利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

56 条记录 (耗时 0.021 秒)

    DISTRIBUTED THERMOELECTRIC STRING AND INSULATING PANEL AND APPLICATIONS FOR LOCAL HEATING, LOCAL COOLING, AND POWER GENERATION FROM HEAT
    3.
    发明申请
    DISTRIBUTED THERMOELECTRIC STRING AND INSULATING PANEL AND APPLICATIONS FOR LOCAL HEATING, LOCAL COOLING, AND POWER GENERATION FROM HEAT 审中-公开
    分布式热电弧和绝缘板及其应用，用于本地加热，本地冷却和发电从热

    公开(公告)号：US20120198616A1

    公开(公告)日：2012-08-09

    申请号：US13394288

    申请日：2011-09-12

    申请人： Tarek Makansi ,  Michael J. Berman ,  Steven Wood ,  John L. Franklin ,  Mark N. Evers

    发明人： Tarek Makansi ,  Michael J. Berman ,  Steven Wood ,  John L. Franklin ,  Mark N. Evers

    IPC分类号： A47C21/04 ,  H05B3/00 ,  F25B21/04 ,  H01L35/28 ,  H01L35/34

    CPC分类号： H01C1/16 ,  A61F2007/0075 ,  H01C1/12 ,  H01C7/008 ,  H01C13/02 ,  H01L35/32

    摘要： Inexpensive, lightweight, flexible heating and cooling panels with highly distributed thermoelectric elements are provided. A thermoelectric “string” is described that may be woven or assembled into a variety of insulating panels such as seat cushions, mattresses, pillows, blankets, ceiling tiles, office partitions, under-desk panels, electronic enclosures, building walls, refrigerator walls, and heat conversion panels. The string contains spaced thermoelectric elements which are thermally and electrically connected to lengths of braided, meshed, stranded, foamed, or otherwise expandable and compressible conductor. The elements and a portion of compacted conductor are mounted within the insulating panel. On the outsides of the panel, the conductor is expanded to provide a very large surface area of contact with air or other medium for heat absorption on the cold side and for heat dissipation on the hot side.

    摘要翻译： 提供了具有高度分布的热电元件的廉价，轻便，灵活的加热和冷却面板。 描述了一种热电“串”，其可以被编织或组装成各种绝缘面板，例如座垫，床垫，枕头，毯子，天花板瓦片，办公室隔板，桌子下面板，电子外壳，建筑物墙壁，冰箱壁， 和热转换面板。 该串包含间隔开的热电元件，它们热连接到编织，网状，绞合，发泡或其它可膨胀和可压缩导体的长度。 元件和压实导体的一部分安装在绝缘板内。 在面板的外侧，导体膨胀以提供与空气或其它介质接触的非常大的表面积，以在冷侧上进行吸热并在热侧进行散热。

    Electroplating tool for semiconductor manufacture having electric field control
    4.
    发明授权
    Electroplating tool for semiconductor manufacture having electric field control 有权
    具有电场控制的半导体制造用电镀工具

    公开(公告)号：US07332062B1

    公开(公告)日：2008-02-19

    申请号：US10452360

    申请日：2003-06-02

    申请人： Steven E. Reder ,  Michael J. Berman

    发明人： Steven E. Reder ,  Michael J. Berman

    IPC分类号： C25D17/00 ,  C25D17/06 ,  C25D7/12

    CPC分类号： C25D17/06 ,  C25D17/001 ,  C25D17/005

    摘要： An electroplating tool for providing a metal or metal film on a semiconductor wafer during processing thereof has a wafer chucking mechanism with a conductor or conductors associated therewith. The conductor(s) are electrically connected to a controller that applies a voltage or current applied thereto for altering the position of and/or varying the intensity of electromagnetic field lines originating from a source anode of the electroplating tool. The electromagnetic field lines originating from the source anode direct the deposition of metal from the electroplating solution to the semiconductor wafer. The conductor(s) of the wafer chucking mechanism improve and/or modulate the electromagnetic field lines of the electroplating process. This provides greater control of metal deposition during the electroplating process such that uniformity of the metal (e.g. copper) is provided across the semiconductor wafer.

