摘要:
A device and method wherein a thermo electric generator device is disposed between stacks of a multiple level device, or is provided on or under a die of a package and is conductively connected to the package. The thermo electric generator device is configured to generate a voltage by converting heat into electric power. The voltage which is generated by the thermo electric generator can be recycled back into the die itself, or to a higher-level unit in the system, even to a cooling fan.
摘要:
A gas delivery system for delivering a gas to a reactor. The reactor has a reactor chamber, a gas inlet port, and a gas exhaust port. The gas delivery system included a torch chamber having an outer wall extending along a first axis. A torch injector extends into the torch chamber at a first end of the torch chamber. The torch injector includes at least one gas intake port for receiving at least one gas and a gas injector section for expelling the at least one gas into the torch chamber. A gas outlet section is disposed at a second end of the torch chamber. The gas outlet section includes a first tubing member disposed along a second axis and a gas outlet port connected to the first tubing member. The gas outlet port of the gas outlet section engages the gas inlet port of the reactor. The torch chamber, the torch injector, and the gas outlet section of the gas delivery system are formed into a unitized structure with no resealable connections between them.
摘要:
A method and control system for detecting harmonic oscillation in a chemical mechanical polishing process and reacting thereto, such as by taking steps to at least one of: 1) reduce or eliminate the harmonic oscillation; and 2) counter the noise which is associated with the harmonic oscillation. By reducing or eliminating harmonic oscillation, films with reduced structure strengths including low k dielectric films can be used. By countering the noise, the quality of the work environment is improved.
摘要:
According to one embodiment, a method of planarizing of a surface of a semiconductor substrate is provided. A copper layer is inlaid in a dielectric layer of the substrate. The semiconductor substrate is disposed opposite to a polishing pad and relative movement provided between the pad and the substrate. An electrolytic slurry containing abrasive particles is flowed over the substrate or the pad. A voltage is applied between the polishing pad and the substrate to perform electropolishing of the substrate. The rate of chemical mechanical polishing is controlled by the down force applied to a polishing head urging the substrate against the polishing pad.
摘要:
A system for coupling a ball fitting connected to a first tubing to a socket fitting connected to a second tubing. A first coupling forms an aperture having a diameter that is larger than the diameter of the ball fitting, and receives the ball fitting. The first coupling forms an annular race, with an annular surface disposed between the annular race and the aperture. First split ring pieces are assembled into a first ring that forms an aperture having a diameter that is smaller than the diameter of the ball fitting, and receives the first tubing. The first ring forms an annular ridge that engages the annular race, and aligns the first split ring pieces. The annular surface applies uniform axial pressure to a first surface of the first ring. The first ring has a second surface opposing the first surface that applies uniform axial pressure to a back portion of the ball fitting. A second coupling forms an aperture having a diameter that is larger than the diameter of the socket fitting, and receives the socket fitting. The second coupling forms an annular race, with an annular surface disposed between the annular race and the aperture. Second split ring pieces are assembled into a second ring that forms an aperture having a diameter that is smaller than the diameter of the socket fitting, and receives the second tubing. The second ring forms an annular ridge that engages the annular race, and aligns the second split ring pieces. The annular surface applies uniform axial pressure to a first surface of the second ring. The second ring has a second surface opposing the first surface that applies uniform axial pressure to a back portion of the socket fitting. Engagement means reversibly draw the first coupling and the second coupling toward each other, and releasably hold them together with uniform axial pressure.
摘要:
A system for thinning a layer on a substrate without damaging a delicate underlying layer in the substrate. The system includes means for mechanically eroding the layer on the substrate, and means for electropolishing the layer on the substrate. In this manner, portions of the layer that cannot be removed by electropolishing can be removed by the mechanical erosion. However, electropolishing can preferentially be used on some portions of the layer so that unnecessary mechanical stresses can be avoided. Thus, the system imparts less mechanical stress to the substrate during the removal of the layer, and the delicate underlying layer receives less damage during the process, and preferably no damage whatsoever.
摘要:
The present invention provides a method of forming a dielectric on a semiconductor substrate. A dielectric is grown at a substrate interface in a plurality of increments. Stress is relieved at the dielectric substrate interface between each increment. In another aspect, stress relief is performed by annealing the substrate. The annealing is performed by placing the substrate in an inert environment and by raising the temperature surrounding the substrate.
摘要:
According to one embodiment, a method of forming a low-k dielectric composite film is provided. A low-k interconnect dielectric layer is strengthened by forming whiskers in the low-k film. The whiskers are formed simultaneously with the low-k layer. In one embodiment, the low-k structure is removed by heating a volatile matrix film, leaving a whisker residue.
摘要:
A reaction chamber of the type used to create a reaction at a surface of a substrate disposed within the reaction chamber. A transmitter produces a transmitted beam having first characteristics, where the transmitter is disposed outside of the reaction chamber. A view port is disposed in a boundary wall of the reaction chamber, where the view port is formed of a material that is transparent at least in part to the transmitted beam. The transmitter, the view port, and the substrate are aligned such that the transmitted beam is directable to and reflected at least in part from the surface of the substrate, thereby producing a reflected beam having second characteristics. A receiver is disposed outside of the reaction chamber, and the receiver receives the reflected beam from the surface of the substrate through the view port. The receiver also senses the second characteristics of the reflected beam and reports the second characteristics. A controller receives the second characteristics from the receiver and compares the second characteristics to the first characteristics to determine a difference between the first characteristics and the second characteristics. The difference relates to a progress of the reaction at the surface of the substrate. The controller also reports the progress of the reaction. A view port shield shields the view port from the reaction without substantially inhibiting the transmitted beam from reaching the surface of the substrate and the reflected beam from reaching the receiver. The transmitted beam is produced by the transmitter and the reflected beam is received and sensed by the receiver and the controller determines the progress of the reaction while the reaction is conducted.
摘要:
A gas injector apparatus and process, having a gas injector tube ending at the top of a vertical reaction chamber, improves the thickness and resistivity uniformity of films deposited in CVD process reactors. The injection tube has a plurality of baffles to increase the residence time of reactant gases flowing toward the reaction chamber.