-
公开(公告)号：US20170248992A1
公开(公告)日：2017-08-31
申请号：US15053934
申请日：2016-02-25
IPC分类号： G06F1/16
CPC分类号： G06F1/1656 , B32B3/02 , B32B3/04 , B32B3/08 , B32B5/022 , B32B5/024 , B32B5/145 , B32B5/18 , B32B5/24 , B32B5/245 , B32B5/26 , B32B7/02 , B32B7/08 , B32B7/12 , B32B9/02 , B32B9/025 , B32B9/041 , B32B9/045 , B32B9/046 , B32B9/047 , B32B15/043 , B32B15/046 , B32B15/08 , B32B15/14 , B32B27/065 , B32B27/08 , B32B27/12 , B32B2250/02 , B32B2250/03 , B32B2250/44 , B32B2262/0261 , B32B2262/0276 , B32B2262/0292 , B32B2262/14 , B32B2307/20 , B32B2307/206 , B32B2307/412 , B32B2307/518 , B32B2307/54 , B32B2307/72 , B32B2307/732 , B32B2457/00 , B32B2457/08 , B32B2457/208 , G06F1/1637 , G06F1/1662
摘要： A structure for housing electronic components. The structure includes a first layer and a second layer. One or more layers may each have a modulus of elasticity of less than 2.41 MPa. One or more layers may be at least partially affixed to form a combined layer. The combined layer may have a combined modulus of elasticity of less than 2300 MPa. The combined layer may be transparent to electromagnetic waves. The combined layer may be not electrically conductive across an entire surface area of the combined layer. The combined layer may be polycarbonate free. An outermost layer may be a textile layer.
-
公开(公告)号：US20170245382A1
公开(公告)日：2017-08-24
申请号：US15052615
申请日：2016-02-24
发明人： Kurt Jenkins
CPC分类号： H05K5/0217 , B29C37/0082 , B29C45/14311 , B29C65/70 , B29C2045/14327 , B29L2031/3475 , B32B3/30 , G06F1/16 , H05K5/00 , H05K5/0017
摘要： Structures include a substrate having a base surface. The base surface includes a plurality of protrusions extending from the base surface and/or a plurality of depressions extending into the base surface. The structures include a molded liner. The molded liner encapsulates the plurality of protrusions and/or the molded liner extends into at least a portion of the plurality of depressions.
-
公开(公告)号：US20180321720A1
公开(公告)日：2018-11-08
申请号：US16039089
申请日：2018-07-18
IPC分类号： G06F1/20 , B33Y70/00 , B33Y80/00 , B23K26/342 , H01L23/427 , B23P15/26 , F28D15/02 , H05K7/20 , F28D15/04 , B33Y10/00 , B23K101/14 , F28D20/00 , H01L21/48 , H01L23/40
CPC分类号： G06F1/206 , B23K26/342 , B23K2101/14 , B23P15/26 , B23P2700/09 , B33Y10/00 , B33Y70/00 , B33Y80/00 , F28D15/0233 , F28D15/0283 , F28D15/046 , F28D2020/0013 , F28F2255/18 , G06F1/203 , G06F2200/201 , H01L21/4871 , H01L21/4882 , H01L23/427 , H01L23/4275 , H01L2023/4037 , H05K7/20336
摘要： Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.
-
公开(公告)号：US20180143673A1
公开(公告)日：2018-05-24
申请号：US15359544
申请日：2016-11-22
CPC分类号： G06F1/206 , B22D17/00 , C25D3/12 , C25D3/38 , C25D17/00 , F28D15/04 , F28F21/085 , F28F21/087 , F28F21/089 , F28F2255/14 , F28F2255/143 , H01L23/427
摘要： Thermal management devices and systems, and corresponding manufacturing methods are described herein. A phase change thermal management device is manufactured with a method that includes forming a volume of a first material. The volume of the first material defines a chamber of the thermal management device and an inner surface of a port. A layer of a second material is electroplated on the volume of the first material. The volume of the first material is melted or dissolved, such that the electroplated layer of the second material forms the chamber and the port. The melted volume of the first material is removed via the port.
