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    Layered structures on thin substrates
    1.
    发明申请
    Layered structures on thin substrates 有权
    薄基底上的分层结构

    公开(公告)号：US20070148416A1

    公开(公告)日：2007-06-28

    申请号：US11318975

    申请日：2005-12-27

    申请人： Michal Wolkin ,  Ana Arias

    发明人： Michal Wolkin ,  Ana Arias

    IPC分类号： B41M5/00

    CPC分类号： B41M5/52 ,  B05D5/12 ,  G01K7/16 ,  G01K17/006 ,  G01K2211/00 ,  H01L21/02565 ,  H05K3/048 ,  H05K3/061 ,  H05K3/12 ,  Y10T428/24802

    摘要： A thin substrate has a layered structure on one surface, and can also have a layered structure on the other. Each layered structure can include a part of at least one patterned layer that, if patterned by photolithography, would frequently result in damage to the substrate due to fragility. For example, the substrate could be a 3 mil (76.2 μm) or thinner polyimide film and one patterned layer could be a semiconductor material such as vanadium oxide, while another could be metal in electrical contact with semiconductor material. The layer part, however, can be patterned by a printing operation or can include a printed patterned artifact such as an uneven boundary or an alignment. The printing operation can be direct printing or printing of a mask for etching or liftoff or both. The layered structure can include an array of cells, each with layer parts on each substrate surface.

    摘要翻译： 薄基板在一个表面上具有层状结构，并且另外可以具有层状结构。 每个分层结构可以包括至少一个图案化层的一部分，如果通过光刻图案，则会由于脆性而频繁地导致对基底的损伤。 例如，衬底可以是3密耳（76.2μm）或更薄的聚酰亚胺膜，并且一个图案化层可以是诸如氧化钒的半导体材料，而另一个可以是与半导体材料电接触的金属。 然而，层部分可以通过打印操作来图案化，或者可以包括印刷的图案化伪像，例如不均匀边界或对准。 打印操作可以是直接打印或打印用于蚀刻或剥离的掩模或两者。 层状结构可以包括每个在每个衬底表面上具有层部分的单元阵列。

    Passive electronic devices
    2.
    发明申请
    Passive electronic devices 有权
    被动电子设备

    公开(公告)号：US20070145362A1

    公开(公告)日：2007-06-28

    申请号：US11318967

    申请日：2005-12-27

    申请人： Michal Wolkin ,  Ana Arias

    发明人： Michal Wolkin ,  Ana Arias

    IPC分类号： B44C1/22 ,  H01L21/302 ,  C23F1/00 ,  H01L29/10 ,  H01L21/20

    CPC分类号： G01N25/20 ,  G01K17/006 ,  G01K2211/00 ,  H01C7/006 ,  H01C7/008 ,  H01C17/075 ,  H01L27/16 ,  H01L28/20

    摘要： A passive electronic device includes layers of a layered structure on a support surface. The device can include a first layer part that includes electrically conductive or semiconductive material and that has a contact surface. The device can also include second layer parts that include electrically conductive material and are in electrical contact with the contact surface, with a subset electrically connectible to external circuitry. At least one of the parts of the two layers can be produced by a printing operation or can include a printed patterned artifact such as an uneven boundary or an alignment. The printing operation can be direct printing or printing of a mask for etching or liftoff or both. The device could, for example, be a resistive device, such as a device with resistance varying in response to non-electrical stimuli, or a conductive device, such as with a contact pad for a pogo pin.

    摘要翻译： 无源电子设备包括在支撑表面上的分层结构的层。 该装置可以包括包括导电或半导体材料并且具有接触表面的第一层部分。 该装置还可以包括包括导电材料并与接触表面电接触的第二层部分，其中子集可电连接到外部电路。 可以通过打印操作来产生两层的至少一个部分，或者可以包括印刷图案化伪像，例如不均匀边界或对准。 打印操作可以是直接打印或打印用于蚀刻或剥离的掩模或两者。 该装置可以例如是电阻性装置，例如具有响应于非电刺激而变化的电阻的装置，或导电装置，例如用于弹簧销的接触垫。

    Producing layered structures using printing
    3.
    发明申请
    Producing layered structures using printing 有权
    使用印刷生产分层结构

    公开(公告)号：US20070147473A1

    公开(公告)日：2007-06-28

    申请号：US11318926

    申请日：2005-12-27

    申请人： Michal Wolkin ,  Ana Arias

    发明人： Michal Wolkin ,  Ana Arias

    IPC分类号： G01K1/00

    CPC分类号： H05B3/00 ,  G01K7/22 ,  G01K17/006 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124

    摘要： A layered structure is on a support structure's surface. The layered structure can include a component that responds electrically to thermal signals, such as a thermistor, and can also include a layer part that has a printed patterned artifact such as an uneven boundary or an alignment. The support structure can be a polymer layer such as polyimide, and a thermistor can include vanadium oxide with a printed patterned artifact. An array can include a layered structure with thermal sensor cells, at least one of which includes a printed patterned artifact. A layered structure can be produced by depositing a first layer, printing a mask, removing the exposed part of the first layer, depositing a second layer, and lifting off part of the second layer, leaving part of the second layer next to part of the first layer.

