公开(公告)号：US06521529B1

公开(公告)日：2003-02-18

申请号：US09679880

申请日：2000-10-05

申请人： Minh Van Ngo ,  Christy Mei-Chu Woo ,  Ercan Adem ,  Robert A. Huertas

发明人： Minh Van Ngo ,  Christy Mei-Chu Woo ,  Ercan Adem ,  Robert A. Huertas

IPC分类号： H01L2144

CPC分类号： H01L29/665 ,  H01L21/28518 ,  H01L29/6656 ,  Y10S257/90

摘要： Bridging between nickel silicide layers on a gate electrode and source/drain regions along silicon nitride sidewall spacers is prevented, after silicidation and removal of any unreacted nickel, by treating the exposed surfaces of the silicon nitride sidewall spacers with a HDP plasma to oxidize nickel silicide thereon forming a surface layer comprising silicoin oxide and silicon oxynitride. Embodiments include treating the silicon nitride sidewall spacers with a HDP plasma to form a surface silicon oxide/silicon oxynitride region having a thickness of about 40 Å to about 50 Å.

摘要翻译： 通过用HDP等离子体处理氮化硅侧壁间隔物的暴露表面以氧化硅化镍，在硅化和除去任何未反应的镍之后，阻止栅电极上的硅化镍层与氮化硅侧壁间隔物的源/漏区之间的桥接 其上形成包含硅氧烷氧化物和氮氧化硅的表面层。 实施例包括用HDP等离子体处理氮化硅侧壁间隔物以形成厚度为大约至大约的表面氧化硅/氧氮化硅区域。

公开(公告)号：US06605513B2

公开(公告)日：2003-08-12

申请号：US09729699

申请日：2000-12-06

申请人： Eric N. Paton ,  Ercan Adem ,  Jacques J. Bertrand ,  Paul R. Besser ,  Matthew S. Buynoski ,  John Clayton Foster ,  Paul L. King ,  George Jonathan Kluth ,  Minh Van Ngo ,  Christy Mei-Chu Woo

发明人： Eric N. Paton ,  Ercan Adem ,  Jacques J. Bertrand ,  Paul R. Besser ,  Matthew S. Buynoski ,  John Clayton Foster ,  Paul L. King ,  George Jonathan Kluth ,  Minh Van Ngo ,  Christy Mei-Chu Woo

IPC分类号： H01L21336

CPC分类号： H01L29/665 ,  H01L21/28061 ,  H01L21/28518 ,  H01L29/4933

摘要： A self-aligned silicide process that can accommodate a low thermal budget and form silicide regions of small dimensions in a controlled reaction. In a first temperature treatment, nickel metal or nickel alloy is reacted with a silicon material to form at least one high resistance nickel silicide region. Unreacted nickel is removed. A dielectric layer is then deposited over a high resistance nickel silicide regions. In a second temperature treatment, the at least one high resistance nickel silicide region and dielectric layer are reacted at a prescribed temperature to form at least one low resistance silicide region and process the dielectric layer. Bridging between regions is avoided by the two-step process as silicide growth is controlled, and unreacted nickel between silicide regions is removed after the first temperature treatment. The processing of the high resistance nickel silicide regions and the dielectric layer are conveniently combined into a single temperature treatment.

摘要翻译： 自对准硅化物工艺，可以适应低热预算，并在受控反应中形成小尺寸的硅化物区域。 在第一温度处理中，镍金属或镍合金与硅材料反应以形成至少一个高电阻镍硅化物区域。 去除未反应的镍。 然后将电介质层沉积在高电阻镍硅化物区域上。 在第二温度处理中，至少一个高电阻镍硅化物区域和电介质层在规定温度下反应以形成至少一个低电阻硅化物区域并处理介电层。 通过控制硅化物生长的两步法避免区域之间的桥接，并且在第一温度处理之后去除硅化物区域之间的未反应的镍。 将高电阻镍硅化物区域和电介质层的处理方便地组合成单温度处理。

