HEAT DISSIPATION IN ELECTRONICS
    4.
    发明申请
    HEAT DISSIPATION IN ELECTRONICS 审中-公开
    电子散热

    公开(公告)号:US20170049006A1

    公开(公告)日:2017-02-16

    申请号:US14827068

    申请日:2015-08-14

    IPC分类号: H05K7/20 B23P15/26

    摘要: Heat dissipation configurations and methods are described herein. A heat dissipation apparatus may include an individual piece of metal having a thermally conductive metal surface. The metal surface includes a plurality of ridges or protrusions extending from a base of the metal surface, wherein an air flow channel is provided between each two adjacent protrusions, therein providing a plurality of air flow channels. The apparatus is configured to dissipate heat for an electronic device having an active cooling source directing air through the plurality of air flow channels. In some examples, the heat dissipation apparatus is a vapor chamber, and the surface includes a section having a trough and a raised area or platform surrounded by the trough, wherein the raised area is configured to contact a microprocessor die in communication with the vapor chamber.

    摘要翻译: 这里描述了散热结构和方法。 散热装置可以包括具有导热金属表面的单个金属片。 金属表面包括从金属表面的基部延伸的多个脊或突起,其中在每个两个相邻突起之间设置有空气流动通道,其中提供多个气流通道。 该装置被配置为为具有通过多个气流通道引导空气的主动冷却源的电子设备散热。 在一些示例中,散热装置是蒸气室,表面包括具有槽的部分和由槽包围的凸起区域或平台,其中凸起区域构造成接触与蒸气室连通的微处理器管芯 。

    Multi-axis retention assembly
    10.
    发明授权

    公开(公告)号:US11531405B2

    公开(公告)日:2022-12-20

    申请号:US17325002

    申请日:2021-05-19

    IPC分类号: G06F3/02 G06F3/039

    摘要: The patent relates to securely storing an input device relative to a computing device. One example can include a housing and a trough defined in the housing and configured to receive at least a portion of an input device. This example can also include a pair of opposing levers that are contained in the trough when the trough is empty and that pivot proud out of the trough around and against the input device installed in the trough.