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1.发明授权Acoustic wave device, duplexer, communication module, communication apparatus, and manufacturing method for acoustic wave device 有权声波装置，双工器，通信模块，通信装置和声波装置的制造方法公开(公告)号：US08258891B2
公开(公告)日：2012-09-04
申请号：US12608397
申请日：2009-10-29
申请人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
发明人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
CPC分类号： H03H3/10 , H03H9/0222 , H03H9/25 , Y10T29/42 , Y10T29/49005
摘要： An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.
摘要翻译： 声波装置包括：压电基板，布置在压电基板上的叉指电极，布置在叉指电极之间的第一电介质元件，覆盖指状电极和第一电介质元件的第二电介质元件和已形成的调节元件 在第一电介质元件上。 调整元件由比重大于第一电介质元件和第二电介质元件的比重的材料形成。
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2.发明申请ELASTIC WAVE DEVICE, FILTER DEVICE, COMMUNICATION MODULE AND COMMUNICATION APPARATUS 审中-公开弹性波装置，滤波装置，通信模块和通信装置公开(公告)号：US20090152982A1
公开(公告)日：2009-06-18
申请号：US12336139
申请日：2008-12-16
申请人： Michio MIURA , Suguru Warashina , Takashi Matsuda
发明人： Michio MIURA , Suguru Warashina , Takashi Matsuda
IPC分类号： H01L41/053
CPC分类号： H03H9/02559 , H03H9/02834
摘要： An elastic wave device including a piezoelectric substrate, comb-like electrodes formed on the piezoelectric substrate, and a dielectric layer formed on the piezoelectric substrate. The dielectric layer formed on the piezoelectric substrate covers the comb-like electrodes and the thickness of the dielectric layer formed on the piezoelectric substrate is larger than the sum of the thickness of the comb-like electrodes and the thickness of the dielectric layer formed on the comb-like electrodes.
摘要翻译： 一种弹性波装置，包括压电基片，形成在压电基片上的梳状电极和形成在压电基片上的电介质层。 形成在压电基板上的电介质层覆盖梳状电极，并且形成在压电基板上的电介质层的厚度大于梳状电极的厚度和形成在其上的电介质层的厚度之和 梳状电极。
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3.发明授权Acoustic wave element, duplexer, communication module, and communication apparatus 有权声波元件，双工器，通信模块和通信设备公开(公告)号：US08222972B2
公开(公告)日：2012-07-17
申请号：US12712144
申请日：2010-02-24
IPC分类号： H03H9/46
CPC分类号： H03H9/0222 , H03H9/02897 , H03H9/02929 , H03H9/02937 , H03H9/02984 , H03H9/02992 , Y10T29/49005
摘要： An acoustic wave element includes: resonators 2 each including an electrode to excite acoustic waves; a power supply wiring portion 3 that is disposed so as to connect the resonators 2 electrically; a piezoelectric substrate 4 on which the resonators 2 and the power supply wiring portion 3 are formed; a second medium 5 that is formed on the piezoelectric substrate 4 so as to cover the resonators 2; and a third medium 6 that is formed on the piezoelectric substrate 4 so as to cover at least the second medium 5 and the power supply wiring portion 3. A side surface 34 of the power supply wiring portion 3 that is in contact with a surface of the piezoelectric substrate 4 forms an obtuse first angle θ with respect to the surface 4a of the piezoelectric substrate 4.
摘要翻译： 声波元件包括：各自包括用于激发声波的电极的谐振器2; 设置为电连接谐振器2的电源配线部3; 形成有谐振器2和电源配线部3的压电基板4; 形成在压电基板4上以覆盖谐振器2的第二介质5; 以及形成在压电基板4上以至少覆盖第二介质5和电源配线部3的第三介质6.电源配线部3的与表面接触的侧面34 压电基板4形成钝角的第一角度＆amp; 相对于压电基板4的表面4a。
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4.发明授权公开(公告)号：US08085116B2
公开(公告)日：2011-12-27
申请号：US12408188
申请日：2009-03-20
申请人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
发明人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
CPC分类号： H03H9/1452 , H03H9/1457
摘要： An elastic wave device is described which includes a piezoelectric substrate, comb-shaped electrodes having teeth electrodes that are disposed so as to face each other on the piezoelectric substrate, a non-overlapping area in which the teeth electrodes of the comb-shaped electrodes do not overlap each other, and a overlapping area in which the teeth electrodes overlap each other and the velocity of sound is higher than that in the non-overlapping area.
