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公开(公告)号:US20250130877A1
公开(公告)日:2025-04-24
申请号:US18790795
申请日:2024-07-31
Applicant: Micron Technology, Inc.
Inventor: Yang Lu , Mark Kalei Hadrick , Kang-Yong Kim , Donald Morgan , Victor Wong
IPC: G06F11/07
Abstract: Apparatuses and techniques for handling faulty usage-based-disturbance data are described. In an example aspect, a memory device uses a report flag to indicate that an address of a row that corresponds to the faulty usage-based-disturbance data is logged at a global-bank level and is accessible by a host device. The report flag also enables the memory device to avoid reporting another error until the host device has cleared information associated with a previously-reported error. In another example aspect, the memory device temporarily prevents usage-based-disturbance mitigation from being performed based on the faulty usage-based-disturbance data. This means that if the faulty usage-based-disturbance data would otherwise trigger refreshing of one or more rows that are proximate to the row corresponding to the faulty usage-based-disturbance data, the memory device does not perform these refresh operations. This is beneficial by conserving resources for refreshing victim rows that are identified based on valid usage-based-disturbance data.
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公开(公告)号:US20240079036A1
公开(公告)日:2024-03-07
申请号:US17930034
申请日:2022-09-06
Applicant: Micron Technology, Inc.
Inventor: Yang Lu , Mark Kalei Hadrick , Kang-Yong Kim
CPC classification number: G06F12/023 , G06F13/1668 , G06F2212/1016
Abstract: Apparatuses and techniques for implementing a standalone mode are described. The standalone mode refers to a mode in which a die that is designed to operate as one of multiple dies that are interconnected can operate independently of another one of the multiple dies. Prior to connecting the die to the other die, the die can perform a standalone read operation and/or a standalone write operation in accordance with the standalone mode. In this way, testing (or debugging) can be performed during an earlier stage in the manufacturing process before integrating the die into an interconnected die architecture. For example, this type of testing can be performed at a wafer level or at a single-die-package (SDP) level. In general, the standalone mode can be executed independent of whether the die is connected to the other die.
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公开(公告)号:US12204780B2
公开(公告)日:2025-01-21
申请号:US17660195
申请日:2022-04-21
Applicant: Micron Technology, Inc.
Inventor: Mark Kalei Hadrick , Yu-Sheng Hsu , John Christopher Sancon , Kang-Yong Kim , Yang Lu
IPC: G06F3/06
Abstract: Described apparatuses and methods relate to self-refresh arbitration. In a memory system with multiple memory components, an arbiter is configured to manage the occurrence of self-refresh operations. In aspects, the arbiter can receive one or more self-refresh request signals from at least one memory controller for authorization to command one or more memory components to enter a self-refresh mode. Upon receiving the one or more self-refresh request signals, the arbiter, based on a predetermined configuration, can transmit one or more self-refresh enable signals to the at least one memory controller with authorization to command the one or more memory components to enter the self-refresh mode. The configuration can ensure that fewer than all memory components simultaneously enter the self-refresh mode. In so doing, memory components can perform self-refresh operations without exceeding an instantaneous power threshold. The arbiter can be included in, for instance, a Compute Express Link™ (CXL™) memory module.
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公开(公告)号:US20240404576A1
公开(公告)日:2024-12-05
申请号:US18642144
申请日:2024-04-22
Applicant: Micron Technology, Inc.
Inventor: Yang Lu , Kang-Yong Kim , Mark Kalei Hadrick
IPC: G11C11/406 , G11C11/4076 , G11C11/4096
Abstract: Apparatuses and methods for scheduling aspects of usage-based disturbance mitigation based on different external commands are described. An apparatus comprises a memory device, which has at least one bank comprising memory cells. A subset of the memory cells is configured to store data associated with usage-based disturbance. The apparatus includes circuitry configured to mitigate usage-based disturbance within the bank. The memory device is configured to receive, from a memory controller, two commands that are separated in time by a timing offset. The memory device is configured to generate an internal read command based on the first command to cause the memory device to read the data from the subset of the memory cells. The memory device is configured to generate an internal write command based on the second command to cause the memory device to write modified data generated by the circuitry to the subset of the memory cells.
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公开(公告)号:US20240338126A1
公开(公告)日:2024-10-10
申请号:US18627859
申请日:2024-04-05
Applicant: Micron Technology, Inc.
Inventor: Kang-Yong Kim , Yang Lu , Wonjun Choi , Mark Kalei Hadrick
IPC: G06F3/06
CPC classification number: G06F3/0619 , G06F3/0653 , G06F3/0673
Abstract: Apparatuses and techniques for implementing collision avoidance for bank-shared circuitry that supports usage-based disturbance mitigation are described. A memory device includes bank-shared circuitry coupled to multiple banks. The bank-shared circuitry can support usage-based disturbance mitigation. By using the bank-shared circuitry to service multiple banks, the memory device can have a smaller footprint and can be cheaper to manufacture compared to other memory devices with circuitry dedicated for each bank. To avoid conflicts associated with some sequences of commands that may relate to a same bank or different banks and utilize the bank-shared circuitry, the memory controller applies an appropriate timing offset (or delay) between commands. The timing offset allows the memory device time to finish utilizing the bank-shared circuitry for usage-based disturbance mitigation prior to utilizing the bank-shared circuitry in accordance with a subsequent command.
