摘要:
A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.
摘要:
A gear socket structure for a designing rule, of which the gear socket is a round cylinder, having a given height; the wall of the gear socket is provided with two leaf springs; the top of each leaf spring has an inward catch hook; the gear socket can accommodate a plurality of gears, which are held in place by means of the catch hooks without falling out unintentionally.
摘要:
A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
摘要:
An improved structure for nose pieces of spectacles, comprises two nose pieces made of soft plastic in concaved shapes and having their front faces planted with fine down and provided with a plurality of air permeable holes, a connecting axle integrally protruding from the nose piece with a protruding ball extending into a base and being able of automatic orientation adjustment and being pressed in the base by a pressing detent which in turn being pressed by a torsional spring, the structure each can be clamped onto a seat (on the spectacles) for a nose piece so as not to be subjected to falling off and is convenient for assembling, the nose piece with this structure can best fit to the bridge of a nose.
摘要:
A communication system includes a wireless network terminal (30), a wired network terminal (10), and a communication device (20). The communication device includes a Local Area Network (LAN) controller module (22), a process unit (24) and a transcoder (26). When the wired network terminal transmits a first kind of signal input to the communication device, the first kind of input signal is processed by the process unit and transformed into a first kind of output signal by the transcoder. Then the first kind of output is transmitted to the wireless network terminal. When the wireless network terminal transmits a second kind of signal input to the communication device. The second kind of input signal is transformed into the second kind of output signal by the transcoder. The second kind of output signal is processed by the process unit, and is then transmitted to the wired network terminal.
摘要:
A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
摘要:
A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
摘要:
A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.
摘要:
A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.