摘要翻译： 描述了一种弹性波装置，其包括压电基片，具有在压电基片上彼此相对配置的齿电极的梳状电极，梳状电极的齿电极的非重叠区域 齿不重叠，齿电极重叠的重叠区域，声速比非重叠区域高。
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5.发明申请ACOUSTIC WAVE ELEMENT, DUPLEXER, COMMUNICATION MODULE, AND COMMUNICATION APPARATUS 有权声波元件，双工器，通信模块和通信设备公开(公告)号：US20100148890A1
公开(公告)日：2010-06-17
申请号：US12712144
申请日：2010-02-24
CPC分类号： H03H9/0222 , H03H9/02897 , H03H9/02929 , H03H9/02937 , H03H9/02984 , H03H9/02992 , Y10T29/49005
摘要： An acoustic wave element includes: resonators 2 each including an electrode to excite acoustic waves; a power supply wiring portion 3 that is disposed so as to connect the resonators 2 electrically; a piezoelectric substrate 4 on which the resonators 2 and the power supply wiring portion 3 are formed; a second medium 5 that is formed on the piezoelectric substrate 4 so as to cover the resonators 2; and a third medium 6 that is formed on the piezoelectric substrate 4 so as to cover at least the second medium 5 and the power supply wiring portion 3. A side surface 34 of the power supply wiring portion 3 that is in contact with a surface of the piezoelectric substrate 4 forms an obtuse first angle θ with respect to the surface 4a of the piezoelectric substrate 4.
摘要翻译： 声波元件包括：各自包括用于激发声波的电极的谐振器2; 设置为电连接谐振器2的电源配线部3; 形成有谐振器2和电源配线部3的压电基板4; 形成在压电基板4上以覆盖谐振器2的第二介质5; 以及形成在压电基板4上以至少覆盖第二介质5和电源配线部3的第三介质6.电源配线部3的与表面接触的侧面34 压电基板4形成钝角的第一角度＆amp; 相对于压电基板4的表面4a。
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公开(公告)号：US20090267707A1
公开(公告)日：2009-10-29
申请号：US12408188
申请日：2009-03-20
申请人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
发明人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
IPC分类号： H01L41/047 , H03H9/64
CPC分类号： H03H9/1452 , H03H9/1457
摘要： An elastic wave device is described which includes a piezoelectric substrate, comb-shaped electrodes having teeth electrodes that are disposed so as to face each other on the piezoelectric substrate, a non-overlapping area in which the teeth electrodes of the comb-shaped electrodes do not overlap each other, and a overlapping area in which the teeth electrodes overlap each other and the velocity of sound is higher than that in the non-overlapping area.
摘要翻译： 描述了一种弹性波装置，其包括压电基片，具有在压电基片上彼此相对配置的齿电极的梳状电极，梳状电极的齿电极的非重叠区域 齿不重叠，齿电极重叠的重叠区域，声速比非重叠区域高。
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7.发明申请ACOUSTIC WAVE DEVICE, DUPLEXER, COMMUNICATION MODULE, COMMUNICATION APPARATUS, AND MANUFACTURING METHOD FOR ACOUSTIC WAVE DEVICE 有权声波设备，双工器，通信模块，通信设备和声波设备的制造方法公开(公告)号：US20100219906A1
公开(公告)日：2010-09-02
申请号：US12608397
申请日：2009-10-29
申请人： Michio MIURA , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
发明人： Michio MIURA , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
CPC分类号： H03H3/10 , H03H9/0222 , H03H9/25 , Y10T29/42 , Y10T29/49005
摘要： An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.
