Abstract:
A fruit grating tool includes a tube-shaped housing, a cap releasably connected to the housing, a pressing member arranged under the cap and biased down by a spring, a rotary member having a knob arranged on top of the cap, and a grating base arranged under the pressing member and connected to the rotary member; the grating base has a grating surface on an upper side thereof, and many sharp edged tangential holes thereon; fruits are put on the grating base to be pressed against the grating surface by means of the pressing member, and are grated by means of the grating surface when the knob is operated to cause the grating base to rotate; the fruits will pass down via the sharp edged tangential holes of the grating base after having been grated into small pieces.
Abstract:
A drink container for small children includes a container, a lid joined to an upper opening of the container, and a drip prevention element. The lid has a sucking portion for allowing a young child, to suck on to draw out drink contents of the container with the mouth. The lid is formed with a passage for allowing drink contents of the container to pass through. The drip prevention element is arranged in a passage of the lid to block the passage when there is no external sucking force exerted on the sucking portion, and which can bend to effect opening of the passage when there is external sucking force exerted on the sucking portion. Thus, liquid contents can't drip through the lid when a young child is learning to grasp objects with the drink container.
Abstract:
A package structure and method for preventing gold bonding wires from collapsing are disclosed. The structure is especially useful for those chips whose two n×1 arrays of bonding pads are on the chip center to be packaged on a BGA substrate. According to the first preferred embodiment, two dies having a redistribution layer formed thereon are introduced outer the bonding pad array on the chip so that the gold bonding wires can be divided into two sections each to connect the bonding pads with the redistribution layer and the redistribution layer with the gold fingers on the BGA substrate. According to the second embodiment, the gold bonding wires are fixed by the epoxy strips on the chips after bonding the bonding pads to the gold fingers but before pouring liquid encapsulated epoxy into a mold.
Abstract:
A method of communication between a protocol-processing unit and an input/output (I/O) device through a device interface controller includes configuring the protocol-processing unit to write command/message data in a predefined write file, and configuring the device interface controller to translate the command/message data written in the predefined write file into a corresponding command/message and to transmit the corresponding command/message thus translated to the I/O device. A system that includes the protocol-processing unit and the device interface controller is also disclosed.
Abstract:
A method for communication between an electronic device and a target input/output (I/O) device in a secure digital input/output (SDIO) card through a secure digital (SD) interface is provided. The SDIO card includes a SDIO controller. The method includes the steps of: configuring the electronic device to write an I/O command packet at a designated address accessible to both the electronic device and the SDIO controller, the I/O command packet including a command for controlling the operation of the target I/O device; and configuring the SDIO controller to control the operation of the target I/O device according to the I/O command packet written at the designated address.
Abstract:
A package structure and method for preventing gold bonding wires from collapsing are disclosed. The structure is especially useful for those chips whose two n×1 arrays of bonding pads are on the chip center to be packaged on a BGA substrate. According to the first preferred embodiment, two dies having a redistribution layer formed thereon are introduced outer the bonding pad array on the chip so that the gold bonding wires can be divided into two sections each to connect the bonding pads with the redistribution layer and the redistribution layer with the gold fingers on the BGA substrate. According to the second embodiment, the gold bonding wires are fixed by the epoxy strips on the chips after bonding the bonding pads to the gold fingers but before pouring liquid encapsulated epoxy into a mold.
Abstract:
A semiconductor die package has a lead frame, a die attached to the lead frame and an encapsulant enclosing the lead frame and the die. The distance between the top outside face of the encapsulant and the frame is substantially equal to the distance between the bottom outside face of the encapsulant and the die, and the distance between the top outside face of the encapsulant and the frame is substantially two and half times the distance between the bottom outside face of the encapsulant and the lead frame. Consequently, the different thickness of different encapsulant portions achieves an optimum balance during curing that effectively reduces the deformation of the encapsulant. In addition, the encapsulant can be completely formed by an injection process, and no crack will form in the encapsulant.
Abstract:
A pepper mill includes a driving member coupled rotatably to a container body and cooperating with the container body to define a receiving space, a grinding unit, a planetary gear mechanism, and an adjusting component. The grinding unit includes a coupling shaft extending rotatably and being movable in the receiving space, a stationary first grinding seat, and a second grinding seat co-rotatable with the coupling shaft. The size of a grinding space between the first and second grinding seats is adjusted when the coupling shaft and the second grinding seat move axially relative to the first grinding seat. The planetary gear mechanism includes a driving gear unit and a driven gear unit driven rotatably by the driving gear unit to drive rotation of the coupling shaft. The adjusting component is connected threadedly to the coupling shaft and is operable to drive the axial movement of the coupling shaft and the second grinding seat.
Abstract:
An image processing method combining compression and watermark techniques is provided. In the method, a block is taken as a unit, and two ordered dither arrays mutually conjugate are used to code an original image, so as to insert information of a watermark into the original image during the coding process. Accordingly, the method generates a compressed image gives consideration to the compression ratio, the image quality and the data safety. On the other hand, the method also provides a procedure to extract the watermark from the compressed image, in order to verify whether the compressed image has been modified illegally.