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    Semiconductor module
    3.
    发明授权
    Semiconductor module 失效
    半导体模块

    公开(公告)号：US5089936A

    公开(公告)日：1992-02-18

    申请号：US404341

    申请日：1989-09-07

    申请人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

    发明人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

    IPC分类号： H01L23/40 ,  H01L23/473

    CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253

    摘要： In a semiconductor module including a wiring substrate having one or a plurality of semiconductor devices electrically connected thereon, a housing constituted of a sealing frame and a ceiling board to enclose the semiconductor devices therein, and a cooling jacket to cool the semiconductor devices. The semiconductor module comprises an elastic arm placed on the cooling jacket for exerting pressure to cause the cooling jacket to be uniformly contacted with the housing ceiling board, and clamping jigs press the cooling jacket and the ceiling board through the elastic arm, so that the clamping jigs may serve to press the respective intermediate positions of the four sides of the cooling jacket through the elastic arm, or screw fasteners may be provided on the elastic arm for controlling the displacements and pressing force.

    摘要翻译： 在包括具有电连接在其上的一个或多个半导体器件的布线基板的半导体模块中，由密封框架和顶板组成的壳体以封装其中的半导体器件，以及用于冷却半导体器件的冷却套。 半导体模块包括放置在冷却套上的弹性臂，用于施加压力以使冷却套与壳体天花板均匀地接触，并且夹具通过弹性臂挤压冷却套和顶板，使得夹紧 夹具可以用于通过弹性臂挤压冷却套的四个侧面的相应中间位置，或者可以在弹性臂上设置螺钉紧固件以控制位移和按压力。

    Electronic apparatus
    4.
    发明授权
    Electronic apparatus 失效
    电子仪器

    公开(公告)号：US5592363A

    公开(公告)日：1997-01-07

    申请号：US128227

    申请日：1993-09-29

    申请人： Takayuki Atarashi ,  Toshio Hatada ,  Takahiro Daikoku ,  Nobuo Kawasaki ,  Toshiki Iino ,  Tamotsu Tsukaguchi ,  Kenichi Kasai ,  Fumiyuki Kobayashi ,  Yoshito Hayashi

    发明人： Takayuki Atarashi ,  Toshio Hatada ,  Takahiro Daikoku ,  Nobuo Kawasaki ,  Toshiki Iino ,  Tamotsu Tsukaguchi ,  Kenichi Kasai ,  Fumiyuki Kobayashi ,  Yoshito Hayashi

    IPC分类号： H01L23/467 ,  H05K7/20

    CPC分类号： H01L23/467 ,  H01L2924/0002

    摘要： An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.

    摘要翻译： 在每个半导体器件上设置具有多个半导体器件的电子设备，所述多个半导体器件在操作期间产生热量，散热片具有多个平板状或针状散热片。 喷嘴与散热器相关联，以将冷却流体供应到散热器中。 散热器布置成使得所有这些散热器沿相同的方向引导和排出冷却流体。 在由散热器确定的流体的流动方向（x方向）和冷却流体的排放量上测量的各个喷嘴的宽度小于相关散热器的宽度。 在与x方向垂直的方向（y方向）上测量的喷嘴的宽度小于相关联的散热器的宽度。 相邻喷嘴之间的空间提供了足够横截面的排放通道，其减小被加热的冷却介质通过其排出所遇到的阻力。

    Cooling device of multi-chip module
    6.
    发明授权
    Cooling device of multi-chip module 失效
    多芯片模块冷却装置

    公开(公告)号：US5751062A

    公开(公告)日：1998-05-12

    申请号：US571711

    申请日：1995-12-13

    申请人： Takahiro Daikoku ,  Fumiyuki Kobayashi ,  Noriyuki Ashiwake ,  Kenichi Kasai ,  Keizou Kawamura ,  Akio Idei

    发明人： Takahiro Daikoku ,  Fumiyuki Kobayashi ,  Noriyuki Ashiwake ,  Kenichi Kasai ,  Keizou Kawamura ,  Akio Idei

    IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/367

    CPC分类号： H01L23/4338 ,  H01L2224/73253

    摘要： A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.

