公开(公告)号：US20090072370A1

公开(公告)日：2009-03-19

申请号：US12205057

申请日：2008-09-05

申请人： Michio HORIUCHI ,  Fumimasa KATAGIRI ,  Shigeaki SUGANUMA ,  Yasue TOKUTAKE ,  Jun YOSHIKE

发明人： Michio HORIUCHI ,  Fumimasa KATAGIRI ,  Shigeaki SUGANUMA ,  Yasue TOKUTAKE ,  Jun YOSHIKE

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49861 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2223/6611 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73204 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19051 ,  H01L2924/19107 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K3/222 ,  H05K3/4046 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2203/0733 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00

摘要： There is provided a multilayer wiring substrate on which at least one semiconductor element is mounted. The multilayer wiring substrate includes: a baseboard; a first wiring layer formed on the baseboard and having a plurality of first wiring portions; an insulating layer formed on the baseboard; a second wiring layer formed on the insulating layer and having a plurality of second wiring portions, the second wiring portions being electrically connected to each other via a conductor wire, the conductor wire being arranged within the insulating layer three-dimensionally in a curved manner; and conductor portions configured to pass through the insulating layer and connecting the first wiring portions and the second wiring portions.

摘要翻译： 提供了一种其上安装有至少一个半导体元件的多层布线基板。 多层布线基板包括：基板; 形成在所述基板上并具有多个第一布线部的第一布线层; 形成在基板上的绝缘层; 形成在所述绝缘层上并且具有多个第二布线部的第二布线层，所述第二布线部经由导体布线彼此电连接，所述导线以三维方式弯曲地布置在所述绝缘层内; 以及导体部，被配置为穿过所述绝缘层并连接所述第一布线部和所述第二布线部。

公开(公告)号：US20090145648A1

公开(公告)日：2009-06-11

申请号：US12323672

申请日：2008-11-26

申请人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Shigeaki SUGANUMA ,  Naoyuki KOIZUMI ,  Fumimasa KATAGIRI

发明人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Shigeaki SUGANUMA ,  Naoyuki KOIZUMI ,  Fumimasa KATAGIRI

IPC分类号： H05K1/18 ,  H01R12/06 ,  B23K37/00

CPC分类号： B23K20/004 ,  B23K1/0016 ,  B23K2101/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/111 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/10287 ,  H01L2924/00012

摘要： A multilayer wiring board is so constituted that: a group of electronic part mounting capture pads are provided on one surface thereof; a first wiring layer formed on an uppermost layer thereof includes a first connection part arranged on the same surface as the surface where the pads are provided, and a second connection part spaced from the first connection part; the pad and the first connection part are electrically connected through a conductor wire, and the conductor wire is provided in a first insulating layer laminated on the first wiring layer; and the first connection part is connected linearly or curvedly to the second connection part through a first wiring pattern.

摘要翻译： 多层布线板的结构是：一组电子部件安装捕获垫设置在其一个表面上; 形成在其最上层的第一布线层包括布置在与设置有焊盘的表面相同的表面上的第一连接部分和与第一连接部分间隔开的第二连接部分; 所述焊盘和所述第一连接部分通过导线电连接，并且所述导线设置在层压在所述第一布线层上的第一绝缘层中; 并且第一连接部分通过第一布线图形线性地或弯曲地连接到第二连接部分。

公开(公告)号：US20090266598A1

公开(公告)日：2009-10-29

申请号：US12394148

申请日：2009-02-27

申请人： Fumimasa KATAGIRI ,  Yasue Tokutake ,  Naoyuki Koizumi ,  Shigeaki Suganuma ,  Michio Horiuchi

发明人： Fumimasa KATAGIRI ,  Yasue Tokutake ,  Naoyuki Koizumi ,  Shigeaki Suganuma ,  Michio Horiuchi

IPC分类号： H05K1/11

CPC分类号： H01L23/49833 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/111 ,  H05K3/103 ,  H05K3/222 ,  H05K2201/09418 ,  H05K2201/09709 ,  H05K2201/10287 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A wiring board includes a plate-shaped resin member; chip connection pads provided in the resin member, the chip connection pads having connection surfaces electrically connected to electrode pads provided on a semiconductor chip, the connection surfaces being situated in substantially the same plane as a first surface of the resin member, the first surface being a side where the semiconductor chip is mounted; pads provided in a portion of the resin member, the portion being situated outside an area where the chip connection pads are formed; lead wirings connected to the pads; and conductive wires sealed by the resin member, the conductive wires electrically connecting the chip connection pads and the pads to each other.

摘要翻译： 布线板包括板状树脂构件; 设置在树脂构件中的芯片连接焊盘，芯片连接焊盘具有电连接到设置在半导体芯片上的电极焊盘的连接表面，连接表面位于与树脂构件的第一表面大致相同的平面中，第一表面为 安装半导体芯片的一侧; 设置在树脂部件的一部分中的焊盘，该部分位于形成芯片连接焊盘的区域的外部; 引线连接到焊盘; 以及由树脂部件密封的导线，导线将芯片连接焊盘和焊盘彼此电连接。

公开(公告)号：US20080299434A1

公开(公告)日：2008-12-04

申请号：US12127974

申请日：2008-05-28

申请人： Fumimasa KATAGIRI ,  Jun Yoshiike ,  Yasue Tokutake ,  Shigeaki Suganuma ,  Michio Horiuchi

