公开(公告)号：US06800803B1

公开(公告)日：2004-10-05

申请号：US09551910

申请日：2000-04-19

申请人： Mitsuji Marumo

发明人： Mitsuji Marumo

IPC分类号： H05K900

CPC分类号： H05K9/00 ,  H01L21/67772 ,  Y10S414/139

摘要： A semiconductor manufacturing apparatus includes a leakage preventing device for preventing outward leakage of electromagnetic waves through an opening defined when a pod having a substrate accommodated therein is mounted on the semiconductor manufacturing apparatus. The leakage preventing device includes at least one electromagnetic wave shielding plate and is provided at the semiconductor manufacturing apparatus side. The apparatus also includes a first electromagnetic wave shielding plate, which is openable and closable so that an opening defined when a carrier in the standard mechanical interface pod is moved downwardly is closed by the plate, and a second electromagnetic wave shielding plate, which has an openable and closable slit provided between an indexer for moving the carrier in the standard mechanical interface pod downwardly and a conveyance robot for conveying the substrate.

摘要翻译： 半导体制造装置包括防漏装置，用于防止电磁波向外泄漏通过其中容纳有衬底的容器的盒子被安装在半导体制造装置上时限定的开口。 防漏装置包括至少一个电磁波屏蔽板，并设置在半导体制造装置侧。 该装置还包括第一电磁波屏蔽板，该第一电磁波屏蔽板可打开和关闭，使得当标准机械接口盒中的载体向下移动时限定的开口被该板关闭;以及第二电磁波屏蔽板，其具有 设置在用于将标准机械接口容器中的托架向下移动的分度器和用于输送基板的输送机器人之间设置的可开闭切口。

公开(公告)号：US5640440A

公开(公告)日：1997-06-17

申请号：US504235

申请日：1995-07-19

申请人： Mitsutoshi Kuno ,  Kazunori Iwamoto ,  Mitsuji Marumo

发明人： Mitsutoshi Kuno ,  Kazunori Iwamoto ,  Mitsuji Marumo

IPC分类号： B25J9/10 ,  B25J13/08 ,  B25J15/06 ,  B65G49/07 ,  G03F7/20 ,  H01L21/00 ,  H01L21/027 ,  H01L21/677 ,  H01L21/68

CPC分类号： H01L21/67259 ,  G03F7/7075

摘要： A substrate conveying system includes an attracting device for attracting a substrate with reduced pressure, a moving device for relatively moving the substrate relative to the attracting device, and a detecting device for detecting the pressure of the attracting device during the relative movement of the substrate to thereby obtain positional information related to the substrate.

摘要翻译： 基板输送系统包括用于以减压的方式吸引基板的吸引装置，用于使基板相对于吸引装置相对移动的移动装置，以及检测装置，用于在基板相对移动期间检测吸引装置的压力 从而获得与基板相关的位置信息。

公开(公告)号：US5191218A

公开(公告)日：1993-03-02

申请号：US723336

申请日：1991-06-28

申请人： Tetsuzo Mori ,  Mitsuji Marumo ,  Kazunori Iwamoto ,  Yuji Chiba ,  Kazuyuki Kasumi

发明人： Tetsuzo Mori ,  Mitsuji Marumo ,  Kazunori Iwamoto ,  Yuji Chiba ,  Kazuyuki Kasumi

IPC分类号： G03F7/20 ,  H01L21/683

CPC分类号： G03F7/707 ,  G03F7/70875 ,  H01L21/6838 ,  Y10S294/907 ,  Y10T279/11

摘要： A vacuum-attraction holding device includes a holding base having an attracting surface, for holding a substrate thereon; a suction passageway formed in the base, for supplying a vacuum to the holding base to attract the substrate to the attracting surface; and a pressure sensor provided in the base and being communicated with the suction passageway.

公开(公告)号：US5999589A

公开(公告)日：1999-12-07

申请号：US140679

申请日：1998-08-26

申请人： Yuji Chiba ,  Nobutoshi Mizusawa ,  Kazunori Iwamoto ,  Yutaka Tanaka ,  Shinichi Hara ,  Mitsuji Marumo ,  Shin Matsui ,  Hiroshi Kurosawa

发明人： Yuji Chiba ,  Nobutoshi Mizusawa ,  Kazunori Iwamoto ,  Yutaka Tanaka ,  Shinichi Hara ,  Mitsuji Marumo ,  Shin Matsui ,  Hiroshi Kurosawa

IPC分类号： B23Q3/08 ,  G03F7/20 ,  G03F9/00 ,  H01L21/027 ,  H01L21/30 ,  H01L21/683 ,  H01J37/20

CPC分类号： G03F7/707 ,  H01L21/6838 ,  H01J2237/20 ,  H01J2237/3175 ,  Y10T279/11

摘要： A substrate holding device includes a vacuum supplying device for supplying a vacuum to a holding surface to hold a substrate, a hollow member surrounding at least a portion of the holding surface and movable between a position in which the holding member protrudes from the holding surface and a position in which the hollow member does not protrude from the holding surface, and a moving mechanism for relatively moving between the hollow member and the holding surface.

