裂。
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公开(公告)号：US5226099A
公开(公告)日：1993-07-06
申请号：US691920
申请日：1991-04-26
CPC分类号： G02B6/3596 , G02B26/0841 , G02B6/3552 , G02B6/353 , G02B6/357 , G02B6/3584
摘要： There is disclosed a device that consists of a micro-mechanical switch consisting of an electrode, a gap between the electrode and an individually deflectable element, which has a vertical shutter attached to its underside. When the electrode is addressed the movement of the deflectable element causes the shutter to raise or lower. Such a device can be used in switching. One embodiment of such a use in waveguides is disclosed along with the method of manufacture.
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公开(公告)号：US5867202A
公开(公告)日：1999-02-02
申请号：US768007
申请日：1996-12-13
CPC分类号： G02B26/0825 , G02B26/0841
摘要： A micromechanical device (50) with spring tips (60) and its method of manufacture. A micromechanical device (50) is formed such that there is a deflectable element (36) suspended by at least one hinge (24a) over an air gap, at the bottom of which are landing stops (34a). The element (36) deflects on said hinge and comes into contact with the landing stops (34a) via at least one small metal protrusion (60), or spring tip. The spring tip flexes upon contact allowing more even distribution of forces and less wear and adhesion. The spring tips are formed in standard semiconductor processing steps with the addition of patterning the metal layer (64) from which the hinges are formed to create separated metal elements. When the deflectable element is formed, the metal forming that element bonds to the separated metal elements at the tips, thereby forming the spring tips.
摘要翻译： 一种具有弹簧顶端（60）的微机械装置（50）及其制造方法。 微机械装置（50）形成为使得存在由空气间隙上的至少一个铰链（24a）悬挂的可偏转元件（36），其底部是着陆挡块（34a）。 元件（36）在所述铰链上偏转并经由至少一个小金属突起（60）或弹簧尖端与着陆挡块（34a）接触。 弹簧尖端在接触时弯曲，允许更均匀的力分布和更少的磨损和粘附力。 在标准的半导体加工步骤中形成弹簧尖端，其中添加了形成铰链的金属层（64）的图案化以产生分离的金属元件。 当形成可偏转元件时，形成该元件的金属在尖端处与分离的金属元件结合，从而形成弹簧顶端。
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公开(公告)号：US5445559A
公开(公告)日：1995-08-29
申请号：US82183
申请日：1993-06-24
IPC分类号： G02B26/02 , B25B11/00 , B28D5/00 , B28D5/02 , B81C1/00 , G02B26/08 , H01L21/301 , H01L21/683 , B24B41/06
CPC分类号： B25B11/005 , B28D5/0052 , B28D5/0094 , B28D5/022 , B81C1/00888 , G02B26/0841 , Y10S148/028 , Y10T225/12
摘要： A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.
摘要翻译： 一种制造微机械装置的加工夹具和方法，例如数字微镜装置，其允许在锯操作和随后的清洁操作期间保护晶片22上的脆弱结构免受碎屑的影响。 在部分锯切晶片22以产生锯切之后，将晶片22附接到真空固定器26。 然后将晶片22的背面磨碎到锯切切口24以分离设备32.每个设备32通过设备32上方的顶部空间中的真空被保持在固定装置上。在替代实施例中，设备通过锯切分开 在夹具中完全通过晶片。
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8.发明授权
公开(公告)号：US5240818A
公开(公告)日：1993-08-31
申请号：US739079
申请日：1991-07-31
CPC分类号： G09F9/372
摘要： A deformable mirror device comprises a plurality of groups of colored mirrors responsive to electronic signals. Each group of mirrors is coated with a mixture of resist and dye thereby reflecting specified wavelengths of visible light. A process for manufacturing such a color deformable mirror device ("DMD") includes forming a layer of material on the DMD comprising a resist and a dye and selectively removing portions of the layer of material from the DMD.
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公开(公告)号：US07106491B2
公开(公告)日：2006-09-12
申请号：US10331495
申请日：2002-12-30
申请人： Thomas J. Meyer , Brett A. Mangrum , Mark F. Reed , James D. Huffman , Michael A. Mignardi , Wei-Yan Shih
发明人： Thomas J. Meyer , Brett A. Mangrum , Mark F. Reed , James D. Huffman , Michael A. Mignardi , Wei-Yan Shih
CPC分类号： G02B26/0841 , Y10S359/904
摘要： A system and method of providing a micromirror pixel 400 that is highly resistant to bright failure states. The micromirror 400 uses an asymmetric yoke 402 to ensure the mirror is only attracted to the address electrode in one rotation direction. The landing mechanism on the other side of the torsion binge axis also is altered to allow the pixel to over rotate in the “off” direction. The over rotation ensures that light reflected by the mirror when in the off direction will miss the projection lens pupil, allowing the corresponding pixel to remain dark in both an operational and failed state.
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公开(公告)号：US5605489A
公开(公告)日：1997-02-25
申请号：US448205
申请日：1995-05-23
IPC分类号： G02B26/02 , B25B11/00 , B28D5/00 , B28D5/02 , B81C1/00 , G02B26/08 , H01L21/301 , H01L21/683 , B24B41/06
CPC分类号： B25B11/005 , B28D5/0052 , B28D5/0094 , B28D5/022 , B81C1/00888 , G02B26/0841 , Y10S148/028 , Y10T225/12
摘要： A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.
摘要翻译： 一种制造微机械装置的加工夹具和方法，例如数字微镜装置，其允许在锯操作和随后的清洁操作期间保护晶片22上的脆弱结构免受碎屑的影响。 在部分锯切晶片22以产生锯切之后，将晶片22附接到真空固定器26。 然后将晶片22的背面磨碎到锯切切口24以分离设备32.每个设备32通过设备32上方的顶部空间中的真空被保持在固定装置上。在替代实施例中，设备通过锯切分离 在夹具中完全通过晶片。
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