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    Chip with Power Supply Device
    1.
    发明申请
    Chip with Power Supply Device 审中-公开
    带电源的芯片

    公开(公告)号：US20080028477A1

    公开(公告)日：2008-01-31

    申请号：US11579213

    申请日：2005-02-02

    申请人： Mirko Lehmann ,  Ulrich Sieben

    发明人： Mirko Lehmann ,  Ulrich Sieben

    IPC分类号： G06F1/26 ,  G08B29/16

    CPC分类号： H01M8/02 ,  G06K19/0702 ,  G06K19/073 ,  G06K19/07381 ,  H01L23/576 ,  H01L2924/0002 ,  H01M8/04559 ,  H01M8/04917 ,  H01M8/04947 ,  H01M8/2475 ,  H01M2250/00 ,  H01M2250/30 ,  Y02B90/18 ,  H01L2924/00

    摘要： A chip includes a memory that stores confidential data, a power supply device to apply a voltage and/or or a current, and an interface to transfer the data from and/or to another device. To secure the data in the memory, the power supply device is an integrated component of the chip. The power supply device is equipped with a limited, non-replenishable fuel reservoir so that data can be maintained in the memory over a limited service life. In other embodiments, voltage provided by the power supply device can also be employed actively to delete data in the memory in the event of unauthorized access to the chip.

    摘要翻译： 芯片包括存储秘密数据的存储器，用于施加电压和/或电流的电源装置，以及将数据从和/或传送到另一装置的接口。 为了保护存储器中的数据，电源设备是芯片的集成组件。 电源设备配备有限的，不可补充的燃料储存器，以便数据可在有限的使用寿命内保持在存储器中。 在其他实施例中，在未经授权的访问芯片的情况下，还可以主动地采用由电源装置提供的电压来删除存储器中的数据。

    Chip arrangement
    2.
    发明授权
    Chip arrangement 失效
    芯片布置

    公开(公告)号：US06288440B1

    公开(公告)日：2001-09-11

    申请号：US09342697

    申请日：1999-06-29

    申请人： Ulrich Sieben ,  Günter Igel ,  Mirko Lehmann ,  Hans-Jürgen Gahle ,  Bernhard Wolf ,  Werner Baumann ,  Ralf Ehret

    发明人： Ulrich Sieben ,  Günter Igel ,  Mirko Lehmann ,  Hans-Jürgen Gahle ,  Bernhard Wolf ,  Werner Baumann ,  Ralf Ehret

    IPC分类号： H01L23495

    CPC分类号： H01L23/5385 ,  A61B5/14532 ,  A61B5/1473 ,  G01N33/48707 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A chip arrangement (1) has a substrate board (2) with an opening (3), into which a carrier chip (4) is inserted, which has an electrical or electronic structural component (5). At least one conductor path (7) is integrated into the carrier chip (4), which connects the structural component (5) to the electrical connection contact (8). The carrier chip (4) is inserted into the opening (3) in such a way that its ends project beyond the opposite-facing, flat-sided surfaces (9, 9′) of the substrate board (2), and thereby form overhangs (10, 10′). Here, the structural component is arranged on the overhang (10) projecting beyond the one surface (9), and the connection contact (8) is arranged on the overhang (10′) projecting beyond the other surface (9′), and the conductor path (7) connecting the structural component (5) and the connection contact (8) passes through the opening (3). A seal is arranged between the substrate board (2) and the carrier chip (4).

    摘要翻译： 芯片装置（1）具有带有开口（3）的基板（2），其中插入有载体芯片（4），其具有电或电子结构部件（5）。 至少一个导体路径（7）集成到载体芯片（4）中，其将结构部件（5）连接到电连接触点（8）。 载体芯片（4）以这样的方式插入到开口（3）中，使得其端部突出超过衬底板（2）的相对面对的平坦表面（9,9'），从而形成突出部 （10,10'）。 这里，结构部件布置在突出超过一个表面（9）的伸出部（10）上，并且连接触点（8）布置在突出超过另一个表面（9'）的伸出部（10'）上，并且 连接结构部件（5）和连接触点（8）的导体路径（7）穿过开口（3）。 在基板（2）和载体芯片（4）之间设置密封件。

    Apparatus for intracellular manipulation of a biological cell
    4.
    发明授权
    Apparatus for intracellular manipulation of a biological cell 失效
    用于细胞内操作生物细胞的装置

    公开(公告)号：US07501276B2

    公开(公告)日：2009-03-10

    申请号：US10202419

    申请日：2002-07-23

    申请人： Werner Baumann ,  Ralf Ehret ,  Mirko Lehmann ,  Günter Igel ,  Hans-Jürgen Gahle ,  Ulrich Sieben ,  Ingo Freund ,  Martin Brischwein

    发明人： Werner Baumann ,  Ralf Ehret ,  Mirko Lehmann ,  Günter Igel ,  Hans-Jürgen Gahle ,  Ulrich Sieben ,  Ingo Freund ,  Martin Brischwein

