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17 条记录 (耗时 0.025 秒)

    Wafer table and exposure apparatus with the same
    1.
    发明授权
    Wafer table and exposure apparatus with the same 失效
    晶圆台和曝光装置相同

    公开(公告)号：US5231291A

    公开(公告)日：1993-07-27

    申请号：US821888

    申请日：1992-01-17

    申请人： Mitsuaki Amemiya ,  Eiji Sakamoto ,  Koji Uda ,  Kunitaka Ozawa ,  Kazunori Iwamoto ,  Shunichi Uzawa ,  Mitsuji Marumo

    发明人： Mitsuaki Amemiya ,  Eiji Sakamoto ,  Koji Uda ,  Kunitaka Ozawa ,  Kazunori Iwamoto ,  Shunichi Uzawa ,  Mitsuji Marumo

    IPC分类号： G03F7/20 ,  H01L21/00 ,  H01L21/687

    CPC分类号： H01L21/67109 ,  G03F7/2041 ,  G03F7/707 ,  G03F7/70866 ,  G03F7/70875

    摘要： A wafer table includes a wafer holding surface for holding a wafer by attraction; a flow passageway through which a temperature adjusting medium flows to remove any heat in the wafer table; a temperature measuring system for measuring the temperature of the wafer held by the wafer holding surface; a temperature adjusting system disposed between the wafer holding surface and the flow passageway; a temperature setting system for setting a temperature related to the wafer held by the wafer holding surface; a flow rate controlling system for controlling the flow rate of the temperature adjusting medium to be circulated through the flow passageway; and a temperature controlling system for controlling the operation of the temperature adjusting system related to heat, on the basis of a value set by the temperature setting system and a value measured by the temperature measuring system.

    摘要翻译： 晶片台包括用于通过吸引保持晶片的晶片保持表面; 流动通道，温度调节介质通过该通道流动以去除晶片台中的任何热量; 用于测量由晶片保持表面保持的晶片的温度的温度测量系统; 设置在晶片保持表面和流动通道之间的温度调节系统; 用于设定与晶片保持面保持的晶片有关的温度的温度设定系统; 流量控制系统，用于控制温度调节介质流过所述流动通道的流量; 以及温度控制系统，用于基于由温度设定系统设定的值和由温度测量系统测量的值来控制与热量相关的温度调节系统的操作。

    Liquid cooled X-ray lithographic exposure apparatus
    4.
    发明授权
    Liquid cooled X-ray lithographic exposure apparatus 失效
    液体冷却X射线光刻曝光装置

    公开(公告)号：US5063582A

    公开(公告)日：1991-11-05

    申请号：US658434

    申请日：1991-02-20

    申请人： Tetsuzo Mori ,  Eiji Sakamoto ,  Shinichi Hara ,  Koji Uda ,  Isamu Shimoda ,  Shunichi Uzawa ,  Kunitaka Ozawa

    发明人： Tetsuzo Mori ,  Eiji Sakamoto ,  Shinichi Hara ,  Koji Uda ,  Isamu Shimoda ,  Shunichi Uzawa ,  Kunitaka Ozawa

    IPC分类号： G03F7/20

    CPC分类号： G03F7/709 ,  G03F7/707 ,  G03F7/70716 ,  G03F7/70866 ,  G03F7/70875

    摘要： The present invention relates to a temperature control system for a lithographic exposure apparatus wherein a mask and wafer are closely disposed, and predetermined exposure energy is applied to respective shot areas of the wafer through the mask. The exposure energy is a soft-X-ray source, for example. The pattern of the mask is transferred onto the respective shot areas in a step-and-repeat manner. In the apparatus, a temperature control medium liquid is supplied into the wafer chuck which supports the wafer at the exposure position. The flow rate of the temperature control liquid is different during an exposure operation than during a non-exposure-operation. The flow control is determined in consideration of the wafer chuck vibration attributable to the supply of the liquid medium and also, of the heat generation in the wafer by the exposure energy, so that the vibration of the wafer chuck during the exposure operation is suppressed. Simultaneously the temperature rise of the wafer can also be suppressed. The pattern transfer from the mask to the wafer thus be precisely performed.

    Exposure method
    5.
    发明授权
    Exposure method 失效
    曝光方法

    公开(公告)号：US5610965A

    公开(公告)日：1997-03-11

    申请号：US197569

    申请日：1994-02-17

    申请人： Makiko Mori ,  Kunitaka Ozawa ,  Koji Uda ,  Isamu Shimoda ,  Shunichi Uzawa ,  Eiji Sakamoto

    发明人： Makiko Mori ,  Kunitaka Ozawa ,  Koji Uda ,  Isamu Shimoda ,  Shunichi Uzawa ,  Eiji Sakamoto

    IPC分类号： G03F1/76 ,  G03F7/20 ,  H01L21/027 ,  G21K5/00

    CPC分类号： G03F7/70866 ,  G03F7/70875

    摘要： A method of exposing a wafer to exposure energy such as ultraviolet rays or X-rays through a mask to transfer a pattern of the mask onto the wafer, for example. The temperature of the mask and/or the wafer increases during the exposure operation by absorption of the exposure energy. While the wafer is being exposed, the temperature of the mask and/or the wafer is detected. If the temperature is going to exceed an exposable temperature range determined on the basis of the line width of the pattern to be transferred, the exposure operation is interrupted. Then, the heat accumulated in the mask and/or the wafer is removed. Thereafter, the exposure operation is resumed. This is repeated until the predetermined or required amount of exposure is reached, for one shot. By this, thermal expansion of the mask and the wafer during the exposure operation is prevented to assure the precision of the pattern transfer.