公开(公告)号：US06383925B1

公开(公告)日：2002-05-07

申请号：US09497850

申请日：2000-02-04

申请人： Minh Van Ngo ,  Lu You ,  Robert A. Huertas ,  Ercan Adem

发明人： Minh Van Ngo ,  Lu You ,  Robert A. Huertas ,  Ercan Adem

IPC分类号： H01L2144

CPC分类号： H01L21/76838 ,  H01L21/76834 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： The adhesion of a barrier or capping layer to a Cu or Cu alloy interconnect member is significantly enhanced by treating the exposed surface of the Cu or Cu alloy interconnect member, after CMP, in a reaction chamber with a plasma containing ammonia and nitrogen for a brief period of time to reduce the surface oxide and then introducing silane into the reaction chamber to deposit the barrier layer, e.g., silicon nitride, under high density plasma conditions in the presence of nitrogen. The presence of nitrogen during plasma oxide layer reduction and plasma barrier layer deposition significantly improves adhesion of the barrier layer to the Cu or Cu alloy surface.

摘要翻译： 通过在具有氨和氮气的等离子体的反应室中处理Cu或Cu合金互连构件的CMP暴露表面之后，通过将Cu或Cu合金互连构件的阻挡层或覆盖层的粘合性显着提高， 一段时间以减少表面氧化物，然后将硅烷引入反应室，以在氮气存在下在高密度等离子体条件下沉积阻挡层，例如氮化硅。 在等离子体氧化物层还原和等离子体阻挡层沉积期间氮的存在显着提高了阻挡层对Cu或Cu合金表面的粘附性。

公开(公告)号：US06562718B1

公开(公告)日：2003-05-13

申请号：US09729700

申请日：2000-12-06

申请人： Qi Xiang ,  Ercan Adem ,  Jacques J. Bertrand ,  Paul R. Besser ,  Matthew S. Buynoski ,  John C. Foster ,  Paul L. King ,  George J. Kluth ,  Minh V. Ngo ,  Eric N. Paton ,  Christy Mei-Chu Woo

发明人： Qi Xiang ,  Ercan Adem ,  Jacques J. Bertrand ,  Paul R. Besser ,  Matthew S. Buynoski ,  John C. Foster ,  Paul L. King ,  George J. Kluth ,  Minh V. Ngo ,  Eric N. Paton ,  Christy Mei-Chu Woo

IPC分类号： H01L2144

CPC分类号： H01L29/66507 ,  H01L21/28097

摘要： A method of forming a fully silicidized gate of a semiconductor device includes forming silicide in active regions and a portion of a gate. A shield layer is blanket deposited over the device. The top surface of the gate electrode is then exposed. A refractory metal layer is deposited and annealing is performed to cause the metal to react with the gate and fully silicidize the gate, with the shield layer protecting the active regions of the device from further silicidization to thereby prevent spiking and current leakage in the active regions.

摘要翻译： 形成半导体器件的完全硅化栅极的方法包括在有源区和门的一部分中形成硅化物。 屏蔽层被覆盖在该器件上。 然后露出栅电极的顶表面。 沉积难熔金属层并进行退火以使金属与栅极反应并使栅极完全硅化，屏蔽层保护器件的有源区不受另外的硅化，从而防止有源区中的峰值和电流泄漏 。

公开(公告)号：US06667070B1

公开(公告)日：2003-12-23

申请号：US10061349

申请日：2002-02-04

申请人： Ercan Adem

发明人： Ercan Adem

IPC分类号： C23C1652

CPC分类号： C23C16/52

摘要： A novel method is provided for in situ monitoring of a film being deposited on a wafer for manufacturing a semiconductor device. The method involves producing an incident beam of radiation directed during a deposition process to a film being deposited on a wafer in a deposition reactor. The Raman scattered radiation resulted from interaction of the incident beam with molecules of the deposited film is detected to produce a Raman spectrum of the deposited film.