    摘要翻译： 分层结构在支撑结构的表面上。 层状结构可以包括对诸如热敏电阻之类的热信号进行电响应的部件，并且还可以包括具有印刷图案化伪像的层部分，例如不均匀边界或对准。 支撑结构可以是诸如聚酰亚胺的聚合物层，并且热敏电阻可以包括具有印刷图案的假象的氧化钒。 阵列可以包括具有热传感器单元的分层结构，其中至少一个包括印刷图案的伪影。 可以通过沉积第一层，印刷掩模，去除第一层的暴露部分，沉积第二层和提起第二层的一部分来制造分层结构，将第二层的一部分留在第二层的一部分上 第一层

    Detecting defective ejector in digital lithography system
    5.
    发明申请
    Detecting defective ejector in digital lithography system 失效
    在数字光刻系统中检测有缺陷的喷射器

    公开(公告)号：US20070046705A1

    公开(公告)日：2007-03-01

    申请号：US11218416

    申请日：2005-09-01

    申请人： William Wong ,  Steven Ready ,  Ana Arias

    发明人： William Wong ,  Steven Ready ,  Ana Arias

    IPC分类号： B41J29/38

    CPC分类号： B41J29/393

    摘要： A digital lithography system prints a large-area electronic device by dividing the overall device printing process into a series of discrete feature printing sub-processes, where each feature printing sub-process involves printing both a predetermined portion (feature) of the device in a designated substrate area, and an associated test pattern in a designated test area that is remote from the feature. At the end of each feature printing sub-process, the test pattern is analyzed, e.g., using a camera and associated imaging system, to verify that the test pattern has been successfully printed. A primary ejector is used until an unsuccessfully printed test pattern is detected, at which time a secondary (reserve) ejector replaces the primary ejector and reprints the feature associated with the defective test pattern. When multiple printheads are used in parallel, analysis of the test pattern is used to efficiently identify the location of a defective ejector.

    摘要翻译： 数字光刻系统通过将整个设备打印过程划分成一系列离散特征打印子过程来打印大面积电子设备，其中每个特征打印子过程涉及将设备的预定部分（特征）打印在一个 指定的基板区域以及远离该特征的指定测试区域中的关联测试图案。 在每个特征打印子过程结束时，分析测试图案，例如使用相机和相关联的成像系统来验证测试图案是否已被成功打印。 使用初级喷射器，直到检测到未成功打印的测试图案，此时次要（预留）喷射器取代主喷射器并重印与缺陷测试图案相关的特征。 当并行使用多个打印头时，使用测试图案的分析来有效地识别有缺陷的喷射器的位置。

    Printed transistors
    6.
    发明申请
    Printed transistors 有权
    印刷晶体管

    公开(公告)号：US20060115945A1

    公开(公告)日：2006-06-01

    申请号：US11332577

    申请日：2006-01-12

    申请人： Michael Chabinyc ,  Ana Arias

    发明人： Michael Chabinyc ,  Ana Arias

    IPC分类号： H01L21/8238

    CPC分类号： H01L51/0004 ,  B82Y10/00 ,  B82Y30/00 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/283 ,  H01L29/66742 ,  H01L51/0012 ,  H01L51/0541 ,  H01L51/0545

    摘要： A transistor is formed by applying modifier coatings to source and drain contacts and/or to the channel region between those contacts. The modifier coatings are selected to adjust the surface energy pattern in the source/drain/channel region such that semiconductor printing fluid is not drawn away from the channel region. For example, the modifier coatings for the contacts can be selected to have substantially the same surface energy as the modifier coating for the channel region. Semiconductor printing fluid deposited on the channel region therefore settles in place (due to the lack of a surface energy differential) and forms a relatively thick active semiconductor region between the contacts. Alternatively, the modifier coatings can be selected to have lower surface energies than the modifier coating in the channel region, which actually causes semiconductor printing fluid to be drawn towards the channel region.

    摘要翻译： 通过将改性剂涂层施加到源极和漏极触点和/或向这些触点之间的沟道区域施加晶体管。 选择改性剂涂层以调节源极/漏极/沟道区域中的表面能量图案，使得半导体印刷液体不被从通道区域拉出。 例如，可以选择用于触点的改性剂涂层以具有与用于沟道区的改性涂层基本上相同的表面能。 沉积在通道区域上的半导体印刷液体因此沉降就位（由于缺少表面能量差），并且在触点之间形成相对厚的有源半导体区域。 或者，可以选择改性剂涂层以具有比通道区域中的改性剂涂层更低的表面能，其实际上导致半导体印刷液体被拉向通道区域。

    Method of manufacturing fine features for thin film transistors
    8.
    发明申请
    Method of manufacturing fine features for thin film transistors 有权
    制造薄膜晶体管精细特征的方法

    公开(公告)号：US20070221611A1

    公开(公告)日：2007-09-27

    申请号：US11388731

    申请日：2006-03-24

    申请人： Eugene Chow ,  William Wong ,  Michael Chabinyc ,  Ana Arias

    发明人： Eugene Chow ,  William Wong ,  Michael Chabinyc ,  Ana Arias

    IPC分类号： H01B13/00 ,  C23F1/00

    CPC分类号： H01L29/4908 ,  H01L27/124 ,  H01L27/1292

    摘要： A process for fabricating fine features such as small gate electrodes on a transistor. The process involves the jet-printing of a mask and the plating of a metal to fabricate sub-pixel and standard pixel size features in one layer. Printing creates a small sub-pixel size gap mask for plating a fine feature. A second printed mask may be used to protect the newly formed gate and etch standard pixel size lines connecting the small gates.