    IPC分类号： C12M1/42 ,  C12N15/87

    CPC分类号： C12N15/89 ,  C12M35/02 ,  C12M35/04 ,  C12M35/08 ,  C12N13/00

    摘要： A process is provided for the intracellular manipulation of a biological cell (3) which is positioned adhering to a support area (5) in a culture medium (2). Inside the support area (5) for the cell (3) an opening into the membrane of the cell (3) is created spaced from its support edge. The edge of the cell membrane surrounding the opening, adhering to the support area (5), thus seals off the cell fluid situated in the interior of the cell (3) from the culture medium (2) and insulates the cell fluid against the culture medium (2). The interior of the cell (3) is manipulated through the opening. An apparatus for implementing the process is also provided, including an object carrier (4) with a support area (5) for adhering the cell and a poration tool (6) for creating the opening in the cell membrane. The poration tool (6) may be any of various chemical, mechanical and/or electrical devices.

    摘要翻译： 提供了一种用于细胞内操作生物细胞（3）的方法，所述生物细胞（3）定位为粘附在培养基（2）中的支持区域（5）。 在电池（3）的支撑区域（5）的内部，与电池（3）的隔膜形成的开口与其支撑边缘间隔开。 围绕开口的细胞膜的边缘附着在支撑区域（5）上，从而将位于细胞（3）内部的细胞液体与培养基（2）密封在一起，并使细胞液体抵抗培养物 中等（2）。 电池（3）的内部通过开口被操纵。 还提供了一种用于实现该方法的装置，包括具有用于粘附细胞的支撑区域（5）的物体载体（4）和用于在细胞膜中形成开口的引锭工具（6）。 引锭工具（6）可以是各种化学，机械和/或电气装置中的任何一种。

    Integrated sensor arrangement
    5.
    发明申请
    Integrated sensor arrangement 审中-公开
    集成传感器布置

    公开(公告)号：US20070107514A1

    公开(公告)日：2007-05-17

    申请号：US11545778

    申请日：2006-10-10

    申请人： Ulrich Sieben ,  Holger Klapproth ,  Mirko Lehmann

    发明人： Ulrich Sieben ,  Holger Klapproth ,  Mirko Lehmann

    IPC分类号： G01F15/14

    CPC分类号： G01N21/6454

    摘要： An integrated sensor array has a substrates, at least one sensor element, and a signal processing device integrated in the substrate and connected or capable of being connected with the sensor elements. A layer having a measuring surface is capable of being detachably bonded to the substrate so that a signal emitted from the measuring surface is capable of being processed by the signal processing device when the layer is bonded to the substrate. The substrate has at least one feedthrough hole abutting with the layer, which feedthrough hole is connected or capable of being connected to a vacuum generating device in order to bond the layer to the substrate by suction.

    摘要翻译： 集成传感器阵列具有基板，至少一个传感器元件和集成在基板中并连接或能够与传感器元件连接的信号处理装置。 具有测量表面的层能够可拆卸地结合到基板，使得当该层与基板结合时，从测量表面发射的信号能够被信号处理装置处理。 衬底具有与该层邻接的至少一个馈通孔，所述馈通孔连接或能够连接到真空产生装置，以便通过抽吸将层粘合到衬底。

    Method for intracellular manipulation of a biological cell
    8.
    发明授权
    Method for intracellular manipulation of a biological cell 有权
    细胞内操作生物细胞的方法

    公开(公告)号：US06475760B1

    公开(公告)日：2002-11-05

    申请号：US09321051

    申请日：1999-05-27

    申请人： Werner Baumann ,  Ralf Ehret ,  Mirko Lehmann ,  Günter Igel ,  Hans-Jürgen Gahle ,  Bernhard Wolf ,  Ulrich Sieben ,  Ingo Freund ,  Martin Brischwein

    发明人： Werner Baumann ,  Ralf Ehret ,  Mirko Lehmann ,  Günter Igel ,  Hans-Jürgen Gahle ,  Bernhard Wolf ,  Ulrich Sieben ,  Ingo Freund ,  Martin Brischwein

    IPC分类号： C12N1300

    CPC分类号： C12N15/89 ,  C12M35/02 ,  C12M35/04 ,  C12M35/08 ,  C12N13/00

    摘要： A process is provided for the intracellular manipulation of a biological cell (3) which is positioned adhering to a support area (5) in a culture medium (2). Inside the support area (5) for the cell (3) an opening into the membrane of the cell (3) is created spaced from its support edge. The edge of the cell membrane surrounding the opening, adhering to the support area (5), thus seals off the cell fluid situated in the interior of the cell (3) from the culture medium (2) and insulates the cell fluid against the culture medium (2). The interior of the cell (3) is manipulated through the opening. An apparatus for implementing the process is also provided, including an object carrier (4) with a support area (5) for adhering the cell and a poration tool (6) for creating the opening in the cell membrane. The poration tool (6) may be any of various chemical, mechanical and/or electrical devices.

