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1.发明申请公开(公告)号：US20090130821A1
公开(公告)日：2009-05-21
申请号：US12249812
申请日：2008-10-10
申请人： Damon K. Cox , Todd J. Egan , Michael X. Yang , Jeffrey C. Hudgens , Ingrid B. Peterson , Michael R. Rice
发明人： Damon K. Cox , Todd J. Egan , Michael X. Yang , Jeffrey C. Hudgens , Ingrid B. Peterson , Michael R. Rice
CPC分类号： H01L23/544 , H01L24/94 , H01L24/96 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2223/54453 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01322 , H01L2924/12044 , Y10T156/17
摘要： A method, a system and a computer readable medium for three dimensional packaging with wafer-level bonding and chip-level repair. A first wafer is provided having a first plurality of chips. A second wafer is provided having a second plurality of chips. At least one chip is removed from the second wafer while retaining the relative alignment of the remaining chips in the second wafer. The first and second wafers are aligned and joined with wafer-to-wafer techniques. Where a bad chip having a relative physical position within the second wafer corresponding to a relative physical position within the first wafer of a good chip is removed, a good chip may be aligned and bonded to the first wafer using die-to-wafer techniques.
摘要翻译： 一种用于具有晶片级结合和芯片级修复的三维封装的方法，系统和计算机可读介质。 提供具有第一多个芯片的第一晶片。 提供具有第二多个芯片的第二晶片。 至少一个芯片从第二晶片移除，同时保持剩余芯片在第二晶片中的相对对准。 第一和第二晶片被对准并且与晶片到晶片技术接合。 如果去除了与第二晶片内的相对物理位置对应于良好芯片的第一晶片内的相对物理位置的不良芯片，则可以使用晶片到晶片技术将良好的芯片对准并结合到第一晶片。
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公开(公告)号：US08078304B2
公开(公告)日：2011-12-13
申请号：US12176381
申请日：2008-07-20
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/37224 , G05B2219/45061 , H01L21/67742 , H01L21/67766 , Y02P90/22 , Y10S414/135
摘要： Electronic device manufacturing systems and methods are provided. In some aspects, a system having a dual-mode robot is provided which is disposed within a system component (e.g., a factory interface or transfer chamber) and adapted to operate in a first mode and a second mode. In the first mode, the robot may transfer a substrate between components of the system (e.g., between a carrier and a process chamber or chamber to chamber) and in the second mode, the robot may execute a process motion profile (e.g., metrology).
摘要翻译： 提供电子设备制造系统和方法。 在一些方面，提供一种具有双模式机器人的系统，其被布置在系统部件（例如，工厂接口或传送室）内并且适于在第一模式和第二模式中操作。 在第一模式中，机器人可以在系统的部件之间（例如，在载体和处理室或室到室之间）传送基板，并且在第二模式中，机器人可以执行过程运动曲线（例如，计量） 。
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公开(公告)号：US20090024241A1
公开(公告)日：2009-01-22
申请号：US12176381
申请日：2008-07-20
CPC分类号： G05B19/41875 , G05B2219/37224 , G05B2219/45061 , H01L21/67742 , H01L21/67766 , Y02P90/22 , Y10S414/135
摘要： Electronic device manufacturing systems and methods are provided. In some aspects, a system having a dual-mode robot is provided which is disposed within a system component (e.g., a factory interface or transfer chamber) and adapted to operate in a first mode and a second mode. In the first mode, the robot may transfer a substrate between components of the system (e.g., between a carrier and a process chamber or chamber to chamber) and in the second mode, the robot may execute a process motion profile (e.g., metrology).
摘要翻译： 提供电子设备制造系统和方法。 在一些方面，提供一种具有双模式机器人的系统，其被布置在系统部件（例如，工厂接口或传送室）内并且适于在第一模式和第二模式中操作。 在第一模式中，机器人可以在系统的部件之间（例如，在载体和处理室或室到室之间）传送基板，并且在第二模式中，机器人可以执行过程运动曲线（例如，计量） 。
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公开(公告)号：US08123881B2
公开(公告)日：2012-02-28
申请号：US12248204
申请日：2008-10-09
IPC分类号： B32B37/00
CPC分类号： H01L21/68 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01077 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T156/10 , Y10T156/1702
摘要： A method, a system and a computer readable medium having a set of instructions stored thereon for die-to-robot alignment for die-to-substrate bonding are described. First, a robot is aligned with a substrate to provide a pre-aligned robot. Next, a die is aligned with the pre-aligned robot to provide a robot-aligned die. Finally, the robot-aligned die is bonded to a region of the substrate. The substrate is held stationary immediately following the aligning of the robot with the substrate and at least until the robot-aligned die is bonded to the region of the substrate.
