公开(公告)号：US5037748A

公开(公告)日：1991-08-06

申请号：US559050

申请日：1990-07-30

申请人： Minoru Matsubara ,  Tohru Masukawa ,  Norihiko Adachi ,  Miki Fukuta ,  Masao Kariya ,  Tohru Kodama ,  Toshio Omori

发明人： Minoru Matsubara ,  Tohru Masukawa ,  Norihiko Adachi ,  Miki Fukuta ,  Masao Kariya ,  Tohru Kodama ,  Toshio Omori

IPC分类号： C07C62/32 ,  C12P7/44

CPC分类号： C12P7/44 ,  C07C62/32 ,  Y10S435/874

摘要： A process for producing cis-4,5-dihydro-4,5-dihydroxyphthalic acid which comprises producing cis-4,5-dihydro-4,5-dihydroxyphthalic acid and/or a salt thereof from phthalic acid and/or a salt thereof using a microorganism whose activity to decompose cis-4,5-dihydro-4,5-dihydroxyphthalic acid and/or a salt thereof has disappeared or diminished, acidifying the product system unless it is acidic, and then extracting therefrom cis-4,5-dihydro-4,5-dihydroxyphthalic acid with such an organic solvent that it is miscible with water in any proportion and the mixture of the organic solvent with water can be separated into two layers upon adding a salt thereto, in the presence of a salt, or with an alcohol having 4 carbon atoms. The process enables one to produce cis-4,5-dihydro-4,5-dihydroxyphthalic acid from phthalic acid and/or its salt in a high yield.

公开(公告)号：US6011123A

公开(公告)日：2000-01-04

申请号：US974916

申请日：1997-11-20

申请人： Takahiko Kurosawa ,  Kinji Yamada ,  Minoru Matsubara ,  Yasutake Inoue ,  Tomotaka Shinoda ,  Kouhei Gotou

发明人： Takahiko Kurosawa ,  Kinji Yamada ,  Minoru Matsubara ,  Yasutake Inoue ,  Tomotaka Shinoda ,  Kouhei Gotou

IPC分类号： C08G77/455 ,  C08K5/5415 ,  C08L79/08 ,  C09D183/10 ,  H01L21/312 ,  C08L77/00

CPC分类号： H01L21/312 ,  C08G77/455 ,  C08K5/5415 ,  C08L79/08 ,  C09D183/10

摘要： A curable resin composition comprising (A) a hydrolyzate or a partial condensate of an organosilane compound, or both; (B) at least one compound selected from the group consisting of polyamic acids having a hydrolyzable silyl group or carboxylic acid anhydride group, or both, and polyimides having a hydrolyzable silyl group or carboxylic acid anhydride group, or both; and (C) a chelate compound or an alkoxide compound with a metal selected from the group consisting of zirconium, titanium, and aluminum, or both the chelate compound and the alkoxide compound. The resin composition can be cured and fabricated without producing no cracks into a cured product such as a semiconductor device having a low dielectric constant, high heat resistance and moisture resistance, superior adhesion to various substrate materials, superb electrical insulation properties, and low moisture absorption. Semiconductor devices using this curable resin composition as an insulating film exhibit a low electricity consumption, work at a high speed, and have excellent reliability.

摘要翻译： 一种可固化树脂组合物，其包含（A）有机硅烷化合物的水解产物或部分缩合物，或两者; （B）至少一种选自具有水解性甲硅烷基或羧酸酐基团的聚酰胺酸或二者的化合物和具有可水解甲硅烷基或羧酸酐基团的聚酰亚胺或两者; 和（C）螯合化合物或选自锆，钛和铝的金属的醇盐化合物，或螯合化合物和醇盐化合物两者。 可以固化和制造树脂组合物，而不会在诸如具有低介电常数，高耐热性和耐湿性，优异的各种基材的粘合性，优异的电绝缘性能和低吸湿性的半导体装置等固化产物中不产生裂纹 。 使用该固化性树脂组合物作为绝缘膜的半导体装置的电耗低，高速工作，可靠性优异。

公开(公告)号：US06313233B1

公开(公告)日：2001-11-06

申请号：US09447952

申请日：1999-11-29

申请人： Takahiko Kurosawa ,  Kinji Yamada ,  Minoru Matsubara ,  Yasutake Inoue ,  Tomotaka Shinoda ,  Kouhei Gotou

发明人： Takahiko Kurosawa ,  Kinji Yamada ,  Minoru Matsubara ,  Yasutake Inoue ,  Tomotaka Shinoda ,  Kouhei Gotou

IPC分类号： C08G6548

CPC分类号： H01L21/02126 ,  C08G77/455 ,  C08K5/5415 ,  C08L79/08 ,  C09D183/10 ,  H01L21/312 ,  C08L2666/52

摘要： A curable resin composition comprising (A) a hydrolyzate or a partial condensate of an organosilane compound, or both; (B) at least one compound selected from the group consisting of polyamic acids having a hydrolyzable silyl group or carboxylic acid anhydride group, or both, and polyimides having a hydrolyzable silyl group or carboxylic acid anhydride group, or both; and (C) a chelate compound or an alkoxide compound with a metal selected from the group consisting of zirconium, titanium, and aluminum, or both the chelate compound and the alkoxide compound. The resin composition can be cured and fabricated without producing no cracks into a cured product such as a semiconductor device having a low dielectric constant, high heat resistance and moisture resistance, superior adhesion to various substrate materials, superb electrical insulation properties, and low moisture absorption. Semiconductor devices using this curable resin composition as an insulating film exhibit a low electricity consumption, work at a high speed, and have excellent reliability.