摘要翻译： 声波装置包括：压电基板，布置在压电基板上的叉指电极，布置在叉指电极之间的第一电介质元件，覆盖指状电极和第一电介质元件的第二电介质元件和已形成的调节元件 在第一电介质元件上。 调整元件由比重大于第一电介质元件和第二电介质元件的比重的材料形成。
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8.发明授权Planar surface acoustic wave device, communication module, and communication apparatus 有权平面声表面波装置，通信模块和通信装置公开(公告)号：US07977848B2
公开(公告)日：2011-07-12
申请号：US12711753
申请日：2010-02-24
申请人： Suguru Warashina , Takashi Matsuda , Shogo Inoue , Yoshio Satoh
发明人： Suguru Warashina , Takashi Matsuda , Shogo Inoue , Yoshio Satoh
CPC分类号： H03H9/02574 , H03H9/14541 , Y10T29/42
摘要： An acoustic wave device of the present application includes a piezoelectric substrate (14), interdigital transducer electrodes (13) formed on the piezoelectric substrate (14), and an SiO2 film (12) formed so as to cover the electrodes (13). The acoustic wave device also includes a displacement adjustment film (11) formed on the SiO2 film (12), and the displacement adjustment film (11) is formed from a substance whose acoustic velocity is slower than that of the substance forming the SiO2 film (12). According to this configuration, it is possible to suppress unnecessary waves as well as improve temperature characteristics. Also, by mounting such an acoustic wave device in a communication module or communication apparatus, it is possible to achieve an improvement in reliability.
摘要翻译： 本申请的声波元件包括形成在压电基板（14）上的压电基板（14），叉指式换能器电极（13）和形成为覆盖电极（13）的SiO 2膜（12）。 声波装置还包括形成在SiO 2膜（12）上的位移调节膜（11），位移调节膜（11）由声速慢于形成SiO 2膜的物质的物质形成（ 12）。 根据该结构，能够抑制不必要的波以及改善温度特性。 此外，通过将这种声波装置安装在通信模块或通信装置中，可以实现可靠性的提高。
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公开(公告)号：US20050242420A1
公开(公告)日：2005-11-03
申请号：US11115253
申请日：2005-04-27
IPC分类号： H01L41/09 , H01L23/02 , H01L23/06 , H01L23/48 , H01L23/52 , H01L29/40 , H03H3/08 , H03H9/00 , H03H9/10 , H03H9/145 , H03H9/25
CPC分类号： H03H9/1071 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/15174 , H01L2924/15184 , H03H9/0071 , H03H9/059 , H03H9/1078 , H01L2224/05599
摘要： A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.
摘要翻译： 封装衬底包括设置在封装衬底的主表面上的信号焊盘，设置在封装衬底的背面上的脚垫和设置在主表面上以围绕信号焊盘的密封电极，信号焊盘电耦合到脚垫 密封电极与脚垫绝缘。
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公开(公告)号：US20050116352A1
公开(公告)日：2005-06-02
申请号：US10986448
申请日：2004-11-12
CPC分类号： H03H9/059 , H01L2224/05001 , H01L2224/05023 , H01L2224/05166 , H01L2224/05568 , H01L2224/05644 , H01L2224/16225 , H01L2224/48091 , H03H9/0538 , H03H9/1078 , H01L2924/00014
摘要： An acoustic wave device includes a device substrate on which electrodes, first terminals, and a first metal seal layer located along an outer periphery are formed, a supporting substrate on which second terminals to be connected to the first terminals, and a second metal seal layer to be joined to the first metal seal layer are formed, and a conductive seal film provided on an outer surface of the device substrate, an outer surface of the first metal seal layer, and an outer surface of the second metal seal layer. The electrodes and the first and second terminals are hermetically sealed with the first and second metal seal layers and the seal film.
摘要翻译： 声波装置包括其上形成有电极，第一端子和沿着外周设置的第一金属密封层的器件基板，与第一端子连接的第二端子的支撑基板和第二金属密封层 形成与第一金属密封层接合的导电性密封膜，设置在器件基板的外表面的导电性密封膜，第一金属密封层的外表面和第二金属密封层的外表面。 电极和第一和第二端子用第一和第二金属密封层和密封膜密封。
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