Current-Controlled Buffer Using Analog Bias
    1.
    发明公开

    公开(公告)号:US20240248861A1

    公开(公告)日:2024-07-25

    申请号:US18506229

    申请日:2023-11-10

    IPC分类号: G06F13/20

    CPC分类号: G06F13/20 G06F2213/0002

    摘要: A semiconductor device includes a pair of transistors configured to implement buffering of input data to outputs. The semiconductor device also includes a first transistor configured to receive a common-mode of the outputs at a gate terminal of the first transistor. The semiconductor device also includes a current source configured to control a tail current from the pair of transistors. Additionally, the semiconductor device includes a second transistor configured to adjust the tail current based at least in part on changes in a reference voltage used by the pair of transistors to buffer the input data. Furthermore, the semiconductor device includes a third transistor configured to adjust the tail current based at least in part on changes in locally generated reference voltage based at least in part on a process and temperature variations.

    Test input/output speed conversion and related apparatuses and methods

    公开(公告)号:US11789835B2

    公开(公告)日:2023-10-17

    申请号:US16953828

    申请日:2020-11-20

    CPC分类号: G06F11/27 G06F1/12 G06F13/20

    摘要: Test input/output speed conversion and related apparatuses and methods are disclosed. An apparatus includes a glue circuit and a BIST circuit for core circuitry of an integrated circuit device. The, the BIST circuit includes a test interface, one or more inputs, and one or more outputs. The BIST circuit is configured to operate at a first speed. The glue circuit is configured to interface with the test interface, the one or more inputs, and the one or more outputs of the BIST circuit. The glue circuit is configured to convert between second speed test interface signals and second speed input/output signals operating at a second speed and first speed test interface signals and first speed input/output signals operating at the first speed. The second speed is different from the first speed.

    Methods for improving timing in memory devices, and related devices and systems

    公开(公告)号:US11619964B2

    公开(公告)日:2023-04-04

    申请号:US17385412

    申请日:2021-07-26

    IPC分类号: G06F1/12 G06F1/10 G06F1/08

    摘要: Methods for improving timing in memory devices are disclosed. A method may include sampling a command signal according to a clock signal to obtain standard-timing commands. The method may also include sampling the command signal according to an adjusted clock signal to obtain time-adjusted commands. The method may also include comparing the standard-timing commands and the time-adjusted commands. The method may also include determining an improved timing for the clock signal based on the comparison of the standard-timing commands and the time-adjusted commands. The method may also include adjusting the clock signal based on the improved timing. Associated systems and methods are also disclosed.

    SYSTEMS AND METHODS FOR IMPROVED DUAL-TAIL LATCH WITH LOAD CONTROL

    公开(公告)号:US20240249766A1

    公开(公告)日:2024-07-25

    申请号:US18506208

    申请日:2023-11-10

    摘要: A semiconductor device includes an interface configured to receive clock signals and data signals. The interface includes a dual-tail latch. The dual-tail latch includes a sensing stage configured to sense and to amplify a differential voltage between at least a portion of the data signals and another signal. The sensing stage includes a first node and a second node between which the amplified differential voltage is output from the sensing stage. The dual-tail latch also includes a latch stage configured to latch a first latched value and a second latched value based at least in part on the amplified differential voltage. Moreover, the differential voltage is based at least in part on a previous first value and a previous second value from the latch stage fed back to the sensing stage.

    Apparatuses, systems, and methods for ZQ calibration

    公开(公告)号:US11922996B2

    公开(公告)日:2024-03-05

    申请号:US17449861

    申请日:2021-10-04

    摘要: A semiconductor device may include one or more output drivers. An output driver may be adjusted for impedance matching by applying a body voltage to one or more transistors of the output driver. In some examples, the body voltage applied may be based on a comparison between a reference voltage and a voltage at an external terminal. In some examples, the semiconductor device may include a calibration circuit that includes a comparator and an up/down counter that, based on a signal from the comparator, generates a code indicating the body voltage to be applied. The body voltage may be applied by a voltage generator in some examples.

    SIGNAL DELAY CONTROL AND RELATED APPARATUSES, SYSTEMS, AND METHODS

    公开(公告)号:US20220303111A1

    公开(公告)日:2022-09-22

    申请号:US17204681

    申请日:2021-03-17

    IPC分类号: H04L7/02

    摘要: The present application is directed to signal delay control and related apparatuses, systems, and methods. An apparatus includes delay elements and control circuitry electrically connected to the delay elements. The delay elements are configured to receive skewed data signals and delay codes indicating delay quantities. The delay elements are also configured to provide delayed data signals delayed relative to the skewed data signals by the delay quantities. The control circuitry is configured to provide the delay codes, which are selected to reduce a timing skew of the delayed data signals relative to a timing skew of the skewed data signals. A system includes a first device, a second device including the apparatus, and transmission lines electrically connected between the first device and the second device. A method includes calibrating the delay codes.

    TEST INPUT/OUTPUT SPEED CONVERSION AND RELATED APPARATUSES AND METHODS

    公开(公告)号:US20220164269A1

    公开(公告)日:2022-05-26

    申请号:US16953828

    申请日:2020-11-20

    IPC分类号: G06F11/27 G06F13/20 G06F1/12

    摘要: Test input/output speed conversion and related apparatuses and methods are disclosed. An apparatus includes a glue circuit and a BIST circuit for core circuitry of an integrated circuit device. The, the BIST circuit includes a test interface, one or more inputs, and one or more outputs. The BIST circuit is configured to operate at a first speed. The glue circuit is configured to interface with the test interface, the one or more inputs, and the one or more outputs of the BIST circuit. The glue circuit is configured to convert between second speed test interface signals and second speed input/output signals operating at a second speed and first speed test interface signals and first speed input/output signals operating at the first speed. The second speed is different from the first speed.