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公开(公告)号:US5182615A
公开(公告)日:1993-01-26
申请号:US563420
申请日:1990-08-07
申请人: Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Nobutoshi Mizusawa , Shigeyuki Suda , Noriyuki Nose , Takao Kariya
发明人: Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Nobutoshi Mizusawa , Shigeyuki Suda , Noriyuki Nose , Takao Kariya
CPC分类号: G03F7/70691 , G03F9/7049
摘要: An exposure apparatus for printing a pattern of a mask to a wafer includes a mask moving mechanism for moving the mask; a wafer moving mechanism or moving the wafer along a predetermined movement coordinate; a measuring system for measuring an error with respect to the movement coordinate, resulting from the movement of the mask by the mask moving mechanism; and a memorizing device for memorizing a data table prepared on the basis of the error measured by the measuring system; wherein the wafer moving mechanism uses the data in the data table when it moves the wafer for positioning of the wafer with respect to the mask.
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公开(公告)号:US5157700A
公开(公告)日:1992-10-20
申请号:US401615
申请日:1989-08-31
申请人: Hiroshi Kurosawa , Mitsuaki Amemiya , Shigeru Terashima , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa , Makiko Mori , Ryuichi Ebinuma , Shinichi Hara , Nobutoshi Mizusawa , Eigo Kawakami
发明人: Hiroshi Kurosawa , Mitsuaki Amemiya , Shigeru Terashima , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa , Makiko Mori , Ryuichi Ebinuma , Shinichi Hara , Nobutoshi Mizusawa , Eigo Kawakami
IPC分类号: G03F7/20
CPC分类号: G03F7/70691 , G03F7/70058 , G03F7/70091 , G03F7/702
摘要: An exposure apparatus usable with synchrotron radiation source wherein the synchrotron radiation is generated by electron injection into a ring. The exposure apparatus is to transfer a semiconductor element pattern of a mask onto a semiconductor wafer by the synchrotron radiation. The apparatus includes a shutter for controlling the exposure of the wafer. The shutter controls the exposure with the illuminance distribution on the wafer surface taken into account. The illuminance distribution is determined in response to the electron injection, and thereafter, the illuminance distribution is corrected in a predetermined manner. By this, the illuminance distribution data for controlling the shutter always correspond to the actual illuminance distribution. The entire shot areas of the semiconductor wafer are exposed with high precision.
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公开(公告)号:US5172402A
公开(公告)日:1992-12-15
申请号:US666649
申请日:1991-03-08
申请人: Nobutoshi Mizusawa , Ryuichi Ebinuma , Hiroshi Kurosawa , Koji Uda , Takao Kariya , Shunichi Uzawa
发明人: Nobutoshi Mizusawa , Ryuichi Ebinuma , Hiroshi Kurosawa , Koji Uda , Takao Kariya , Shunichi Uzawa
IPC分类号: G03F7/20
CPC分类号: G03F7/70008 , G03F7/702
摘要: An exposure method for manufacture of semiconductor devices, includes moving a shutter having an edge so that the edge is related to a predetermined exposure region; projecting an exposure beam to the edge of the shutter and to at least a portion of the exposure region; determining a position of a shadow of the edge of the shutter formed by the exposure beam with respect to a predetermined coordinate system related to movement of a movable chuck; adjusting the shutter in accordance with the determination; placing a substrate on the chuck; moving the chuck so that the substrate is related to the exposure region; and controlling the exposure of the substrate with the exposure beam through the shutter.
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公开(公告)号:US5498501A
公开(公告)日:1996-03-12
申请号:US416503
申请日:1995-04-04
CPC分类号: G03F7/70066 , G03F7/2022 , G03F7/7045 , Y10S438/949
摘要: A method of manufacturing of semiconductor devices, includes exposing different portions of a semiconductor substrate with a first exposure apparatus having a first exposure range; placing and aligning the semiconductor substrate with respect to a second exposure range of a second exposure apparatus, which range is larger than the first exposure range of the first exposure apparatus; detecting an alignment error of each of the portions of the semiconductor substrate as covered by the second exposure range of the second exposure apparatus; calculating an overall alignment error of those portions of the semiconductor substrate with respect to the entire second exposure range of the second exposure apparatus, on the basis of the detected alignment errors; and controlling the exposure operation of the second exposure apparatus on the basis of the calculated overall alignment error.
