公开(公告)号：US07226306B1

公开(公告)日：2007-06-05

申请号：US11297346

申请日：2005-12-09

申请人： Michael Chen ,  Tai-Wei Lin

发明人： Michael Chen ,  Tai-Wei Lin

IPC分类号： H01R13/627

CPC分类号： H01R13/6335

摘要： A transmission line that is plugged and unplugged includes a wire and at least one socket connecting to one end of the wire. The socket is connected to an electronic device and coupled with a force applying member. The force applying member rams the electronic device when subject to a force to facilitate separation of the socket and the electronic device. The force applying member is hinged on the socket and is divided by the hinged location to form a force applying portion and a pressing portion. When the force applying portion receives the force, the pressing portion generates a counter force about the hinged location against the electronic device to make the socket to be removed from the electronic device.

摘要翻译： 插入和拔出的传输线包括电线和连接到电线的一端的至少一个插座。 插座连接到电子设备并与施力部件联接。 当施加力时，力施加构件将电子装置拉开以便于插座和电子装置的分离。 力施加构件铰接在插座上，并被铰接位置分开以形成施力部分和按压部分。 当施力部分接收到力时，按压部分围绕电子装置的铰接位置产生反作用力，以使插座从电子装置移除。

公开(公告)号：US20070134971A1

公开(公告)日：2007-06-14

申请号：US11297346

申请日：2005-12-09

申请人： Michael Chen ,  Tai-Wei Lin

发明人： Michael Chen ,  Tai-Wei Lin

IPC分类号： H01R13/627

CPC分类号： H01R13/6335

摘要： A transmission line that is plugged and unplugged includes a wire and at least one socket connecting to one end of the wire. The socket is connected to an electronic device and coupled with a force applying member. The force applying member rams the electronic device when subject to a force to facilitate separation of the socket and the electronic device. The force applying member is hinged on the socket and is divided by the hinged location to form a force applying portion and a pressing portion. When the force applying portion receives the force, the pressing portion generates a counter force about the hinged location against the electronic device to make the socket to be removed from the electronic device.

摘要翻译： 插入和拔出的传输线包括电线和连接到电线的一端的至少一个插座。 插座连接到电子设备并与施力部件联接。 当施加力时，力施加构件将电子装置拉开以便于插座和电子装置的分离。 力施加构件铰接在插座上，并被铰接位置分开以形成施力部分和按压部分。 当施力部分接收到力时，按压部分围绕电子装置的铰接位置产生反作用力，以使插座从电子装置移除。

公开(公告)号：US20100265468A1

公开(公告)日：2010-10-21

申请号：US12662273

申请日：2010-04-08

申请人： Tai-Wei Lin ,  Jia-Bin Huang ,  Chi-Chui Yun

发明人： Tai-Wei Lin ,  Jia-Bin Huang ,  Chi-Chui Yun

IPC分类号： G03B21/16 ,  F28D15/04

CPC分类号： G03B21/16 ,  F28D15/0266

摘要： A heat dissipation module includes a heat-absorbing unit, a first heat pipe, a second heat pipe, and a heat-dissipating unit. The heat-absorbing unit is adapted to contact the heat source thermally. The first heat pipe has a first heat-absorbing section being connected to the heat-absorbing unit and a first heat-dissipating section. The second heat pipe has a second heat-absorbing section being connected to the heat-absorbing unit and a second heat-dissipating section. The heat-dissipating unit includes a first fin assembly and a second fin assembly. The first heat-dissipating section is connected to the first fin assembly along a first extending direction, the second heat-dissipating section is connected to the second fin assembly along a second extending direction, the first extending direction and second extending direction are oblique to each other, and a part of the first fin assembly and a part of the second fin assembly are inset to each other.