摘要翻译： 基板保持装置包括用于向保持表面提供真空以保持基板的真空供应装置，围绕保持表面的至少一部分的中空构件，并且可在保持构件从保持表面突出的位置和 中空构件不从保持表面突出的位置，以及用于在中空构件和保持表面之间相对移动的移动机构。

公开(公告)号：US5436693A

公开(公告)日：1995-07-25

申请号：US119395

申请日：1993-09-13

申请人： Mitsuji Marumo

发明人： Mitsuji Marumo

IPC分类号： B65G49/07 ,  B25B11/00 ,  B25J15/06 ,  H01L21/677 ,  H01L21/683 ,  H05K13/04

CPC分类号： H01L21/6838 ,  B25B11/005

摘要： A substrate holding apparatus includes a pump, serving as a suction source, a conveying chuck for holding a wafer substrate by suction, a connection arrangement, including parallel lines intermediate the connection arrangement, for conneting the pump to the chuck, and a valve arrangement including at least one valve provided in at least one of the parallel lines. By selecting one of the parallel lines by controlling opening/closing of these valves, the conductance of the connection line is adjusted, whereby the optimum suction pressure for the chuck is set.

摘要翻译： 基板保持装置包括作为吸引源的泵，用于通过抽吸保持晶片基板的输送卡盘，包括连接装置中间的平行线的连接装置，用于将泵连接到卡盘;以及阀装置，包括 至少一个阀，设置在至少一条平行线上。 通过控制这些阀的打开/关闭来选择平行线之一，调节连接线的电导，由此设定卡盘的最佳吸入压力。

公开(公告)号：US5374829A

公开(公告)日：1994-12-20

申请号：US231785

申请日：1994-04-25

申请人： Eiji Sakamoto ,  Ryuichi Ebinuma ,  Shinichi Hara ,  Mitsuji Marumo

发明人： Eiji Sakamoto ,  Ryuichi Ebinuma ,  Shinichi Hara ,  Mitsuji Marumo

IPC分类号： C30B25/12 ,  C30B31/14 ,  H01L21/683 ,  H01J37/20

CPC分类号： C30B31/14 ,  C30B25/12 ,  H01L21/6838 ,  Y10T279/11

摘要： A wafer holding device of the vacuum attraction type includes a structural member having a protrusion for supporting a wafer and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of the structural member. The elastic members are distributed on a wafer attraction plane of the structural member.

摘要翻译： 真空吸引型的晶片保持装置包括具有用于支撑晶片的突起的结构构件和由具有比晶片的弹性模量小的结构构件的弹性模量的材料制成的弹性构件。 弹性构件分布在结构构件的晶片吸引面上。

公开(公告)号：US20100026980A1

公开(公告)日：2010-02-04

申请号：US12512939

申请日：2009-07-30

申请人： Shinichi Hirano ,  Mitsuji Marumo

发明人： Shinichi Hirano ,  Mitsuji Marumo

IPC分类号： G03B27/58 ,  H01L21/677 ,  G05D3/00

CPC分类号： H01L21/677 ,  G03B27/58 ,  H01L21/67742 ,  H01L21/67745

摘要： A processing apparatus of the present invention processes for a wafer 9. The processing apparatus includes an XY stage 6 which includes a wafer chuck 8 which holds the wafer 9 and an elevating device which rises relative to the wafer chuck 8 to hold the wafer 9, and a wafer conveying robot hand 14 which conveys the wafer 9 from the XY stage 6 at a wafer transfer position 18. The XY stage 6 moves to change a direction at an angle between 30 degree and 120 degree via the wafer transfer position 18 in a state where the elevating device rises relative to the wafer chuck 8. The wafer conveying robot hand 14 has a shape which does not interfere with the XY stage 6 which moves to change the direction at the angle when the wafer conveying hand 14 is positioned at the wafer transfer position 18.