    摘要翻译： 一种用于在其处理期间在半导体晶片上提供金属或金属膜的电镀工具具有带有与其相关联的导体或导体的晶片夹持机构。 导体电连接到控制器，该控制器施加施加到其上的电压或电流，以改变源自电镀工具的源极的电磁场线的位置和/或改变电磁场线的强度。 源自源极阳极的电磁场线将金属从电镀溶液沉积到半导体晶片。 晶片夹持机构的导体改善和/或调制电镀工艺的电磁场线。 这提供了在电镀工艺期间对金属沉积的更大控制，使得跨半导体晶片提供金属（例如铜）的均匀性。

    Slurry filling a recess formed during semiconductor fabrication
    5.
    发明授权
    Slurry filling a recess formed during semiconductor fabrication 有权
    填充在半导体制造期间形成的凹部的浆料

    公开(公告)号：US06297558B1

    公开(公告)日：2001-10-02

    申请号：US09454257

    申请日：1999-12-02

    申请人： Michael J. Berman

    发明人： Michael J. Berman

    IPC分类号： H01L2348

    CPC分类号： H01L21/32115

    摘要： The present invention advantageously provides a method for filling a recess with a slurry that exhibits electrical properties similar to those of the structure which has the recess. The topological surface that includes the recess may be placed adjacent to a pad on which the slurry is disposed. The pad may be rotated to force the slurry into the recess. After the slurry is densely packed into the recess, the slurry may be cleaned from the topological surface exclusive of the recess. The slurry may be heated in order to remove the liquid portion of the slurry. The resulting topological surface is planar since a recess no longer exists therein. The technique hereof may be especially usefull for filling a recess that forms in the surface of a plug or in the surface of a fill dielectric disposed within a trench. Such recesses may form as a result of CMP or etchback.

    摘要翻译： 本发明有利地提供了一种填充具有与具有凹部的结构的电性能相似的电浆的浆料的方法。 包括凹部的拓扑表面可以放置在其上布置有浆料的垫附近。 垫可以旋转以迫使浆料进入凹槽。 在浆料密集地填充到凹部中之后，浆料可以从除凹口之外的拓扑表面清洁。 可以加热浆液以除去浆料的液体部分。 所形成的拓扑表面是平面的，因为其中不再存在凹槽。 本发明的技术可能特别适用于填充在塞子的表面中形成的凹槽或者设置在沟槽内的填充电介质的表面。 这种凹陷可能由于CMP或回蚀而形成。

    Pre-conditioning polishing pads for chemical-mechanical polishing
    6.
    发明授权
    Pre-conditioning polishing pads for chemical-mechanical polishing 有权
    预处理抛光垫进行化学机械抛光

    公开(公告)号：US06273798B1

    公开(公告)日：2001-08-14

    申请号：US09362648

    申请日：1999-07-27

    申请人： Michael J. Berman

    发明人： Michael J. Berman

    IPC分类号： B24B2118

    CPC分类号： B24B53/017

    摘要： A preconditioning mechanism for preconditioning a polishing pad is described. The preconditioning mechanism includes an arm capable of being disposed over the polishing pad and a head section located on a distal end of the arm and rotatable about a central axis. Furthermore, the head section includes at least two heads oriented about the central axis and have surfaces for either conditioning or preconditioning the polishing pad, whereby rotation of the head section about the central axis by defined amounts presents at least two heads to the polishing pad so that different of the two heads can engage the polishing pad for conditioning or preconditioning depending upon how far rotation has proceeded.