摘要翻译： 提供一种新颖的方法用于原位监测沉积在用于制造半导体器件的晶片上的膜。 该方法包括在沉积过程中将沉积在晶片上的膜的沉积反应器中产生的辐射入射光束产生。 检测入射光束与沉积膜分子相互作用产生的拉曼散射辐射，产生沉积膜的拉曼光谱。

公开(公告)号：US20070020919A1

公开(公告)日：2007-01-25

申请号：US11173244

申请日：2005-07-01

申请人： Ercan Adem ,  Nicholas Tripsas

发明人： Ercan Adem ,  Nicholas Tripsas

IPC分类号： H01L21/4763 ,  H01L21/44

CPC分类号： H01L21/76849 ,  H01L21/76834 ,  H01L21/76886

摘要： Methods are described for eliminating void formation during the fabrication of and/or operation of memory cells/devices. According to one aspect of the present disclosure, the methods to eliminate voids include formation of an opening on a semiconductor structure, formation of a diffusion barrier layer, deposition of a metal into the opening, preamorphization of the metal using preamorphization implants, and formation of a conductivity facilitating layer. According to another aspect of the present disclosure, the methods to eliminate voids include formation of an opening on a semiconductor structure, formation of a diffusion barrier layer, deposition of a metal into the opening, preamorphization of the metal using a contact with a plasma, and formation of a conductivity facilitating layer.

摘要翻译： 描述了在存储器单元/器件的制造和/或操作期间消除空隙形成的方法。 根据本公开的一个方面，消除空隙的方法包括在半导体结构上形成开口，形成扩散阻挡层，将金属沉积到开口中，使用预变形植入物预先形成金属，以及形成 导电促进层。 根据本公开的另一方面，消除空隙的方法包括在半导体结构上形成开口，形成扩散阻挡层，将金属沉积到开口中，使用与等离子体接触进行金属预变质， 并形成导电促进层。

公开(公告)号：US06518185B1

公开(公告)日：2003-02-11

申请号：US10127521

申请日：2002-04-22

申请人： Pin-Chin Connie Wang ,  Fei Wang ,  Kashmir Sahota ,  Steven Avanzino ,  Amit Marathe ,  Matthew Buynoski ,  Ercan Adem ,  Christy Woo

发明人： Pin-Chin Connie Wang ,  Fei Wang ,  Kashmir Sahota ,  Steven Avanzino ,  Amit Marathe ,  Matthew Buynoski ,  Ercan Adem ,  Christy Woo

IPC分类号： H01L2144

CPC分类号： H01L21/76877

摘要： In the present method of fabricating a semiconductor device, openings of different configurations (for example, different aspect ratios) are provided in a dielectric layer. Substantially undoped copper is deposited over the dielectric layer, filling the openings and extending above the dielectric layer, the different configurations of the openings providing an upper surface of the substantially undoped copper that is generally non-planar. A portion of the substantially undoped copper is removed to provide a substantially planar upper surface thereof, and a layer of doped copper is deposited on the upper surface of the substantially undoped copper. An anneal step is undertaken to difffuse the doping element into the copper in the openings.

摘要翻译： 在本发明的半导体装置的制造方法中，在介质层中设置不同结构（例如不同的纵横比）的开口。 基本上未掺杂的铜沉积在电介质层上，填充开口并在电介质层上方延伸，开口的不同构型提供通常为非平面的基本未掺杂的铜的上表面。 去除基本上未掺杂的铜的一部分以提供其基本平坦的上表面，并且在基本未掺杂的铜的上表面上沉积掺杂的铜层。 进行退火步骤以将掺杂元素扩散到开口中的铜中。

公开(公告)号：US06281559B1

公开(公告)日：2001-08-28

申请号：US09261274

申请日：1999-03-03

申请人： Bin Yu ,  Ercan Adem

发明人： Bin Yu ,  Ercan Adem

IPC分类号： H01L31119

CPC分类号： H01L21/82345 ,  H01L21/2807 ,  H01L21/823842 ,  H01L29/4925 ,  H01L29/4966

摘要： An ultra-large-scale integrated (ULSI) circuit includes MOSFETs which have different threshold voltages and yet have the same channel characteristics. The MOSFETs include gate structures or gate stacks with a silicon and germanium material provided over a seed layer. The seed layer can be a 20-40 Å polysilicon layer. An amorphous silicon layer is provided over the silicon and germanium material, and a cap layer is provided over the amorphous silicon layer. The polysilicon material is implanted with lower concentrations of germanium, where lower threshold voltage MOSFETs are required. Over a range of 0-60% concentration of germanium, the threshold voltage can be varied by roughly 240 mV.