发明人： Fumimasa KATAGIRI ,  Jun Yoshiike ,  Yasue Tokutake ,  Shigeaki Suganuma ,  Michio Horiuchi

IPC分类号： H01M8/10 ,  B05D5/12 ,  B32B37/00

CPC分类号： H01M4/8642 ,  B32B38/145 ,  B32B2037/243 ,  B32B2038/168 ,  B32B2457/18 ,  H01M4/8621 ,  H01M4/8885 ,  H01M4/9016 ,  H01M8/1213 ,  Y02P70/56 ,  Y10T156/10

摘要： A solid oxide type fuel cell has a solid electrolyte substrate with a flat plate shape, and a cathode electrode layer is formed in a flat plate shape on one surface of the substrate and an anode electrode layer is formed in a flat plate shape on the other surface. The cathode electrode layer and the anode electrode layer are formed by the same electrode formation material. One or both of the cathode electrode layer and the anode electrode layer contain the electrode formation material and a solid electrolyte, and a concentration of the solid electrolyte included in the cathode electrode layer or the anode electrode layer increases with approach to the solid electrolyte substrate. Also, the solid oxide type fuel cell is formed by simultaneously calcining the solid electrolyte substrate, the cathode electrode layer and the anode electrode layer.

摘要翻译： 固体氧化物型燃料电池具有平板状的固体电解质基板，在基板的一个表面上形成平板状的阴极电极层，而在其他的平板形状上形成阳极电极层 表面。 阴极电极层和阳极电极层由相同的电极形成材料形成。 阴极电极层和阳极电极层中的一个或两个包含电极形成材料和固体电解质，并且包含在阴极电极层或阳极电极层中的固体电解质的浓度随着接近固体电解质基底而增加。 此外，固体氧化物型燃料电池通过同时煅烧固体电解质基板，阴极电极层和阳极电极层而形成。

公开(公告)号：US20110104858A1

公开(公告)日：2011-05-05

申请号：US12913105

申请日：2010-10-27

申请人： Fumimasa KATAGIRI ,  Akihiko Tateiwa

发明人： Fumimasa KATAGIRI ,  Akihiko Tateiwa

IPC分类号： H01L21/60

CPC分类号： H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor element sealed substrate including a semiconductor element covered by an insulating layer is fabricated while a wiring substrate formed by stacking wiring layers is fabricated by a process different from the process of fabricating the semiconductor element sealed substrate. Next, the semiconductor element sealed substrate and the wiring substrate are stacked on each other in such a way that electrode terminals of the semiconductor element and corresponding conductive bumps on the outermost wiring layer face each other. The electrode terminals and the conductive bumps are thus connected to each other.

摘要翻译： 制造包含由绝缘层覆盖的半导体元件的半导体元件密封基板，同时通过与制造半导体元件密封基板的工艺不同的工艺制造通过堆叠布线层形成的布线基板。 接下来，半导体元件密封基板和布线基板彼此堆叠，使得半导体元件的电极端子和最外面布线层上的相应的导电凸块彼此面对。 因此，电极端子和导电凸块彼此连接。

公开(公告)号：US20110062578A1

公开(公告)日：2011-03-17

申请号：US12856934

申请日：2010-08-16

申请人： Fumimasa KATAGIRI ,  Teruaki Chino ,  Akihiko Tateiwa

发明人： Fumimasa KATAGIRI ,  Teruaki Chino ,  Akihiko Tateiwa

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/4334 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/18162 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2224/19 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor chip having a connection electrode on a surface side, and a resin substrate sealing a periphery of the semiconductor chip and formed to have a thickness from a back surface of the semiconductor chip to a lower side thereof, and the resin substrate whose lower surface is positioned to a lower side than the back surface of the semiconductor chip. A wiring layer is connected directly to the connection electrode of the semiconductor chip without the intervention of solder.

摘要翻译： 半导体器件包括具有表面侧的连接电极的半导体芯片和密封半导体芯片周围的树脂基板，其形成为具有从半导体芯片的背面到其下侧的厚度，并且树脂 基板，其下表面位于比半导体芯片的背面更低的一侧。 布线层直接连接到半导体芯片的连接电极，而不需要焊料的介入。

公开(公告)号：US20100252921A1

公开(公告)日：2010-10-07

申请号：US12750854

申请日：2010-03-31

申请人： Fumimasa KATAGIRI

发明人： Fumimasa KATAGIRI

IPC分类号： H01L23/52 ,  H01L21/60 ,  H01L23/522

CPC分类号： H01L21/568 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/82 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24247 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes: a semiconductor element that has a first surface on which an electrode terminal is formed and a second surface opposite to the first surface; a resin mold portion in which the semiconductor element is embedded and that has a third surface exposing the first surface and a fourth surface opposite to the third surface; and a wiring layer formed on the third surface and the first surface, wherein a plurality of conducting portions are provided in the resin mold portion, which penetrate the resin mold portion along a thickness direction thereof to be electrically connected to the wiring layer.

摘要翻译： 半导体器件包括：具有形成电极端子的第一表面和与第一表面相对的第二表面的半导体元件; 树脂模具部分，其中半导体元件被嵌入并且具有暴露第一表面的第三表面和与第三表面相对的第四表面; 以及形成在所述第三表面和所述第一表面上的布线层，其中在所述树脂模制部分中设置有多个导电部分，所述多个导电部分沿着其厚度方向穿过所述树脂模制部分以与所述布线层电连接。