摘要翻译： 描述了一种方法，系统和计算机可读介质，其具有存储在其上的用于管芯到基板结合的管芯到机器人对准的一组指令。 首先，机器人与基板对准以提供预对准的机器人。 接下来，模具与预对准机器人对准以提供机器人对准的模具。 最后，将机器人对准的管芯结合到衬底的区域。 在机器人与基板对准之后，基板保持静止，并且至少直到机器人对准的管芯结合到基板的区域。
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公开(公告)号：US20090126851A1
公开(公告)日：2009-05-21
申请号：US12248204
申请日：2008-10-09
IPC分类号： B32B37/12
CPC分类号： H01L21/68 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01077 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T156/10 , Y10T156/1702
摘要： A method, a system and a computer readable medium having a set of instructions stored thereon for die-to-robot alignment for die-to-substrate bonding are described. First, a robot is aligned with a substrate to provide a pre-aligned robot. Next, a die is aligned with the pre-aligned robot to provide a robot-aligned die. Finally, the robot-aligned die is bonded to a region of the substrate. The substrate is held stationary immediately following the aligning of the robot with the substrate and at least until the robot-aligned die is bonded to the region of the substrate.
摘要翻译： 描述了一种方法，系统和计算机可读介质，其具有存储在其上的用于管芯到基板结合的管芯到机器人对准的一组指令。 首先，机器人与基板对准以提供预对准的机器人。 接下来，模具与预对准机器人对准以提供机器人对准的模具。 最后，将机器人对准的管芯结合到衬底的区域。 在机器人与基板对准之后，基板保持静止，并且至少直到机器人对准的管芯结合到基板的区域。
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公开(公告)号：US08322963B2
公开(公告)日：2012-12-04
申请号：US12422867
申请日：2009-04-13
IPC分类号： B65H5/00
CPC分类号： H01L21/67219 , H01L21/67259 , H01L21/67742 , Y10T74/20305
摘要： Embodiments of the present invention generally provide an apparatus and method for transferring substrates in a processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint when compared to conventional techniques.
摘要翻译： 本发明的实施例通常提供一种用于在处理系统（例如，集群工具）中传送基板的装置和方法，所述处理系统具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片） 历史），与传统技术相比，占地面积减少。
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7.发明授权公开(公告)号：US08020689B2
公开(公告)日：2011-09-20
申请号：US12430032
申请日：2009-04-24
申请人： Michael R. Rice , Eric A. Englhardt , Robert B. Lowrance , Martin R. Elliot , Jeffrey C. Hudgens
发明人： Michael R. Rice , Eric A. Englhardt , Robert B. Lowrance , Martin R. Elliot , Jeffrey C. Hudgens
IPC分类号： B65G47/34
CPC分类号： H01L21/68707 , H01L21/6773 , H01L21/67733
摘要： A break-away mounting system for a continuous-motion, high-speed position conveyor system is disclosed. A support cradle may be suspended from a conveyor belt such that the support cradle maintains a fixed position and orientation relative to at least one point on the conveyor belt without inducing appreciable stress on the conveyor belt, the support cradle, or the coupling between the conveyor belt and the support cradle. The mount may include a leading rotatable bearing attached to the support cradle which may releasably engage a first key attached to the conveyor belt, the rotatable bearing adapted to accommodate rotational forces applied to the support cradle by the conveyor belt. The mount may also include a slide bearing attached to the support cradle which may releasably engage a second key attached to the conveyor belt, the slide bearing adapted to accommodate longitudinal forces applied to the support cradle by the conveyor belt.