摘要翻译: 一种半导体器件的制造方法,包括用具有第一曝光范围的第一曝光装置曝光半导体衬底的不同部分; 将半导体衬底相对于第二曝光装置的第二曝光范围放置和对准,该范围大于第一曝光装置的第一曝光范围; 检测由第二曝光装置的第二曝光范围所覆盖的半导体衬底的每个部分的对准误差; 基于检测到的对准误差,计算半导体衬底的这些部分相对于第二曝光装置的整个第二曝光范围的总体对准误差; 并根据计算的整体对准误差来控制第二曝光装置的曝光操作。
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5.
公开(公告)号:US5524131A
公开(公告)日:1996-06-04
申请号:US441641
申请日:1995-05-15
申请人: Shunichi Uzawa , Takao Kariya , Makoto Higomura , Nobutoshi Mizusawa , Ryuichi Ebinuma , Kohji Uda , Kunitaka Ozawa , Mitsuaki Amemiya , Eiji Sakamoto , Naoto Abe , Kenji Saitoh
发明人: Shunichi Uzawa , Takao Kariya , Makoto Higomura , Nobutoshi Mizusawa , Ryuichi Ebinuma , Kohji Uda , Kunitaka Ozawa , Mitsuaki Amemiya , Eiji Sakamoto , Naoto Abe , Kenji Saitoh
IPC分类号: G21K1/06 , G03F7/20 , G03F9/00 , G21K5/02 , G21K5/04 , G21K5/10 , H01L21/027 , H01L21/30 , H05H13/04 , G21K5/00
CPC分类号: G03F7/70008 , G03F7/702 , G03F7/70691 , G03F7/70741 , G03F7/70841 , G03F7/70866 , G03F7/70975 , G03F9/70 , G21K1/06
摘要: A semiconductor device manufacturing SOR X-ray exposure apparatus wherein, after a mask and a semiconductor wafer are aligned, and SOR X-ray is used to transfer a semiconductor device pattern on the mask onto a resist on the semiconductor wafer. The apparatus includes a mirror unit and an exposure unit for exposing the wafer through the mask to the X-ray from the mirror unit. The mirror unit includes an X-ray mirror for diverging the X-ray in a desired direction, a first chamber for providing a desired vacuum ambience around the X-ray mirror and a first supporting device for supplying the X-ray mirror. The exposure unit includes a shutter for controlling the exposure, a mask stage for holding the mask, a wafer stage for holding the wafer, a second chamber for providing a desired He ambience around the mask stage and the wafer stage, a frame structure for mounting the mask stage and the wafer stage and a second supporting device for supporting the frame structure. By this, a more highly integrated semiconductor device can be produced.
摘要翻译: 一种制造SOR X射线曝光装置的半导体器件,其中在掩模和半导体晶片对准之后,使用SOR X射线将掩模上的半导体器件图案转印到半导体晶片上的抗蚀剂上。 该装置包括反射镜单元和曝光单元,用于将晶片通过掩模曝光到来自反射镜单元的X射线。 镜单元包括用于沿所需方向分散X射线的X射线镜,用于在X射线反射镜周围提供期望的真空环境的第一腔室和用于供给X射线镜的第一支撑装置。 曝光单元包括用于控制曝光的快门,用于保持掩模的掩模台,用于保持晶片的晶片台,用于在掩模台和晶片台周围提供期望的He环境的第二室,用于安装的框架结构 掩模台和晶片台以及用于支撑框架结构的第二支撑装置。 由此,可以制造更高度集成的半导体器件。
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6.