    摘要翻译： 多芯片模块的冷却装置具有独立于热变形和易于组装和拆卸的微封装。 多芯片模块包括多层基板，其上安装有每个包装LSI芯片的微封装以及与冷却器一体形成的壳体。 每个微封装包括第一导热构件，具有用于容纳LSI芯片的盖部分和与其一体形成的与盖部分相同的材料制成的第一鳍片，以及固定到第一热量帽盖部分的基板 所述LSI芯片被安装在所述基板上，所述基板被牢固地固定到所述导热部件的盖部，同时在其背面牢固地接合到所述第一导热部件的盖部的内表面。 每个包括基部和第二翅片的第二热传导构件设置成与第一翅片接合并且分别通过弹簧压靠在冷却器上。

    Cooling arrangement for semiconductor devices and method of making the same
    8.
    发明授权
    Cooling arrangement for semiconductor devices and method of making the same 失效
    用于半导体器件的冷却装置及其制造方法

    公开(公告)号：US5133403A

    公开(公告)日：1992-07-28

    申请号：US423386

    申请日：1989-10-19

    申请人： Hitoshi Yokono ,  Takao Terabayashi ,  Nobuo Kayaba ,  Takahiro Daikoku ,  Shigekazu Kieda ,  Fumiyuki Kobayashi ,  Shizuo Zushi

    发明人： Hitoshi Yokono ,  Takao Terabayashi ,  Nobuo Kayaba ,  Takahiro Daikoku ,  Shigekazu Kieda ,  Fumiyuki Kobayashi ,  Shizuo Zushi

    IPC分类号： H01L23/373 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

    CPC分类号： H01L23/4338 ,  H01L23/3733 ,  F28F2255/18 ,  H01L2224/16225

    摘要： A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.m, with a sintering aid being added and the powdery mixture being subjected to a hot press sintering whereby the sintered material is low in thermal conductivity in a direction parallel to an axis of a shaft of the hot press.

    摘要翻译： 一种用于通过从大型电子计算机中的诸如半导体集成芯片的半导体元件产生的热量来冷却半导体元件的冷却装置。 该冷却装置由维氏硬度不高于AlN材料的五分之一的复合AlN-BN烧结材料制成，并且二维方向的热导率的各向异性特性比AlN的各向异性高 各向同性的导热性。 即使复合烧结体的形状和尺寸一致，冷却装置也可以批量生产，同时具有与每个半导体元件产生的热量匹配的高转印性能。 复合烧结材料由平均粒径不小于1μm的六方晶BN粉末和平均粒径约2μm的AlN粉末的混合物形成，并加入烧结助剂。 混合物进行热压烧结，由此烧结材料在与热压机的轴的轴线平行的方向上的导热性低。

    Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
    9.
    发明授权
    Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system 失效
    用于冷却电子设备的冷却系统和用于冷却系统的散热片

    公开(公告)号：US5077601A

    公开(公告)日：1991-12-31

    申请号：US404350

    申请日：1989-09-07

    申请人： Toshio Hatada ,  Takayuki Atarashi ,  Takahiro Daikoku ,  Satomi Kobayashi ,  Shizuo Zushi ,  Fumiyuki Kobayashi ,  Susumu Iwai

    发明人： Toshio Hatada ,  Takayuki Atarashi ,  Takahiro Daikoku ,  Satomi Kobayashi ,  Shizuo Zushi ,  Fumiyuki Kobayashi ,  Susumu Iwai

    IPC分类号： H01L23/467

    CPC分类号： H01L23/467 ,  H01L2924/0002

    摘要： A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.

    摘要翻译： 一种冷却系统，用于通过使冷却流体沿着沿着冷却流体的主流排列成串联的电子装置的发热部件等发热部件而流动而冷却电子设备。 冷却系统具有附接到发热部件的散热翅片，以及限定冷却流体流动通道的冷却管道，其中设置有由发热部件和散热翅片组成的组件。 当在垂直于冷却流体的主流方向的平面中时，流动通道在上游端组件的上游端处具有大于组件的截面面积的横截面面积。 流动通道的横截面积朝向下游端逐渐减小，由此流动通道被分成主通道，冷却流体的主流分量通过该主通道直接流入一系列组件和辅助通道，通过该辅助通道 冷却流体的辅助部件基本垂直地朝着发热部件流动以撞击发热部件。