公开(公告)号：US09935072B2

公开(公告)日：2018-04-03

申请号：US15291063

申请日：2016-10-11

申请人： SFA SEMICON CO., LTD.

发明人： Byeong Ho Jeong ,  Eun Dong Kim ,  Jong Won Lee ,  Hyun Hak Jung ,  Jai Kyoung Choi

IPC分类号： H01L23/52 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/16 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03616 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/10145 ,  H01L2224/10175 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1601 ,  H01L2224/16014 ,  H01L2224/16111 ,  H01L2224/16112 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/3201 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06558 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01044 ,  H01L2924/01051 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/095 ,  H01L2924/07025 ,  H01L2924/0715 ,  H01L2924/0685 ,  H01L2924/0695 ,  H01L2224/119 ,  H01L2224/03444 ,  H01L2224/0346 ,  H01L2224/1146 ,  H01L2224/0361 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/06 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/07802

摘要： The present disclosure provides a semiconductor package that prevents a bump bridge from being formed between adjacent conductive bumps to realize a fine bump pitch when each unit circuit part is directly stacked without using a printed circuit board and a method for manufacturing the same. The semiconductor package includes a first semiconductor chip structure including a first unit circuit part, a first passivation layer disposed on the first unit circuit part, and a conductive bump electrically connected to the first unit circuit part, and a second semiconductor chip structure including a second unit circuit part, a second passivation layer having a stepped portion that is recessed inward and disposed on the second unit circuit part, and a bump pad provided in the stepped portion. The first semiconductor chip structure and the second semiconductor chip structure are stacked to allow the conductive bump to be bonded to the bump pad within the stepped portion.

公开(公告)号：US09831387B2

公开(公告)日：2017-11-28

申请号：US14738490

申请日：2015-06-12

申请人： HIPHOTON CO., LTD.

发明人： Chen-Fu Chu ,  Chen-Hsien Chu

IPC分类号： H01L33/32 ,  H01L25/075 ,  H01L27/15 ,  H01L33/62 ,  H01L33/00 ,  H01L33/50

CPC分类号： H01L33/32 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/38 ,  H01L33/504 ,  H01L33/508 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/8192 ,  H01L2933/0041

摘要： The invention discloses a light engine array comprises a multiple light engines arranged into an array, multiple dams located on a first surface of the light engines; and the dams combined a dam array.

公开(公告)号：US20170279018A1

公开(公告)日：2017-09-28

申请号：US15466780

申请日：2017-03-22

申请人： NICHIA CORPORATION

发明人： Masatsugu ICHIKAWA ,  Yoshiki INOUE ,  Yoshiyuki AIHARA ,  Takehito SHIMATSU

IPC分类号： H01L33/62 ,  H01L27/15

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/44 ,  H01L2224/16225 ,  H01L2224/8192 ,  H01L2224/97 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0066

摘要： A method for manufacturing a semiconductor device includes: providing a support with a semiconductor light-emitting element including a first electrode and a second electrode; providing a base including a first interconnect terminal and a second interconnect terminal; forming a first metal layer on the support to cover the first and the second electrodes; forming a second metal layer on the base to cover the first and the second interconnect terminals; arranging the first and second electrodes and the first and second interconnect terminals to respectively face each other, and providing electrical connection therebetween by atomic diffusion; and rendering electrically insulative or removing portions of the first metal layer and the second metal layer that are outside thereof defined between the first and second electrodes and the first and second interconnect terminals.

公开(公告)号：US09754803B2

公开(公告)日：2017-09-05

申请号：US14217969

申请日：2014-03-18

申请人： SEIKO EPSON CORPORATION

发明人： Manabu Kondo

IPC分类号： H05K1/03 ,  H01L21/48 ,  H01L23/34 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H03H9/10 ,  H01L23/00

CPC分类号： H01L21/4842 ,  H01L21/56 ,  H01L23/3185 ,  H01L23/345 ,  H01L23/49572 ,  H01L24/81 ,  H01L2224/16245 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83102 ,  H03H9/10 ,  Y10T29/4913 ,  H01L2924/00014

摘要： An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view.

