DIFFERENTIAL PMOS ISFET-BASED PH SENSOR
    1.
    发明公开

    公开(公告)号:US20240310321A1

    公开(公告)日:2024-09-19

    申请号:US18575877

    申请日:2022-07-01

    CPC classification number: G01N27/4148 G01N27/4167

    Abstract: A pHI sensor system, Integrated Circuit (IC) chip, and a method are provided. Embodiments of the pH sensor may a first p-channel ion-sensitive transistor (IST)-operational-transconductance-amplifier (PIOTA) and a second PIOTA. Each PIOTA may further include a p-channel IST, an n-channel load transistor having a source and drain, wherein each PIOTA may have a drain-to-source resistance different from each other. Each PIOTA may further include an operational-transconductance-amplifier (OTA). A differential sensor may be connected to the outputs of both PIOTAs, and an output from the differential sensor may indicate a change in pH. Each PIOTA may further have an n-type substrate, a potential of which may be varied to control sensitivity of pH change detection. The NMOS load transistors of one or both of the PIOTAs may be selected from a plurality of NMOS load transistors to enhance sensitivity.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20230393092A1

    公开(公告)日:2023-12-07

    申请号:US17830359

    申请日:2022-06-02

    CPC classification number: G01N27/4148

    Abstract: A semiconductor device includes a substrate, an interconnect, and a sensor. The substrate includes devices therein and has a front side and a rear side opposite to the front side. The interconnect is disposed on the front side and electrically coupled to the devices. The sensor is disposed over the substrate and in the interconnect, and includes a sensing element and a reference element. The sensing element is disposed in a topmost layer of the interconnect and exposed therefrom, where the sensing element is electrically coupled to a first device of the devices through the interconnect. The reference element is disposed in the topmost layer of the interconnect and exposed therefrom, where the reference element is laterally spaced from the sensing element and is electrically coupled to a second device of the devices through the interconnect.

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