    摘要翻译： 一种在晶体管上制造诸如小栅电极的精细特征的工艺。 该方法涉及一种掩模的喷墨印刷和金属镀层，以在一层中制造亚像素和标准像素尺寸特征。 打印创建一个小的子像素大小的间隙掩模，用于电镀精细特征。 可以使用第二印刷掩模来保护新形成的栅极并蚀刻连接小栅极的标准像素尺寸线。

    Solar cell production using non-contact patterning and direct-write metallization
    9.
    发明申请
    Solar cell production using non-contact patterning and direct-write metallization 审中-公开
    使用非接触式图案化和直接写入金属化的太阳能电池生产

    公开(公告)号：US20070169806A1

    公开(公告)日：2007-07-26

    申请号：US11336714

    申请日：2006-01-20

    申请人： David Fork ,  Patrick Maeda ,  Ana Arias ,  Douglas Curry

    发明人： David Fork ,  Patrick Maeda ,  Ana Arias ,  Douglas Curry

    IPC分类号： H01L31/00

    CPC分类号： H01L31/1876 ,  H01L31/022425 ,  Y02E10/50 ,  Y02P70/521

    摘要： Photovoltaic devices (i.e., solar cells) are formed using non-contact patterning apparatus (e.g., a laser-based patterning systems) to define contact openings through a passivation layer, and direct-write metallization apparatus (e.g., an inkjet-type printing or extrusion-type deposition apparatus) to deposit metallization into the contact openings and over the passivation surface. The metallization includes two portions: a contact (e.g., silicide-producing) material is deposited into the contact openings, then a highly conductive metal is deposited on the contact material and between the contact holes. The device wafers are transported between the patterning and metallization apparatus in hard tooled registration using a conveyor mechanism. Optional sensors are utilized to align the patterning and metallization apparatus to the contact openings. An extrusion-type apparatus is used to form grid lines having a high aspect central metal line that is supported on each side by a transparent material.

    摘要翻译： 使用非接触式图案形成装置（例如，基于激光的图案形成系统）来形成光电装置（即，太阳能电池），以限定通过钝化层的接触开口，以及直接写入金属化装置（例如喷墨型印刷或 挤出型沉积设备）以将金属化沉积到接触开口中并在钝化表面上。 金属化包括两部分：将接触（例如，产生硅化物）的材料沉积到接触开口中，然后在接触材料上和接触孔之间沉积高导电性金属。 使用传送机构在硬模具配准中，在图案化和金属化装置之间输送装置晶片。 使用可选的传感器来将图案化和金属化装置对准接触开口。 使用挤出型装置形成具有高方位中心金属线的网格线，每条边由透明材料支撑。

    Electronic device with unique encoding
    10.
    发明申请
    Electronic device with unique encoding 审中-公开
    电子设备具有独特的编码

    公开(公告)号：US20070138462A1

    公开(公告)日：2007-06-21

    申请号：US11313498

    申请日：2005-12-21

    申请人： Robert Street ,  Ana Arias

    发明人： Robert Street ,  Ana Arias

    IPC分类号： H01L29/08

    CPC分类号： H01L51/0005 ,  H01L27/1285 ,  H01L27/1288 ,  H01L27/1292 ,  H01L27/283 ,  H01L51/0545

    摘要： An electronic device comprising a thin film transistor (TFT) array and manufacturing methods thereof according to various embodiments. Jet-printed material is deposited on selected partially formed transistors to form completed transistors. Thus, a selected number of the TFTs are connected into the circuit while the remainder of the TFTs are not connected. An electronic read-out of the array identifies the specific array by distinguishing the connected TFTs from the unconnected ones. For a TFT array with n elements there are 2n alternative configurations; therefore, a relatively small number of TFTs can uniquely identify a huge number of devices. Such uniquely encoded devices have applications for encryption, identification and personalization of electronic systems.

    摘要翻译： 一种包括薄膜晶体管（TFT）阵列的电子器件及其制造方法。 喷射印刷材料沉积在选定的部分形成的晶体管上以形成完整的晶体管。 因此，选择数量的TFT连接到电路中，而其余TFT不连接。 阵列的电子读出通过将连接的TFT与未连接的TFT区分开来识别特定的阵列。 对于具有n个元件的TFT阵列，存在2个替代配置; 因此，相对较少的TFT可以唯一地识别大量的设备。 这种唯一编码的设备具有用于电子系统的加密，识别和个性化的应用。