公开(公告)号:US5822389A
公开(公告)日:1998-10-13
申请号:US464038
申请日:1995-06-05
申请人: Shunichi Uzawa , Takao Kariya , Makoto Higomura , Nobutoshi Mizusawa , Ryuichi Ebinuma , Kohji Uda , Kunitaka Ozawa , Mitsuaki Amemiya , Eiji Sakamoto , Naoto Abe , Kenji Saitoh
发明人: Shunichi Uzawa , Takao Kariya , Makoto Higomura , Nobutoshi Mizusawa , Ryuichi Ebinuma , Kohji Uda , Kunitaka Ozawa , Mitsuaki Amemiya , Eiji Sakamoto , Naoto Abe , Kenji Saitoh
IPC分类号: G21K1/06 , G03F7/20 , G03F9/00 , G21K5/02 , G21K5/04 , G21K5/10 , H01L21/027 , H01L21/30 , H05H13/04 , G21K5/00
CPC分类号: G03F7/70008 , G03F7/702 , G03F7/70691 , G03F7/70741 , G03F7/70841 , G03F7/70866 , G03F7/70975 , G03F9/70 , G21K1/06
摘要: A synchrotron exposure includes a synchrotron radiation source for generating a synchrotron radiation beam, and exposure unit having a mask stage for holding a mask and a wafer stage for holding a waver, a beam port for directing the radiation beam to the exposure unit, a mirror unit having a mirror for reflecting the radiation beam, a pre-alignment system for aligning the wafer relative to the wafer stage, a fine-alignment system for aligning the wafer held by the wafer stage relative to the mask held by the mask stage, a mask storage apparatus for storing the mask, a wafer storage apparatus for storing the wafer, a mask conveying apparatus for conveying the mask between the mask storage apparatus and the mask stage and a wafer conveying apparatus for conveying a wafer between the wafer storage apparatus and the wafer stage.
摘要翻译: 同步加速器曝光包括用于产生同步加速器辐射束的同步加速器辐射源,以及具有用于保持掩模的掩模台和用于保持摇摆的晶片台的曝光单元,用于将辐射束引导到曝光单元的光束端口 具有用于反射辐射束的反射镜的单元,用于使晶片相对于晶片台对准的预对准系统,用于使由晶片台保持的晶片相对于由掩模台保持的掩模对准的精细对准系统, 用于存储掩模的掩模存储装置,用于存储晶片的晶片存储装置,用于在掩模存储装置和掩模台之间传送掩模的掩模传送装置和用于在晶片存储装置和掩模载台之间传送晶片的晶片传送装置 晶圆台。
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公开(公告)号:US5317615A
公开(公告)日:1994-05-31
申请号:US987554
申请日:1992-12-08
申请人: Ryuichi Ebinuma , Nobutoshi Mizusawa , Takao Kariya , Shigeyuki Suda , Shunichi Uzawa , Takayuki Hasegawa
发明人: Ryuichi Ebinuma , Nobutoshi Mizusawa , Takao Kariya , Shigeyuki Suda , Shunichi Uzawa , Takayuki Hasegawa
CPC分类号: G03F7/70066 , G03F7/70858 , G03F7/70891 , G03F9/70
摘要: An exposure apparatus and method for exposing a workpiece to a pattern of an original with radiation includes a masking device having movable blades for variably defining an aperture to selectively block and transmit the radiation to define on the workpiece a desired exposure zone corresponding to the aperture, the masking device having a window, and a detector for detecting the positional deviation between the original and the workpiece by using light passing through the window of the masking device.