摘要翻译： 一种可固化树脂组合物，其包含（A）有机硅烷化合物的水解产物或部分缩合物，或两者; （B）至少一种选自具有水解性甲硅烷基或羧酸酐基团的聚酰胺酸或二者的化合物和具有可水解甲硅烷基或羧酸酐基团的聚酰亚胺或两者; 和（C）螯合化合物或选自锆，钛和铝的金属的醇盐化合物，或螯合化合物和醇盐化合物两者。 可以固化和制造树脂组合物，而不会在诸如具有低介电常数，高耐热性和耐湿性，优异的各种基材的粘合性，优异的电绝缘性能和低吸湿性的半导体装置等固化产物中不产生裂纹 。 使用该固化性树脂组合物作为绝缘膜的半导体装置的电耗低，高速工作，可靠性优异。

公开(公告)号：US06235101B1

公开(公告)日：2001-05-22

申请号：US09203534

申请日：1998-12-01

申请人： Takahiko Kurosawa ,  Kinji Yamada ,  Tomotaka Shinoda ,  Minoru Matsubara ,  Satoko Hakamatsuka

发明人： Takahiko Kurosawa ,  Kinji Yamada ,  Tomotaka Shinoda ,  Minoru Matsubara ,  Satoko Hakamatsuka

IPC分类号： C09D525

CPC分类号： H01L21/02126 ,  C08G77/58 ,  C09D183/14 ,  H01L21/02282 ,  H01L21/3121

摘要： A composition for film formation and a film obtained by heating the composition. The composition comprises: (A) a hydrolyzate and/or partial condensate of a compound represented by the following formula (1) R1nSi(OR2)4-n  (1) wherein R1 and R2 may be the same or different and each represent an alkyl group having 1 to 5 carbon atoms or an aryl group having 6 to 20 carbon atoms, and n is an integer of 1 or 2; (B) a metal chelate compound represented by the following formula (2) R3tM(OR4)s-t  (2) wherein R3 represents a chelating agent, M represents a metal atom, R4 represents an alkyl group having 2 to 5 carbon atoms or an aryl group having 6 to 20 carbon atoms, s represents a valence of the metal M, and t is an integer of 1 to s; (C) an organic solvent having a boiling point of 110 to 180° C.; and (D) &bgr;-diketone.

摘要翻译： 用于成膜的组合物和通过加热组合物获得的膜。组合物包含：（A）由下式（1）表示的化合物的水解产物和/或部分缩合物，其中R 1和R 2可以相同或不同， 各自表示碳原子数1〜5的烷基或碳原子数6〜20的芳基，n表示1或2的整数，（B）由下式（2）表示的金属螯合物，其中，R3表示 螯合剂，M表示金属原子，R4表示碳原子数2〜5的烷基或碳原子数6〜20的芳基，s表示金属M的化合价，t表示1〜s的整数。 ;（C）沸点为110〜180℃的有机溶剂。 和（D）β-二酮。

公开(公告)号：US6084053A

公开(公告)日：2000-07-04

申请号：US60105

申请日：1998-04-15

申请人： Minoru Matsubara ,  Yasutake Inoue ,  Mayumi Kakuta ,  Igor Rozhanskii ,  Kohei Goto

发明人： Minoru Matsubara ,  Yasutake Inoue ,  Mayumi Kakuta ,  Igor Rozhanskii ,  Kohei Goto

IPC分类号： C08G73/10 ,  H01B3/30 ,  H05K1/03 ,  B32B27/00

CPC分类号： H01B3/306 ,  C08G73/10 ,  C08G73/1039 ,  H05K1/0346 ,  Y10S428/901

摘要： Electronic parts and a process for manufacturing the electronic parts are provided. The electronic parts comprise an electric insulating material exhibiting a high heat resistance and low dielectric constant as a structural component. The electric insulating material is formed of a polyimide containing a recurring unit represented by the following general formula (1). ##STR1##

摘要翻译： 提供了电子部件和用于制造电子部件的工艺。 电子部件包括表现出高耐热性和低介电常数作为结构部件的电绝缘材料。 电绝缘材料由含有由以下通式（1）表示的重复单元的聚酰亚胺形成。