公开(公告)号：US20170162648A1

公开(公告)日：2017-06-08

申请号：US15347213

申请日：2016-11-09

申请人： Microchip Technology Incorporated

发明人： Greg Dix ,  Randy Yach ,  Francesco Mazzilli

IPC分类号： H01L49/02 ,  H01L21/52 ,  H01L21/311 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L28/60 ,  H01L21/31105 ,  H01L21/52 ,  H01L23/3142 ,  H01L23/48 ,  H01L23/5222 ,  H01L23/5223 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/42 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0652 ,  H01L28/00 ,  H01L28/40 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/14104 ,  H01L2224/1412 ,  H01L2224/16145 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2924/00014 ,  H01L2924/1205 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2924/0665

摘要： The teachings of the present disclosure may be applied to the manufacture and design of capacitors. In some embodiments of these teachings, a capacitor may be formed on a heavily doped substrate. For example, a method for manufacturing a capacitor may include: depositing an oxide layer on a first side of a heavily doped substrate; depositing a first metal layer on the oxide layer; and depositing a second metal layer on a second side of the heavily doped substrate.

公开(公告)号：US20170125369A1

公开(公告)日：2017-05-04

申请号：US15291063

申请日：2016-10-11

申请人： SFA SEMICON CO., LTD.

发明人： Byeong Ho JEONG ,  Eun Dong KIM ,  Jong Won LEE ,  Hyun Hak JUNG ,  Jai Kyoung CHOI

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L24/16 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03616 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/10145 ,  H01L2224/10175 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1601 ,  H01L2224/16014 ,  H01L2224/16111 ,  H01L2224/16112 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/3201 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06558 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01044 ,  H01L2924/01051 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/095 ,  H01L2924/07025 ,  H01L2924/0715 ,  H01L2924/0685 ,  H01L2924/0695 ,  H01L2224/119 ,  H01L2224/03444 ,  H01L2224/0346 ,  H01L2224/1146 ,  H01L2224/0361 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/06 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/07802

摘要： The present disclosure provides a semiconductor package that prevents a bump bridge from being formed between adjacent conductive bumps to realize a fine bump pitch when each unit circuit part is directly stacked without using a printed circuit board and a method for manufacturing the same. The semiconductor package includes a first semiconductor chip structure including a first unit circuit part, a first passivation layer disposed on the first unit circuit part, and a conductive bump electrically connected to the first unit circuit part, and a second semiconductor chip structure including a second unit circuit part, a second passivation layer having a stepped portion that is recessed inward and disposed on the second unit circuit part, and a bump pad provided in the stepped portion. The first semiconductor chip structure and the second semiconductor chip structure are stacked to allow the conductive bump to be bonded to the bump pad within the stepped portion.

公开(公告)号：US20170117245A1

公开(公告)日：2017-04-27

申请号：US15351184

申请日：2016-11-14

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yu-Wei Lin ,  Sheng-Yu Wu ,  Yu-Jen Tseng ,  Tin-Hao Kuo ,  Chen-Shien Chen

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L21/48

CPC分类号： H01L24/02 ,  H01L21/4853 ,  H01L21/76885 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02125 ,  H01L2224/02141 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/0401 ,  H01L2224/05114 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2224/10125 ,  H01L2224/11013 ,  H01L2224/11019 ,  H01L2224/1112 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/13026 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13551 ,  H01L2224/13564 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13686 ,  H01L2224/1369 ,  H01L2224/14051 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/81007 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/8181 ,  H01L2224/81895 ,  H01L2224/8192 ,  H01L2224/81948 ,  H01L2225/06513 ,  H01L2924/04941 ,  H01L2924/07025 ,  H01L2924/181 ,  H01L2924/301 ,  H01L2924/35 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/05432 ,  H01L2924/053 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/206 ,  H01L2924/207

摘要： An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.

公开(公告)号：US20170069587A1

公开(公告)日：2017-03-09

申请号：US15356316

申请日：2016-11-18

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yen-Liang Lin ,  Yu-Jen Tseng ,  Chang-Chia Huang ,  Tin-Hao Kuo ,  Chen-Shien Chen

IPC分类号： H01L23/00

CPC分类号： H01L24/02 ,  H01L21/4853 ,  H01L21/76885 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02125 ,  H01L2224/02141 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/0401 ,  H01L2224/05114 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2224/10125 ,  H01L2224/11013 ,  H01L2224/11019 ,  H01L2224/1112 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/13026 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13551 ,  H01L2224/13564 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13686 ,  H01L2224/1369 ,  H01L2224/14051 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/81007 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/8181 ,  H01L2224/81895 ,  H01L2224/8192 ,  H01L2224/81948 ,  H01L2225/06513 ,  H01L2924/04941 ,  H01L2924/07025 ,  H01L2924/181 ,  H01L2924/301 ,  H01L2924/35 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/05432 ,  H01L2924/053 ,  H01L2924/00 ,  H01L2924/00012

