公开(公告)号：US20090072370A1

公开(公告)日：2009-03-19

申请号：US12205057

申请日：2008-09-05

申请人： Michio HORIUCHI ,  Fumimasa KATAGIRI ,  Shigeaki SUGANUMA ,  Yasue TOKUTAKE ,  Jun YOSHIKE

发明人： Michio HORIUCHI ,  Fumimasa KATAGIRI ,  Shigeaki SUGANUMA ,  Yasue TOKUTAKE ,  Jun YOSHIKE

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49861 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2223/6611 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73204 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19051 ,  H01L2924/19107 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K3/222 ,  H05K3/4046 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2203/0733 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00

摘要： There is provided a multilayer wiring substrate on which at least one semiconductor element is mounted. The multilayer wiring substrate includes: a baseboard; a first wiring layer formed on the baseboard and having a plurality of first wiring portions; an insulating layer formed on the baseboard; a second wiring layer formed on the insulating layer and having a plurality of second wiring portions, the second wiring portions being electrically connected to each other via a conductor wire, the conductor wire being arranged within the insulating layer three-dimensionally in a curved manner; and conductor portions configured to pass through the insulating layer and connecting the first wiring portions and the second wiring portions.

摘要翻译： 提供了一种其上安装有至少一个半导体元件的多层布线基板。 多层布线基板包括：基板; 形成在所述基板上并具有多个第一布线部的第一布线层; 形成在基板上的绝缘层; 形成在所述绝缘层上并且具有多个第二布线部的第二布线层，所述第二布线部经由导体布线彼此电连接，所述导线以三维方式弯曲地布置在所述绝缘层内; 以及导体部，被配置为穿过所述绝缘层并连接所述第一布线部和所述第二布线部。