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公开(公告)号:US20250131973A1
公开(公告)日:2025-04-24
申请号:US18790365
申请日:2024-07-31
Applicant: Micron Technology, Inc.
Inventor: Yang Lu , Mark Kalei Hadrick , Kang-Yong Kim , Donald Morgan , Victor Wong
Abstract: Apparatuses and techniques for logging a memory address associated with faulty usage-based disturbance data are described. In an example aspect, a memory device can detect, at a local-bank level, a fault associated with usage-based disturbance data. This detection enables the memory device to log a row address associated with the faulty usage-based disturbance data. To avoid increasing a complexity and/or a size of the memory device, some implementations of the memory device can perform the address logging at the multi-bank level with the assistance of an engine, such as a test engine. The memory device stores the logged address in at least one mode register to communicate the fault to a memory controller. With the logged address, the memory controller can initiate a repair procedure to fix the faulty usage-based disturbance data.
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公开(公告)号:US20240347096A1
公开(公告)日:2024-10-17
申请号:US18628127
申请日:2024-04-05
Applicant: Micron Technology, Inc.
Inventor: Yang Lu , Mark Kalei Hadrick , HyunYoo Lee , KeunSoo Song , John Christopher Sancon , Kang-Yong Kim
IPC: G11C11/406 , G11C11/4096
CPC classification number: G11C11/40615 , G11C11/40611 , G11C11/4096
Abstract: Apparatuses and techniques for implementing usage-based disturbance counter clearance are described. In example implementations, a memory device includes a memory array having multiple rows. The memory device also includes multiple usage-based disturbance counters that are associated with the memory array. The memory device further includes logic that performs a refresh operation on a row of the multiple rows responsive to a refresh command. The logic also clears a usage-based disturbance counter of the multiple usage-based disturbance counters responsive to the refresh command. Here, the usage-based disturbance counter stores a quantity of accesses to the row of the multiple rows. This can reduce a frequency of performing usage-based disturbance mitigation procedures that would otherwise be applied to the multiple usage-based disturbance counters, thereby saving power and avoiding denial-of-service periods with the memory array.
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公开(公告)号:US12100468B2
公开(公告)日:2024-09-24
申请号:US17930034
申请日:2022-09-06
Applicant: Micron Technology, Inc.
Inventor: Yang Lu , Mark Kalei Hadrick , Kang-Yong Kim
CPC classification number: G11C7/1045 , G06F13/1668
Abstract: Apparatuses and techniques for implementing a standalone mode are described. The standalone mode refers to a mode in which a die that is designed to operate as one of multiple dies that are interconnected can operate independently of another one of the multiple dies. Prior to connecting the die to the other die, the die can perform a standalone read operation and/or a standalone write operation in accordance with the standalone mode. In this way, testing (or debugging) can be performed during an earlier stage in the manufacturing process before integrating the die into an interconnected die architecture. For example, this type of testing can be performed at a wafer level or at a single-die-package (SDP) level. In general, the standalone mode can be executed independent of whether the die is connected to the other die.
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公开(公告)号:US11928039B1
公开(公告)日:2024-03-12
申请号:US18051603
申请日:2022-11-01
Applicant: Micron Technology, Inc.
Inventor: Yang Lu , Kang-Yong Kim , Mark Kalei Hadrick , Keun Soo Song
CPC classification number: G06F11/27 , G06F7/762 , G06F11/3041 , G06F13/00 , G06F13/14 , G06F13/28 , G06F21/85 , G06F2213/00 , G06F2213/0024
Abstract: Apparatuses and techniques for implementing a data-transfer test mode are described. The data-transfer test mode refers to a mode in which the transfer of data from an interface die to a linked die can be tested prior to connecting the interface die to the linked die. In particular, the data-transfer test mode enables the interface die to perform aspects of a write operation and output a portion of write data that is intended for the linked die. With the data-transfer test mode, testing (or debugging) of the interface die can be performed during an earlier stage in the manufacturing process before integrating the interface die into an interconnected die architecture. For example, this type of testing can be performed at a wafer level or at a single-die-package (SDP) level. In general, the data-transfer test mode can be executed independent of whether the interface die is connected to the linked die.
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公开(公告)号:US20230343381A1
公开(公告)日:2023-10-26
申请号:US17660199
申请日:2022-04-21
Applicant: Micron Technology, Inc.
Inventor: John Christopher Sancon , Yang Lu , Kang-Yong Kim , Mark Kalei Hadrick , Hyun Yoo Lee
IPC: G11C11/406 , G11C11/4076 , G11C11/408
CPC classification number: G11C11/40618 , G11C11/40615 , G11C11/4076 , G11C11/4085
Abstract: Described apparatuses and methods relate to a bank-level self-refresh for a memory system. A memory device can include logic that implements self-refresh operations in the memory device. The logic may perform self-refresh operations on a set of banks of the memory device that is less than all banks within the memory device. The set of banks of the memory device may be determined such that the peak current in a power distribution network of the memory device is bounded when the self-refresh operation is performed. Accordingly, bank-level self-refresh can reduce a cost of the memory device of a memory system by enabling use of a less complicated power distribution network. The bank-level self-refresh may also be implemented with different types of refresh operations. Amongst other scenarios, bank-level self-refresh can be deployed in memory-expansion environments.
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