摘要翻译： 公开了一种用于连续运动的高速位置传送器系统的分离安装系统。 支撑托架可以从传送带悬挂，使得支撑托架相对于传送带上的至少一个点保持固定的位置和方向，而不会在传送带，支撑架或传送带之间的联接中引起明显的应力 皮带和支撑架。 安装件可以包括附接到支撑架的前导可旋转轴承，其可释放地接合附接到传送带的第一键，该旋转轴承适于容纳由传送带施加到支撑支架的旋转力。 安装件还可以包括附接到支撑支架的滑动轴承，其可以可释放地接合附接到传送带的第二键，滑动轴承适于容纳由传送带施加到支撑支架的纵向力。
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公开(公告)号：US07819079B2
公开(公告)日：2010-10-26
申请号：US11530297
申请日：2006-09-08
申请人： Eric A. Englhardt , Michael R. Rice , Jeffrey C. Hudgens , Steve Hongkham , Jay D. Pinson , Mohsen Salek , Charles Carlson , William T Weaver , Helen R. Armer
发明人： Eric A. Englhardt , Michael R. Rice , Jeffrey C. Hudgens , Steve Hongkham , Jay D. Pinson , Mohsen Salek , Charles Carlson , William T Weaver , Helen R. Armer
IPC分类号： B05C13/02 , H01L21/677 , C23C14/00
CPC分类号： G03F7/70991 , H01L21/67173 , H01L21/67178 , H01L21/67225 , H01L21/67742 , H01L21/67745
摘要： The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that is easily configurable, has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, and then certain portions of the photosensitive material are removed in a developing process completed in the cluster tool.
摘要翻译： 本发明总体上提供了一种用于使用容易配置的多室处理系统（例如，集群工具）处理衬底的装置和方法，具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片 处理历史（或晶圆历史），减少占地面积。 在一个实施例中，簇工具适于执行其中衬底被感光材料涂覆的轨道光刻工艺，然后转移到步进/扫描器，其将感光材料暴露于某种形式的辐射以形成图案 感光材料，然后在簇组工具中完成的显影过程中去除感光材料的某些部分。
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9.发明授权公开(公告)号：US07503448B2
公开(公告)日：2009-03-17
申请号：US11554969
申请日：2006-10-31
申请人： Michael R. Rice , Eric A. Englhardt , Robert B. Lowrance , Martin R. Elliott , Jeffrey C. Hudgens
发明人： Michael R. Rice , Eric A. Englhardt , Robert B. Lowrance , Martin R. Elliott , Jeffrey C. Hudgens
IPC分类号： B65G17/20
CPC分类号： H01L21/68707 , H01L21/6773 , H01L21/67733
摘要： A break-away mounting system for a continuous-motion, high-speed position conveyor system is disclosed. A support cradle may be suspended from a conveyor belt such that the support cradle maintains a fixed position and orientation relative to at least one point on the conveyor belt without inducing appreciable stress on the conveyor belt, the support cradle, or the coupling between the conveyor belt and the support cradle. The mount may include a leading rotatable bearing attached to the support cradle which may releasably engage a first key attached to the conveyor belt, the rotatable bearing adapted to accommodate rotational forces applied to the support cradle by the conveyor belt. The mount may also include a slide bearing attached to the support cradle which may releasably engage a second key attached to the conveyor belt, the slide bearing adapted to accommodate longitudinal forces applied to the support cradle by the conveyor belt.
摘要翻译： 公开了一种用于连续运动的高速位置传送器系统的分离安装系统。 支撑托架可以从传送带悬挂，使得支撑托架相对于传送带上的至少一个点保持固定的位置和方向，而不会在传送带，支撑架或传送带之间的联接中引起明显的应力 皮带和支撑架。 安装件可以包括附接到支撑架的前导可旋转轴承，其可释放地接合附接到传送带的第一键，该旋转轴承适于容纳由传送带施加到支撑支架的旋转力。 安装件还可以包括附接到支撑支架的滑动轴承，其可以可释放地接合附接到传送带的第二键，滑动轴承适于容纳由传送带施加到支撑支架的纵向力。
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公开(公告)号：US20080187414A1
公开(公告)日：2008-08-07
申请号：US12100388
申请日：2008-04-09
申请人： Martin R. Elliott , Michael R. Rice , Robert B. Lowrance , Jeffrey C. Hudgens , Eric A. Englhardt
发明人： Martin R. Elliott , Michael R. Rice , Robert B. Lowrance , Jeffrey C. Hudgens , Eric A. Englhardt
IPC分类号： H01L21/677
CPC分类号： H01L21/67775 , Y10S414/14
摘要： In one aspect, a substrate loading station for a processing tool includes plural load ports. Each load port is operatively coupled to the processing tool and has a mechanism for opening a substrate carrier. A carrier handler transports substrate carriers from a factory exchange location to the load ports without placing the carriers on any carrier support location other than the load ports. Numerous other aspects are provided.
摘要翻译： 一方面，用于处理工具的基板装载站包括多个装载端口。 每个负载端口可操作地耦合到处理工具并且具有用于打开衬底载体的机构。 载体处理器将基板载体从工厂交换位置传送到负载端口，而不将载体放置在除负载端口之外的任何载体支撑位置上。 提供了许多其他方面。
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