摘要翻译： 超大规模集成（ULSI）电路包括具有不同阈值电压但具有相同通道特性的MOSFET。 MOSFET包括在种子层上提供硅和锗材料的栅极结构或栅极堆叠。 种子层可以是20-40多晶硅层。 在硅和锗材料上提供非晶硅层，并且在非晶硅层上提供覆盖层。 用较低浓度的锗注入多晶硅材料，其中需要较低的阈值电压MOSFET。 在锗的0-60％浓度范围内，阈值电压可以改变大约240mV。

公开(公告)号：US06869878B1

公开(公告)日：2005-03-22

申请号：US10367406

申请日：2003-02-14

申请人： Ercan Adem ,  John E. Sanchez ,  Darrell M. Erb ,  Suzette K. Pangrle

发明人： Ercan Adem ,  John E. Sanchez ,  Darrell M. Erb ,  Suzette K. Pangrle

IPC分类号： H01L21/44 ,  H01L21/4763 ,  H01L21/768

CPC分类号： H01L21/76849 ,  H01L21/76807 ,  H01L21/76885

摘要： The reliability and performance of planarized metallization patterns in an electrical device, for example copper, inlaid in the surface of a layer of dielectric material overlying a semiconductor wafer substrate, are enhanced by a method for reliably depositing a barrier layer selective to the metallization patterns. The method comprises forming a sacrificial dielectric layer above a substrate. Metallization patterns are formed in the sacrificial dielectric layer. The barrier layer is selectively deposited on the metallization patterns. Portions of the barrier material undesirably deposited on the sacrificial dielectric layer are removed by removing the sacrificial dielectric layer, thus preventing bridging of adjacent metallization features by the barrier layer portions. An interlevel dielectric layer is then formed in place of the sacrificial dielectric layer. The selectively deposited barrier layer advantageously reduces parasitic capacitance between metallization features in comparison to a conventional blanket-deposited silicon nitride barrier layer.

摘要翻译： 通过用于可靠地沉积对金属化图案有选择性的阻挡层的方法，增强了嵌入在覆盖在半导体晶片衬底上的介电材料层的表面中的电子器件（例如铜）中的平面化金属化图案的可靠性和性能。 该方法包括在衬底上形成牺牲介电层。 在牺牲电介质层中形成金属化图案。 阻挡层选择性地沉积在金属化图案上。 通过去除牺牲介电层来去除不期望地沉积在牺牲介电层上的阻挡材料的部分，从而防止相邻金属化特征由阻挡层部分桥接。 然后形成层间电介质层代替牺牲电介质层。 与常规的覆盖层沉积的氮化硅阻挡层相比，选择性沉积的势垒层有利地减小了金属化特征之间的寄生电容。

公开(公告)号：US06641747B1

公开(公告)日：2003-11-04

申请号：US09783204

申请日：2001-02-15

申请人： Todd P. Lukanc ,  Ercan Adem

发明人： Todd P. Lukanc ,  Ercan Adem

IPC分类号： C23C1600

CPC分类号： H01J37/32935 ,  H01J37/32963

摘要： An apparatus and method for detecting an endpoint for an etching process utilize a reaction chamber with an ion source and detector placed within the reaction chamber. The ion source directs a primary beam of ions towards a wafer so that the ion beam impacts the top layer of the wafer. A detector detects primary ions reflected from the wafer and secondary ions scattered from the wafer. A value is determined that corresponds to the amount of reflected and scattered ions. A change in the value indicates that the ion beam is impacting a layer beneath the top layer of the wafer, and signifies the reaching of the etch process endpoint.

摘要翻译： 用于检测蚀刻过程的端点的装置和方法利用具有放置在反应室内的离子源和检测器的反应室。 离子源将一次离子束照射到晶片，使得离子束撞击晶片的顶层。 检测器检测从晶片反射的一次离子和从晶片散射的二次离子。 确定对应于反射和散射离子的量的值。 值的变化表示离子束影响晶片顶层下方的层，并表示蚀刻工艺终点的到达。