    摘要翻译： 描述了一种预处理抛光垫的预处理机构。 预处理机构包括能够设置在抛光垫上的臂和位于臂的远端上且可围绕中心轴线旋转的头部。 此外，头部包括至少两个围绕中心轴定向的头，并且具有用于调节或预处理抛光垫的表面，由此，头部部分围绕中心轴线限定的量的旋转将至少两个头部提供给抛光垫，因此 根据旋转进行的程度，两个头部的不同可以接合抛光垫进行调理或预处理。

    Visual wear confirmation polishing pad
    8.
    发明授权
    Visual wear confirmation polishing pad 失效
    视觉磨损确认抛光垫

    公开(公告)号：US07442113B2

    公开(公告)日：2008-10-28

    申请号：US10421421

    申请日：2003-04-23

    申请人： Michael J. Berman ,  Matthew R. Trattles

    发明人： Michael J. Berman ,  Matthew R. Trattles

    IPC分类号： B24B7/22

    CPC分类号： B24B37/22 ,  B24B53/017

    摘要： A polishing pad having an upper layer with a first visual characteristic. The upper layer is adapted to erode against a pad conditioner at a uniform rate during a pad conditioning process. At least one lower layer with at least a second visual characteristic is disposed beneath the upper layer. The first visual characteristic is visually distinguishable from the second visual characteristic. The at least one lower layer is adapted to polish a substrate, where the visual distinguishability between the upper layer and the at least one lower layer provides a visual indication of whether the pad conditioning process has been accomplished in a uniform manner.

    摘要翻译： 一种抛光垫，具有具有第一视觉特性的上层。 在衬垫调节过程中，上层适于以均匀的速率侵蚀衬垫调节器。 具有至少第二视觉特征的至少一个下层设置在上层下方。 第一视觉特征在视觉上与第二视觉特征不同。 所述至少一个下层适于抛光基底，其中所述上层和所述至少一个下层之间的视觉可辨别性提供了以均匀方式完成所述垫调节过程的视觉指示。

    Mechanism for improving the structural integrity of low-k films
    9.
    发明授权
    Mechanism for improving the structural integrity of low-k films 有权
    改善低k膜结构完整性的机理

    公开(公告)号：US06982206B1

    公开(公告)日：2006-01-03

    申请号：US10679004

    申请日：2003-10-02

    申请人： Michael J. Berman ,  Steven E. Reder ,  Hemanshu Bhatt

    发明人： Michael J. Berman ,  Steven E. Reder ,  Hemanshu Bhatt

    IPC分类号： H01L21/76

    CPC分类号： H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

    摘要： According to one embodiment, a method of forming a low-k dielectric composite film is provided. A low-k interconnect dielectric layer is strengthened by forming whiskers in the low-k film. The whiskers are formed simultaneously with the low-k layer. In one embodiment, the low-k structure is removed by heating a volatile matrix film, leaving a whisker residue.

    摘要翻译： 根据一个实施例，提供了形成低k电介质复合膜的方法。 通过在低k膜中形成晶须来增强低k互连电介质层。 晶须与低k层同时形成。 在一个实施方案中，通过加热挥发性基质膜除去低k结构，留下晶须残留物。

    Pad conditioning monitor
    10.
    发明授权
    Pad conditioning monitor 有权
    垫调节显示器

    公开(公告)号：US06722948B1

    公开(公告)日：2004-04-20

    申请号：US10423096

    申请日：2003-04-25

    申请人： Michael J. Berman

    发明人： Michael J. Berman

    IPC分类号： B24B4918

    CPC分类号： B24B53/017 ,  B24B49/16

    摘要： A modification to a chemical mechanical polishing conditioner of a type having a member with a conditioning surface adapted to apply a force to and condition a polishing pad. The conditioner includes at least one sensor disposed within the member, where the at least one sensor is adapted to sense at least one of an amount of the force applied to the polishing pad and a uniformity across the member of the force applied to the polishing pad. In this manner, the force applied by the conditioner to the pad, and the uniformity of the force applied by the conditioner to the pad, can be sensed. These sensed forces can be monitored, reported, and controlled, thus providing a better controlled chemical mechanical polishing process.

    摘要翻译： 化学机械抛光调理剂的修改，其具有具有调节表面的构件，适于对抛光垫施加力并调节其抛光垫。 所述调节器包括设置在所述构件内的至少一个传感器，其中所述至少一个传感器适于感测施加到所述抛光垫的力的量中的至少一个以及施加到所述抛光垫的所述构件上的均匀性 。 以这种方式，可以检测由调节器施加到垫的力以及由调节器施加到垫的力的均匀性。 这些感测的力可以被监测，报告和控制，从而提供更好的受控化学机械抛光过程。