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    Combined ultra-fast x-ray and optical system for thin film measurements
    1.
    发明申请
    Combined ultra-fast x-ray and optical system for thin film measurements 审中-公开
    组合的超快速x射线和光学系统用于薄膜测量

    公开(公告)号：US20060256916A1

    公开(公告)日：2006-11-16

    申请号：US11129282

    申请日：2005-05-13

    申请人： Michael Kotelyanskii ,  Andrey Vertikov ,  Christopher Morath

    发明人： Michael Kotelyanskii ,  Andrey Vertikov ,  Christopher Morath

    IPC分类号： G01N23/20

    CPC分类号： G01N23/20

    摘要： A system comprising a means for generating an optical pump beam pulse and for directing the optical pump beam pulse to a first area of a surface of a sample having a plurality of film layers to generate an acoustic signal, a means for generating an x-ray probe pulse and for directing the x-ray probe pulse to a second area of the surface, a means for detecting an intensity of a diffracted x-ray probe pulse the intensity varying in response to the acoustic signal to form a probe pulse response signal, and a means for calculating an expected transient response to a theoretical acoustic signal propagated through a model of the sample and fitting the probe pulse response to the transient response to derive at least one characteristic of the sample.

    摘要翻译： 一种系统，包括用于产生光泵浦波束脉冲并用于将光泵浦波束脉冲引导到具有多个膜层的样品的表面的第一区域以产生声信号的装置，用于产生X射线 探针脉冲并用于将X射线探针脉冲引导到表面的第二区域;用于检测衍射X射线探针脉冲的强度的装置，该强度响应于声信号而变化，以形成探针脉冲响应信号， 以及用于计算通过样本模型传播的理论声学信号的预期瞬态响应的装置，并将探针脉冲响应拟合到瞬态响应以导出样本的至少一个特性。

    Method and apparatus for decreasing thermal loading and roughness sensitivity in a photoacoustic film thickness measurement system
    2.
    发明授权
    Method and apparatus for decreasing thermal loading and roughness sensitivity in a photoacoustic film thickness measurement system 有权

    公开(公告)号：US06504618B2

    公开(公告)日：2003-01-07

    申请号：US10092866

    申请日：2002-03-06

    申请人： Christopher Morath ,  Andrey Vertikov

    发明人： Christopher Morath ,  Andrey Vertikov

    IPC分类号： G01B1106

    CPC分类号： G01N29/2418 ,  G01B11/0666

    摘要： Disclosed are methods and apparatus for reducing thermal loading of a film disposed on a surface of a sample, such as a semiconductor wafer, while obtaining a measurement of a thickness of the film in an area about a measurement site. The method includes steps of (a) bringing an optical assembly of the measurement system into focus; (b) aligning a beam spot with the measurement site; (c) turning on one of a dither EOM or a dither AOM or a piezo-electric dither assembly to sweep the beam spot in an area about the measurement site, thereby reducing the thermal loading within the measurement site; (d) making a measurement by obtaining a signal representing an average for the film under the area; (e) recording the measurement data; and (f) analyzing the measurement data to determine an average film thickness in the measurement area.

    Threshold determination in an inspection system
    10.
    发明授权
    Threshold determination in an inspection system 有权
    检查系统中的阈值确定

    公开(公告)号：US08260035B2

    公开(公告)日：2012-09-04

    申请号：US11525527

    申请日：2006-09-22

    申请人： Mehmet Tek ,  Timothy Tiemeyer ,  Andrey Vertikov

    发明人： Mehmet Tek ,  Timothy Tiemeyer ,  Andrey Vertikov

    IPC分类号： G06K9/00

    CPC分类号： G06K9/2036 ,  G01N21/4738 ,  G01N21/9501 ,  G01N2021/4711 ,  G01N2021/4735 ,  G01N2021/8861 ,  G06K9/03 ,  G06K9/40 ,  G06K9/6277

    摘要： A method and system for inspecting a surface of a semiconductor workpiece comprises providing a surface inspection system and using the surface inspection apparatus to cause laser light to impinge upon a test location on the workpiece surface and thereby cause the laser light to emerge from the surface as returned light comprising at least one of reflected light and scatter light; collecting the returned light and generating a signal from the returned and collected light, the signal comprising a signal value representative of a characteristic of the workpiece surface at the test location; providing a plurality of threshold candidates and causing the surface inspection system to select a threshold from among the plurality of threshold candidates; comparing the threshold to the signal value to obtain a difference value; using the difference value to assess the characteristic of the workpiece surface at the test location; and using the surface inspection system to automatically cause the method to be repeated for a plurality of test locations on the workpiece surface.

    摘要翻译： 用于检查半导体工件的表面的方法和系统包括提供表面检查系统并使用表面检查装置使激光照射到工件表面上的测试位置，从而使激光从表面出射为 返回的光包括反射光和散射光中的至少一种; 收集所返回的光并从返回和收集的光产生信号，所述信号包括代表在测试位置处的工件表面的特性的信号值; 提供多个阈值候选，并使所述表面检查系统从所述多个阈值候选中选择阈值; 将阈值与信号值进行比较以获得差值; 使用差值来评估测试位置处工件表面的特性; 并且使用表面检查系统自动地对工件表面上的多个测试位置重复该方法。