    摘要翻译： 例如，通过掩模将晶片暴露于诸如紫外线或X射线的曝光能量以将掩模的图案转印到晶片上的方法。 掩模和/或晶片的温度在曝光操作期间通过吸收曝光能量而增加。 当晶片被暴露时，检测掩模和/或晶片的温度。 如果温度超过基于要传送的图案的线宽确定的可曝光温度范围，则曝光操作被中断。 然后，除去积存在掩模和/或晶片中的热量。 此后，恢复曝光操作。 一直重复直到达到预定或所需的曝光量。 由此，防止曝光操作期间的掩模和晶片的热膨胀，从而确保图案转印的精度。

    Alignment system
    7.
    发明授权
    Alignment system 失效
    对齐系统

    公开(公告)号：US5112133A

    公开(公告)日：1992-05-12

    申请号：US769495

    申请日：1991-10-01

    申请人： Hiroshi Kurosawa ,  Koji Uda ,  Kunitaka Ozawa ,  Shunichi Uzawa ,  Ryuichi Ebinuma ,  Takao Kariya

    发明人： Hiroshi Kurosawa ,  Koji Uda ,  Kunitaka Ozawa ,  Shunichi Uzawa ,  Ryuichi Ebinuma ,  Takao Kariya

    IPC分类号： G03F9/00 ,  H01L21/027 ,  H01L21/30 ,  H01L21/68

    CPC分类号： G03F9/70 ,  H01L21/681 ,  H01L21/682 ,  Y10T307/786

    摘要： An alignment system usable in an exposure apparatus for printing a pattern of a mask on a wafer, for aligning the mask and the wafer, is disclosed. The system includes a plurality of position detecting devices; a plurality of driving stages corresponding to the position detecting devices, respectively, each driving stage being adapted to move a corresponding one of the position detecting devices two-dimensionally along a plane which is substantially opposed to the mask; a plurality of contacts corresponding to the position detecting devices, respectively, each contact being provided at an end portion of a corresponding one of the position detecting devices, along the plane and facing the pattern side; a detecting device for detecting mutual approach of the position detecting devices through at least one of the contacts; and a control device for controlling movement of at least one of the driving stages in accordance with the detection by the detecting device.

    Temperature controlling device for mask and wafer holders
    10.
    发明授权
    Temperature controlling device for mask and wafer holders 失效
    面罩和晶圆座的温度控制装置

    公开(公告)号：US5577552A

    公开(公告)日：1996-11-26

    申请号：US412101

    申请日：1995-03-28

    申请人： Ryuichi Ebinuma ,  Takao Kariya ,  Nobutoshi Mizusawa ,  Koji Uda ,  Eiji Sakamoto ,  Shunichi Uzawa

    发明人： Ryuichi Ebinuma ,  Takao Kariya ,  Nobutoshi Mizusawa ,  Koji Uda ,  Eiji Sakamoto ,  Shunichi Uzawa

    IPC分类号： G03F7/20 ,  G05D23/19 ,  H05K7/20 ,  F28D15/00

    CPC分类号： H05K7/20281 ,  G03F7/707 ,  G03F7/70875 ,  G05D23/1919

    摘要： A temperature controlling device suitably usable in a semiconductor microcircuit manufacturing exposure apparatus exposes a semiconductor wafer to a mask to print a pattern of the mask on the wafer. The device includes a constant-temperature liquid medium supplying system for controlling temperature of a liquid at high precision, a distributing system for distributing the supplied liquid medium into plural flow passages, to supply the liquid medium to plural subjects of control such as, for example, a mask stage, a wafer stage and the like. The device further includes a plurality of temperature controls each being provided in corresponding one of the flow passages, for correction of any variance in temperature of the distributed liquid medium, resulting from pressure loss energies in the respective flow passages. Thus, temperatures of plural subjects of control can be controlled efficiently and with a simple structure.

    摘要翻译： 可适用于半导体微电路制造曝光装置的温度控制装置将半导体晶片暴露于掩模，以将掩模的图案印刷在晶片上。 该装置包括用于高精度地控制液体的温度的恒温液体介质供给系统，用于将供应的液体介质分配到多个流动通道中的分配系统，以将液体介质供应到多个控制对象，例如 ，掩模台，晶片台等。 该装置还包括多个温度控制装置，每个温度控制装置设置在对应的一个流动通道中，用于校正由相应流动通道中的压力损失能量产生的分配液体介质的温度变化。 因此，能够以简单的结构有效地控制多个控制对象的温度。