-
公开(公告)号：US20180120912A1
公开(公告)日：2018-05-03
申请号：US15336635
申请日：2016-10-27
IPC分类号： G06F1/20 , B33Y80/00 , B33Y70/00 , B23K26/342 , B23P15/26
CPC分类号： G06F1/206 , B23K26/342 , B23K2101/14 , B23P15/26 , B23P2700/09 , B33Y10/00 , B33Y70/00 , B33Y80/00 , F28D15/0233 , F28D15/0283 , F28D15/046 , F28D2020/0013 , F28F2255/18 , G06F1/203 , G06F2200/201 , H01L21/4871 , H01L21/4882 , H01L23/427 , H01L23/4275 , H01L2023/4037 , H05K7/20336
摘要： Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.
-
公开(公告)号：US20170235349A1
公开(公告)日：2017-08-17
申请号：US15046441
申请日：2016-02-17
发明人： Lincoln Ghioni , Jeffrey Taylor Stellman , Andrew Hill , Kurt Jenkins , Robyn Rebecca Reed McLaughlin
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28D2021/0029 , F28F3/04 , F28F13/00 , F28F2215/04 , F28F2250/08 , H01L21/4871 , H01L23/34 , H01L23/367 , H01L23/427 , H05K7/20 , H05K7/20154 , H05K7/20336 , H05K7/2039
摘要： 3D printed thermal management devices and corresponding methods of manufacturing are described herein. A thermal management device includes a single contiguous component including at least a portion of a first heat exchanger and at least a portion of a second heat exchanger. The second heat exchanger is of a different type than the first heat exchanger.
-
公开(公告)号：US10146275B2
公开(公告)日：2018-12-04
申请号：US15046441
申请日：2016-02-17
发明人： Lincoln Ghioni , Jeffrey Taylor Stellman , Andrew Hill , Kurt Jenkins , Robyn Rebecca Reed McLaughlin
IPC分类号： H01L23/427 , H01L23/367 , H05K7/20 , G06F1/20 , F28D15/02 , F28F3/04 , F28F13/00 , H01L23/34 , F28D21/00
摘要： 3D printed thermal management devices and corresponding methods of manufacturing are described herein. A thermal management device includes a single contiguous component including at least a portion of a first heat exchanger and at least a portion of a second heat exchanger. The second heat exchanger is of a different type than the first heat exchanger.
-
公开(公告)号：US10054995B2
公开(公告)日：2018-08-21
申请号：US15336635
申请日：2016-10-27
IPC分类号： F28F7/00 , G06F1/20 , B33Y80/00 , B33Y70/00 , B23K26/342 , B23P15/26 , B23K101/14
CPC分类号： G06F1/206 , B23K26/342 , B23K2101/14 , B23P15/26 , B23P2700/09 , B33Y10/00 , B33Y70/00 , B33Y80/00 , F28D15/0233 , F28D15/0283 , F28D15/046 , F28D2020/0013 , F28F2255/18 , G06F1/203 , G06F2200/201 , H01L21/4871 , H01L21/4882 , H01L23/427 , H01L23/4275 , H01L2023/4037 , H05K7/20336
摘要： Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.
-
公开(公告)号：US09901002B2
公开(公告)日：2018-02-20
申请号：US15052615
申请日：2016-02-24
发明人： Kurt Jenkins
CPC分类号： H05K5/0217 , B29C37/0082 , B29C45/14311 , B29C65/70 , B29C2045/14327 , B29L2031/3475 , B32B3/30 , G06F1/16 , H05K5/00 , H05K5/0017
摘要： Structures include a substrate having a base surface. The base surface includes a plurality of protrusions extending from the base surface and/or a plurality of depressions extending into the base surface. The structures include a molded liner. The molded liner encapsulates the plurality of protrusions and/or the molded liner extends into at least a portion of the plurality of depressions.
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.016 秒)