摘要翻译: 一种用于将工件暴露于具有辐射的原稿图案的曝光装置和方法包括:具有可动刀片的掩模装置,用于可变地限定孔径以选择性地阻挡和透射辐射,以在工件上限定对应于孔的期望曝光区域, 具有窗口的掩蔽装置和用于通过使用穿过掩蔽装置的窗口的光检测原件和工件之间的位置偏差的检测器。
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公开(公告)号:US5150391A
公开(公告)日:1992-09-22
申请号:US830449
申请日:1992-02-05
IPC分类号: G03F7/20 , G03F9/00 , H01L21/027 , H01L21/30
CPC分类号: G03F7/70066 , G03F7/70858 , G03F7/70891 , G03F9/70
摘要: An exposure apparatus for transferring a pattern of an original onto a workpiece, includes a blocking member for defining a rectangular exposure region with respect to at least one of the original and the workpiece, wherein the exposure for the pattern transfer can be effected with the exposure region defined by the blocking member. Plural detection systems detect a positional deviation between the original and the workpiece, each of which is disposed so as to be associated with at least one of four sides of the rectangular exposure region. Plural first movable stages each is provided so as to be associated with at least one of the four sides, and each is adapted to carry thereon one of the detection systems disposed to be associated with a corresponding side. Each first movable stage comprises a single-axis stage movable in a direction parallel to a corresponding side. Plural second stages each carryies thereon corresponding one of the first movable stages, and each comprises a single-axis stage movable in a direction perpendicular to a corresponding side and in a direction parallel to the rectangular exposure region. Each second movable state is operable to displace the light blocking member to change the rectangular exposure region.
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公开(公告)号:US5641264A
公开(公告)日:1997-06-24
申请号:US996870
申请日:1992-12-21
申请人: Mitsutoshi Kuno , Hidehiko Fujioka , Nobutoshi Mizusawa , Yuji Chiba , Takao Kariya , Koji Uda , Shunichi Uzawa , Eigo Kawakami
发明人: Mitsutoshi Kuno , Hidehiko Fujioka , Nobutoshi Mizusawa , Yuji Chiba , Takao Kariya , Koji Uda , Shunichi Uzawa , Eigo Kawakami
IPC分类号: G03F7/20 , H01L21/687 , B65G65/00
CPC分类号: G03F7/70741 , H01L21/68707 , Y10S294/907
摘要: A method of controlling a conveying device having a gripping hand for gripping an article to be conveyed and a conveying mechanism for conveying the gripping hand, wherein a pressing force applied to the gripping hand through the article being conveyed is detected and the conveying operation of the conveying mechanism is stopped when the pressing force exceeds a predetermined force.
摘要翻译: 一种控制输送装置的方法,所述输送装置具有用于夹持要输送的物品的夹持手和用于输送夹持手的输送机构,其中检测到通过被输送物品施加到抓握手的按压力,并且输送操作 当按压力超过预定力时,输送机构停止。
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公开(公告)号:US5577552A
公开(公告)日:1996-11-26
申请号:US412101
申请日:1995-03-28
申请人: Ryuichi Ebinuma , Takao Kariya , Nobutoshi Mizusawa , Koji Uda , Eiji Sakamoto , Shunichi Uzawa
发明人: Ryuichi Ebinuma , Takao Kariya , Nobutoshi Mizusawa , Koji Uda , Eiji Sakamoto , Shunichi Uzawa
CPC分类号: H05K7/20281 , G03F7/707 , G03F7/70875 , G05D23/1919
摘要: A temperature controlling device suitably usable in a semiconductor microcircuit manufacturing exposure apparatus exposes a semiconductor wafer to a mask to print a pattern of the mask on the wafer. The device includes a constant-temperature liquid medium supplying system for controlling temperature of a liquid at high precision, a distributing system for distributing the supplied liquid medium into plural flow passages, to supply the liquid medium to plural subjects of control such as, for example, a mask stage, a wafer stage and the like. The device further includes a plurality of temperature controls each being provided in corresponding one of the flow passages, for correction of any variance in temperature of the distributed liquid medium, resulting from pressure loss energies in the respective flow passages. Thus, temperatures of plural subjects of control can be controlled efficiently and with a simple structure.
摘要翻译: 可适用于半导体微电路制造曝光装置的温度控制装置将半导体晶片暴露于掩模,以将掩模的图案印刷在晶片上。 该装置包括用于高精度地控制液体的温度的恒温液体介质供给系统,用于将供应的液体介质分配到多个流动通道中的分配系统,以将液体介质供应到多个控制对象,例如 ,掩模台,晶片台等。 该装置还包括多个温度控制装置,每个温度控制装置设置在对应的一个流动通道中,用于校正由相应流动通道中的压力损失能量产生的分配液体介质的温度变化。 因此,能够以简单的结构有效地控制多个控制对象的温度。
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