公开(公告)号：US09622358B2

公开(公告)日：2017-04-11

申请号：US14713836

申请日：2015-05-15

Applicant: Micron Technology, Inc.

Inventor： Shiyou Zhao ,  Houfei Chen ,  Hao Wang

IPC: H01K3/10 ,  H05K3/42 ,  H05K1/02 ,  H05K1/16 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K3/429 ,  H05K1/0222 ,  H05K1/115 ,  H05K1/162 ,  H05K3/10 ,  H05K3/42 ,  H05K2201/09809 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/4916 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.

公开(公告)号：US09055702B2

公开(公告)日：2015-06-09

申请号：US14010051

申请日：2013-08-26

Applicant: Micron Technology, Inc.

Inventor： Shiyou Zhao ,  Houfei Chen ,  Hao Wang

IPC: H01K3/10 ,  H05K3/42 ,  H05K1/02 ,  H05K1/16 ,  H05K1/11

CPC classification number: H05K3/429 ,  H05K1/0222 ,  H05K1/115 ,  H05K1/162 ,  H05K3/10 ,  H05K3/42 ,  H05K2201/09809 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/4916 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.

Abstract translation: 本发明的一个实施例包括用于制造用于印刷电路板（PCB）的通孔结构的改进方法。 该通孔允许信号从PCB中的一个信号平面传递到另一个信号平面，并且这样做会超过信号平面之间的电源和接地平面。 为了最小化电源和接地层之间的电磁干扰，由于信号返回电流引起的信号损耗以及通孔到通孔耦合，通孔被屏蔽在两个同心圆柱体中，每个连接到电源和接地层之一。

公开(公告)号：US20150250060A1

公开(公告)日：2015-09-03

申请号：US14713836

申请日：2015-05-15

Applicant: Micron Technology, Inc.

Inventor： Shiyou Zhao ,  Houfei Chen ,  Hao Wang

IPC: H05K3/42 ,  H05K3/10

CPC classification number: H05K3/429 ,  H05K1/0222 ,  H05K1/115 ,  H05K1/162 ,  H05K3/10 ,  H05K3/42 ,  H05K2201/09809 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/4916 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.

Abstract translation: 本发明的一个实施例包括用于制造用于印刷电路板（PCB）的通孔结构的改进方法。 该通孔允许信号从PCB中的一个信号平面传递到另一个信号平面，并且这样做会超过信号平面之间的电源和接地平面。 为了最小化电源和接地层之间的电磁干扰，由于信号返回电流引起的信号损耗以及通孔到通孔耦合，通孔被屏蔽在两个同心圆柱体中，每个连接到电源和接地层之一。

公开(公告)号：US20130340250A1

公开(公告)日：2013-12-26

申请号：US14010051

申请日：2013-08-26

Applicant: Micron Technology, Inc.

Inventor： Shiyou Zhao ,  Houfei Chen ,  Hao Wang

IPC: H05K3/42

CPC classification number: H05K3/429 ,  H05K1/0222 ,  H05K1/115 ,  H05K1/162 ,  H05K3/10 ,  H05K3/42 ,  H05K2201/09809 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/4916 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.

Abstract translation: 本发明的一个实施例包括用于制造用于印刷电路板（PCB）的通孔结构的改进方法。 该通孔允许信号从PCB中的一个信号平面传递到另一个信号平面，并且这样做会超过信号平面之间的电源和接地平面。 为了最小化电源和接地层之间的电磁干扰，由于信号返回电流引起的信号损耗以及通孔到通孔耦合，通孔被屏蔽在两个同心圆柱体中，每个连接到电源和接地层之一。