摘要翻译： 散热模块包括吸热单元，第一热管，第二热管和散热单元。 吸热单元适于热接触热源。 第一热管具有与吸热单元连接的第一吸热部和第一散热部。 第二热管具有与吸热单元连接的第二吸热部和第二散热部。 散热单元包括第一翅片组件和第二翅片组件。 第一散热部沿着第一延伸方向连接于第一散热片组件，第二散热部沿着第二延伸方向与第二散热片组件连接，第一延伸方向和第二延伸方向相互倾斜 第一翅片组件的一部分和第二翅片组件的一部分彼此插入。

公开(公告)号：US20080215183A1

公开(公告)日：2008-09-04

申请号：US12037941

申请日：2008-02-27

申请人： Ying-Tsai Chen ,  Tai-Wei Lin ,  Hung-Yi Chen ,  Wei-Nan William Tseng

发明人： Ying-Tsai Chen ,  Tai-Wei Lin ,  Hung-Yi Chen ,  Wei-Nan William Tseng

IPC分类号： G06F17/00

CPC分类号： G06N3/008

摘要： A entertainment robot includes a recognition unit, an environment detecting unit, an intelligent unit, and a behavior unit. The recognition unit receives an input signal from a user and outputs a corresponding command signal. The environment detecting unit detects background information and outputs a corresponding environment signal. The intelligent unit outputs a corresponding behavior signal based on the command signal and the environment signal. The behavior unit controls the operation of the entertainment robot based on the behavior signal.

摘要翻译： 娱乐机器人包括识别单元，环境检测单元，智能单元和行为单元。 识别单元从用户接收输入信号并输出​​相应的命令信号。 环境检测单元检测背景信息并输出相应的环境信号。 智能单元根据命令信号和环境信号输出相应的行为信号。 行为单元根据行为信号控制娱乐机器人的操作。

公开(公告)号：US08966930B2

公开(公告)日：2015-03-03

申请号：US13214234

申请日：2011-08-22

申请人： Tai-Wei Lin

发明人： Tai-Wei Lin

IPC分类号： F25D11/02 ,  H05K7/14 ,  H05K7/20

CPC分类号： H05K7/1497 ,  H05K7/20745 ,  H05K7/20836

摘要： A container data center system includes a container, a plurality of servers, at least a regulation device, a first refrigeration device and a second refrigeration device. The container defines a first receiving room and a second receiving room isolated from the first receiving room. The servers are received in the first receiving room. The at least a regulation device is received in second receiving room. The at least regulation device is electrically connected to the servers for regulating the servers. The first refrigeration device is installed outside the container for cooling the first receiving room. The second refrigeration device is installed outside the container for cooling the second receiving room.

摘要翻译： 容器数据中心系统包括容器，多个服务器，至少一个调节装置，第一制冷装置和第二制冷装置。 容器限定了与第一接收室隔离的第一接收室和第二接收室。 服务器被接收在第一个接收室。 所述至少一个调节装置被接收在第二接收室中。 至少调节装置电连接到用于调节服务器的服务器。 第一制冷装置安装在容器外部以冷却第一接收室。 第二制冷装置安装在容器的外部，用于冷却第二容纳室。

公开(公告)号：US08339788B2

公开(公告)日：2012-12-25

申请号：US12944770

申请日：2010-11-12

申请人： Tai-Wei Lin

发明人： Tai-Wei Lin

IPC分类号： H05K7/20

CPC分类号： H01L23/40 ,  F16B2/248 ,  F16B5/121 ,  H01L2924/0002 ,  Y10T403/58 ,  H01L2924/00

摘要： A printed circuit board includes a heat sink and a circuit board. The heat sink defines two fixing blind holes respectively arranged on adjacent opposite ends of the heat sink. The circuit board includes a heat-generating component and two fixing elements corresponding to the fixing blind holes. Each fixing elements includes a fixing portion fixed on the circuit board, a locking portion, and an elastic portion extending from a first end of the locking portion to be connected to the fixing portion. A second end of the locking portion of each fixing element is inserted into a corresponding fixing blind hole, to fix the heat sink on the heat-generating component.