摘要翻译： 本发明的处理装置处理晶片9.处理装置包括XY台6，XY台6包括保持晶片9的晶片卡盘8和相对于晶片卡盘8上升以保持晶片9的升降装置， 以及晶片传送机械手14，其在晶片传送位置18处从XY平台6传送晶片9. XY台6移动以通过晶片传送位置18以30度至120度的角度改变方向 升降装置相对于晶片卡盘8上升的状态。晶片输送机械手14具有不干涉XY台6的形状，XY台6移动以当晶片输送手14位于该位置时以角度改变方向 晶片转印位置18。

公开(公告)号：US5203547A

公开(公告)日：1993-04-20

申请号：US798812

申请日：1991-11-27

申请人： Mitsuji Marumo

发明人： Mitsuji Marumo

IPC分类号： H01L21/683

CPC分类号： H01L21/6838

摘要： A vacuum attraction type substrate holding system includes a vacuum source; a distributor for distributing a vacuum from the vacuum source into plural vacuum lines; a plurality of vacuum attraction type substrate holding portions corresponding to the vacuum lines, respectively, each of the substrate holding portions having a valve which is openable and closable for control of the supply of vacuum to the corresponding substrate holding portions, wherein the opening or closing of each valve is influential to control attraction or release of a substrate to or from a corresponding substrate holding portion; and a plurality of restriction valves each being disposed between the distributor and corresponding one of the valves, for serving as a resistance to a gas flowing from the corresponding valve.

公开(公告)号：US08441614B2

公开(公告)日：2013-05-14

申请号：US12512939

申请日：2009-07-30

申请人： Shinichi Hirano ,  Mitsuji Marumo

发明人： Shinichi Hirano ,  Mitsuji Marumo

IPC分类号： G03B27/58

CPC分类号： H01L21/677 ,  G03B27/58 ,  H01L21/67742 ,  H01L21/67745

摘要： A processing apparatus of the present invention processes for a wafer 9. The processing apparatus includes an XY stage 6 which includes a wafer chuck 8 which holds the wafer 9 and an elevating device which rises relative to the wafer chuck 8 to hold the wafer 9, and a wafer conveying robot hand 14 which conveys the wafer 9 from the XY stage 6 at a wafer transfer position 18. The XY stage 6 moves to change a direction at an angle between 30 degree and 120 degree via the wafer transfer position 18 in a state where the elevating device rises relative to the wafer chuck 8. The wafer conveying robot hand 14 has a shape which does not interfere with the XY stage 6 which moves to change the direction at the angle when the wafer conveying hand 14 is positioned at the wafer transfer position 18.

摘要翻译： 本发明的处理装置处理晶片9.处理装置包括XY台6，XY台6包括保持晶片9的晶片卡盘8和相对于晶片卡盘8上升以保持晶片9的升降装置， 以及晶片传送机械手14，其在晶片传送位置18处从XY平台6传送晶片9. XY台6移动以通过晶片传送位置18以30度至120度的角度改变方向 升降装置相对于晶片卡盘8上升的状态。晶片输送机械手14具有不干涉XY台6的形状，XY台6移动以当晶片输送手14位于该位置时以角度改变方向 晶片转印位置18。

公开(公告)号：US20070175838A1

公开(公告)日：2007-08-02

申请号：US11674283

申请日：2007-02-13

申请人： Mitsuji MARUMO

发明人： Mitsuji MARUMO

IPC分类号： B65D85/00

CPC分类号： H01L21/67772

摘要： A pod attachable to an outside surface of a grounded electromagnetic-shielded chamber. The chamber has a door and a flange portion, around the door, on the outside surface and contains a micro-device manufacturing apparatus. The pod includes walls configured to contain a substrate and having an opening, the walls including a flange portion configured to contact the flange portion of the chamber, and a lid configured to openably close the opening, the substrate being transferred between the pod and the chamber through the opening. Also included is an electromagnetic shield member. The electromagnetic shield member is arranged over the walls and on the flange portion of the walls. The electromagnetic shield member on the flange portion of the walls is configured to contact the grounded flange portion of the chamber while the pod is attached to the outside surface.

摘要翻译： 一个可以连接到接地电磁屏蔽室的外表面的吊舱。 该室在外表面上具有门和围绕门的凸缘部分并且包含微型装置制造装置。 所述荚包括构造成容纳基底并具有开口的壁，所述壁包括构造成接触所述腔室的凸缘部分的凸缘部分和被构造成可打开地关闭所述开口的盖子，所述基底在所述荚壳和所述腔室之间转移 通过开放。 还包括电磁屏蔽构件。 电磁屏蔽构件布置在壁的壁上和壁的凸缘部分上。 壁的凸缘部分上的电磁屏蔽构件被构造成在容器附接到外表面的同时接触室的接地法兰部分。