摘要： A bump structure includes a contact element formed on a substrate and a passivation layer overlying the substrate. The passivation layer includes a passivation opening exposing the contact element. The bump structure also includes a polyimide layer overlying the passivation layer and an under bump metallurgy (UBM) feature electrically coupled to the contact element. The polyimide layer has a polyimide opening exposing the contact element, and the under bump metallurgy feature has a UBM width. The bump structure further includes a copper pillar on the under bump metallurgy feature. A distal end of the copper pillar has a pillar width, and the UBM width is greater than the pillar width.

摘要翻译： 凸块结构包括形成在衬底上的接触元件和覆盖衬底的钝化层。 钝化层包括暴露接触元件的钝化开口。 凸起结构还包括覆盖钝化层的聚酰亚胺层和电耦合到接触元件的凸块下金属（UBM）特征。 聚酰亚胺层具有暴露接触元件的聚酰亚胺开口，凸起下的金属特征具有UBM宽度。 凸起结构还包括在凸起下金属冶金特征上的铜柱。 铜柱的前端具有柱宽，UBM宽度大于柱宽。

公开(公告)号：US09401316B2

公开(公告)日：2016-07-26

申请号：US14685394

申请日：2015-04-13

申请人： Skyworks Solutions, Inc.

发明人： Jaydutt Jagdish Joshi

IPC分类号： H01L23/498 ,  H01L23/36 ,  H01L23/373 ,  H01L21/50 ,  H01L23/367 ,  H01L23/00 ,  H01Q1/22 ,  H01L23/42 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/3736 ,  H01L21/50 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/81 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/81912 ,  H01L2224/8192 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/18161 ,  H01Q1/22 ,  H01L2224/11 ,  H01L2224/81

摘要： Electronic devices with improved thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed. In some embodiments, a thermal collection layer can be formed on a surface of a flip chip die. The thermal collection layer can be configured to dissipate heat generated by the flip chip die. In some variations, the thermal collection layer can be constructed using materials having high thermal conductivity.

摘要翻译： 公开了具有包括一个或多个倒装芯片裸片的倒装芯片封装的具有改善的热性能（例如散热）的电子器件。 在一些实施例中，热收集层可以形成在倒装芯片的表面上。 热收集层可以被配置为消散由倒装芯片芯片产生的热量。 在一些变型中，热收集层可以使用具有高导热性的材料构造。

公开(公告)号：US20160141229A1

公开(公告)日：2016-05-19

申请号：US14725156

申请日：2015-05-29

申请人： AMKOR TECHNOLOGY, INC.

发明人： Jong Sik Paek ,  Doo Hyun Park ,  Wang Gu Lee ,  Yong Song ,  Sung Geun Kang

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L24/83 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/24 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/1329 ,  H01L2224/13293 ,  H01L2224/133 ,  H01L2224/1354 ,  H01L2224/16245 ,  H01L2224/241 ,  H01L2224/24246 ,  H01L2224/244 ,  H01L2224/24997 ,  H01L2224/27462 ,  H01L2224/27464 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/8184 ,  H01L2224/81855 ,  H01L2224/819 ,  H01L2224/8192 ,  H01L2224/821 ,  H01L2224/82355 ,  H01L2924/00014 ,  H05K3/4661 ,  H01L2924/00012 ,  H01L2224/291 ,  H01L2924/014

摘要： In one embodiment, a semiconductor package includes a semiconductor die having conductive pads. A lead frame is directly connected to the conductive pads using an electrochemically formed layer or a conductive adhesive layer thereby facilitating an electrical connection between the conductive pads of the semiconductor die and the lead frame without using separate wire bonds or conductive bumps.

摘要翻译： 在一个实施例中，半导体封装包括具有导电焊盘的半导体管芯。 引线框架使用电化学形成的层或导电粘合剂层直接连接到导电焊盘，从而有助于半导体管芯和引线框架的导电焊盘之间的电连接，而不使用单独的引线接合或导电凸块。