摘要翻译： 印刷电路板包括散热器和电路板。 散热器限定了分别布置在散热器的相邻两端的两个固定盲孔。 电路板包括发热部件和对应于固定盲孔的两个固定元件。 每个固定元件包括固定在电路板上的固定部分，锁定部分和从锁定部分的第一端延伸以连接到固定部分的弹性部分。 每个固定元件的锁定部分的第二端插入相应的固定盲孔中，以将散热器固定在发热部件上。

公开(公告)号：US08717763B2

公开(公告)日：2014-05-06

申请号：US13439865

申请日：2012-04-05

申请人： Tai-Wei Lin ,  Chin-Hui Chen

发明人： Tai-Wei Lin ,  Chin-Hui Chen

IPC分类号： H05K7/20 ,  F24F7/06

CPC分类号： H05K7/20563

摘要： A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

摘要翻译： 冷却系统包括第一组风扇，第二组风扇和导气罩。 导气盖包括第一隔板，第二隔板，第三隔板。 第一分区连接在第二分区和第三分区之间，以限定第一空间，第二空间和第三空间。 其中第一组风扇引导空气流进入第一空间和第二空间，第二组风扇引导空气流进入第三空间。

公开(公告)号：US08625275B2

公开(公告)日：2014-01-07

申请号：US13338253

申请日：2011-12-28

申请人： Tai-Wei Lin

发明人： Tai-Wei Lin

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/187 ,  G06F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation apparatus includes a shaped and resilient connecting plate, and a first heat-dissipating plate and a second heat-dissipating plate clamping down on a storage device to dissipate heat.

摘要翻译： 散热装置包括成形和弹性的连接板，以及夹持在存储装置上以散热的第一散热板和第二散热板。

公开(公告)号：US08582025B2

公开(公告)日：2013-11-12

申请号：US12982909

申请日：2010-12-31

申请人： Tai-Wei Lin

发明人： Tai-Wei Lin

IPC分类号： H04N5/225

CPC分类号： H04N5/2253 ,  G03B17/55 ,  H04N5/2252 ,  H04N5/23206

摘要： An internet-protocol camera device includes a lens module and an image pickup module. The lens module guides light to the image pickup module. The image pickup module includes a metal housing, heat generating electronic devices received in the metal housing, heat sinks received in the metal housing, and heat dissipation plates. The metal housing includes a first inner side surface, a second inner side surface, a third inner side surface and a fourth inner side surface connected end-to-end in that order. The first inner side surface faces the third inner side surface. The second inner side surface faces the fourth inner side surface. The heat sinks are mounted on the corresponding heat generating electronic devices. The heat dissipation plates are mounted on the first inner side surface, the second inner side surface, the third inner side surface and the fourth inner side surface.

摘要翻译： 互联网协议摄像机装置包括镜头模块和摄像模块。 镜头模块将光线引导到图像拾取模块。 图像拾取模块包括金属壳体，容纳在金属壳体中的发热电子装置，容纳在金属壳体中的散热器和散热板。 金属壳体包括依次连接端对端连接的第一内侧面，第二内侧面，第三内侧面和第四内侧面。 第一内侧表面面向第三内侧表面。 第二内侧表面面向第四内侧表面。 散热器安装在相应的发热电子设备上。 散热板安装在第一内侧表面，第二内侧表面，第三内侧表面和第四内侧表面上。

公开(公告)号：US07781885B2

公开(公告)日：2010-08-24

申请号：US12114623

申请日：2008-05-02

申请人： Tai-Wei Lin ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

发明人： Tai-Wei Lin ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

IPC分类号： H01L23/10 ,  H01L21/00

CPC分类号： H01S5/02469 ,  H01L33/648 ,  H01L2224/48091 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02288 ,  H01L2924/00014

摘要： An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.

摘要翻译： 用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。 基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。 每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。