    摘要翻译： 提供了一种用于细胞内操作生物细胞（3）的方法，所述生物细胞（3）定位为粘附在培养基（2）中的支持区域（5）。 在电池（3）的支撑区域（5）的内部，与电池（3）的隔膜形成的开口与其支撑边缘间隔开。 围绕开口的细胞膜的边缘附着在支撑区域（5）上，从而将位于细胞（3）内部的细胞液体与培养基（2）密封并使细胞液体抵抗培养物 中等（2）。 电池（3）的内部通过开口被操纵。 还提供了一种用于实现该方法的装置，包括具有用于粘附细胞的支撑区域（5）的物体载体（4）和用于在细胞膜中形成开口的引锭工具（6）。 引锭工具（6）可以是各种化学，机械和/或电气装置中的任何一种。

    Electric component
    9.
    发明授权
    Electric component 有权
    电气部件

    公开(公告)号：US08084792B2

    公开(公告)日：2011-12-27

    申请号：US12840597

    申请日：2010-07-21

    申请人： Mirko Lehmann ,  Ingo Freund

    发明人： Mirko Lehmann ,  Ingo Freund

    IPC分类号： H01L29/78

    CPC分类号： G01N27/4148

    摘要： An electric component comprising a sensor and/or actuator chip with a substrate on which a passivating layer and a sensor and/or actuator structure consisting of an active surface area is arranged. The chip is surrounded by an encapsulation having an opening which forms an access to the at least one active surface area. A layer stack is arranged on the substrate, said stack of layers comprising from the passivating layer to the substrate at least one first strip conductor layer, a first electric insulating layer, a second strip conductor layer and a second electric insulating layer. The first conductor strip layer is fully arranged outside the area of the chip covered by the opening. At least one conductor strip of the second conductor strip layer is connected to the sensor and/or actuator structure.

    摘要翻译： 一种电气部件，包括具有衬底的传感器和/或致动器芯片，其上布置有由活性表面积组成的钝化层和传感器和/或致动器结构。 芯片由具有开口的封装围绕，该开口形成对至少一个有源表面区域的访问。 层叠在衬底上，层叠层包括至少一个第一带状导体层，第一电绝缘层，第二带状导体层和第二电绝缘层，从钝化层到衬底。 第一导体带层完全布置在由开口覆盖的芯片的区域的外部。 第二导体带层的至少一个导体条连接到传感器和/或致动器结构。

    Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement
    10.
    发明授权
    Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement 失效
    用于制造传感器或致动器装置的方法以及相应的传感器或致动器装置

    公开(公告)号：US07592195B2

    公开(公告)日：2009-09-22

    申请号：US10504738

    申请日：2003-02-07

    申请人： Markus Rogalla ,  Ingo Freund ,  Mirko Lehmann

    发明人： Markus Rogalla ,  Ingo Freund ,  Mirko Lehmann

    IPC分类号： H01L21/00

    CPC分类号： B81B7/0061

    摘要： In a method for producing a sensor arrangement and the resulting sensor arrangement, a sensor is provided on or in a chip and the chip is covered with a protective cover, the cover being an interface between the sensor and the environment. An adhesive layer is provided between the chip and the protective cover, the adhesive layer alone or together with the protective cover being an interface between the sensor and the environment. The protective cover and/or the adhesive layer may have a channel formed therein, the channel functioning as the reception channel for a sensor. In an alternative embodiment, the protective cover placed on a wafer with several chips, and the wafer is cut up to produce the individual chips with the protective cover. Thus, a sensor arrangement may have the protective cover applied to the individual chip after the chip is cut from the wafer, or the protective cover may be applied to the wafer, and the wafer and cover are then cut up into the individual chips and corresponding covers. The channel leading from one side of the arrangement to the sensor may be taken through the adhesive layer, through the protective cover, or through both. A hole may be formed in the protective cover above the sensor, with the sensor lying loosely in the hole. The reaction volume may be determined by the dimensions of the hole.

    摘要翻译： 在用于制造传感器装置和所得到的传感器装置的方法中，传感器设置在芯片上或芯片中，并且芯片被保护盖覆盖，盖是传感器和环境之间的接口。 粘合剂层设置在芯片和保护盖之间，粘合剂层单独或与保护罩一起作为传感器和环境之间的界面。 保护盖和/或粘合剂层可以具有形成在其中的通道，该通道用作传感器的接收通道。 在替代实施例中，将保护盖放置在具有几个芯片的晶片上，并且切割晶片以用保护盖产生单独的芯片。 因此，在从晶片切割芯片之后，传感器装置可以具有施加到单个芯片的保护盖，或者可以将保护盖施加到晶片，然后将晶片和盖切割成各个芯片，并且对应于 盖子。 从布置的一侧引导到传感器的通道可以穿过粘合剂层，通过保护盖，或者通过两者。 可以在传感器上方的保护罩中形成孔，传感器松动地位于孔中。 反应体积可以由孔的尺寸确定。